MSC Vertriebs GmbH joins FeaturePak Initiative

26th April 2010

ES Admin

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MSC Vertriebs GmbH has become a member of the FeaturePak™ Initiative unveiled March 1, 2010 which supports a new flexible embedded I/O expansion standard. The FeaturePak™ specification defines tiny, application-specific I/O modules with a size of 65 x 43 mm that snap into low-cost, low-profile sockets on computer-on-module (COM) baseboards. With the I/O modules, customers are able to add additional functions to COM baseboards without adding height to the system. The compactness of the FeaturePak™ modules is specially important in combination with Qseven™ modules in 70 x 70 mm format.

Like the power-saving Qseven™ COMs, FeaturePak™ I/O modules interface to the baseboard via a single low-cost 230-pin MXM connector. The FeaturePak™ host interface consists of PCI Express™, USB, I2C and several interface signals, which map directly to the Qseven™ MXM connector interface. Furthermore FeaturePak™ modules offer up to 100 application I/Os per module. The host interface is compatible to Intel® and RISC based embedded systems.

Bernhard Andretzky, Product Marketing Manager, Embedded Computer Technology, MSC Vertriebs GmbH, said: „The FeaturePak™ I/O expansion modules will accelerate the design of application-optimized baseboards for our innovative Qseven™ and COM Express™ modules.“

The FeaturePak™ Initiative is supported by the originator Diamond Systems Corp., Connect Tech, Cogent Computer Systems, congatec, Hectronic, IXXAT Automation, Douglas Electronics, Arbor Technology and VIA Technologies.