Analysis

Kyzen to Display MICRONOX® MX2302 Wafer-Level Cleaning Solution at IMAPS 2011 – Long Beach

12th September 2011
ES Admin
0
Kyzen will display its MICRONOX® MX2302 Wafer-level Cleaning Solution in Booth #517 at the upcoming IMAPS 44th International Symposium on Microelectronics, scheduled to take place October 9-13, 2011 at the Long Beach Convention Center in Long Beach, CA.
MICRONOX® MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages.

MX2302 has proven effective in ultrasonic, centrifugal and semi-aqueous spray under immersion cleaning systems. Easy to use, MX2302 has excellent compatibility with all soldering materials, passivation layers (PI, Nitride, Silicon Dioxide, BCB, etc.) and metal layers.

MICRONOX® MX2302 is available in one, five, and 55 gallon containers.

Kyzen® and MICRONOX® are registered trademarks in the United States and other countries.


Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier