Creating True Value With Multitest At VOICE 2013

4th April 2013

ES Admin

0 0

Multitest will present at the VOICE conference, scheduled to take place April 23-25, 2013 at the DoubleTree by Hilton Hotel in San Jose, CA. Meet Multitest’s experts to learn more about the company’s solutions, from wafer level test to final test – for standard ICs and sensor packages. Multitest sensor test modules combine the advantages of well-established and production proven tri-temp test handling equipment with innovative concepts to meet the special requirements of the MEMS test market.

Multitest offers solutions for a variety of sensor test applications, for singulated devices as well as cost-efficient strip tests and the latest test strategy: test in carriers. Based on the modular concept, a combination of different stimulus boxes within one MEMS module is possible. This allows testing of up to 9 degrees of freedom in one test setup. Testing of complex MEMS devices with only one test insertion.

Multitest’s leading fab capabilities ensure cost-effective solutions for high layer count and fine-pitch boards. Thoroughly defined processes ensure dependable on-time delivery. Multitest key differentiators are:
-high aspect ratio process
-UltraFlat process
-unique gold plating processes: DuraPad, ENCAP and Direct Attach
-advanced fine-pitch drilling processes
-“flat & smooth” via fill

Multitest Quad Tech applies a next-generation barrel-less architecture for vertical probes. The unique design provides a large compliance window, high bandpass and unsurpassed contact integrity. The architecture is based on a dual-fork design that features a redundant, permanent bias. All surfaces are open and planar and therefore have ideal plating quality. The Quad Tech design is scalable to support fine-pitch applications.