result of improved manufacturing technology, IR’s new performance PQFN 3 x 3 package enables up to 60 percent higher load current capability than standard PQFN 3 x 3 devices in the new compact footprint while overall package resistance is significantly reduced to deliver extremely low on-state resistance (RDS(on)). In addition to the low RDS(on), the new performance PQFN package offers enhanced thermal conductivity as well as improved reliability and is qualified to industrial standard and moisture sensitivity level 1 (MSL1).
The performance PQFN package technology is also applied to 5 x 6 mm footprint devices enabling designs requiring more current without the need for additional footprint compared to standard PQFN 5 x 6 devices.
The family includes devices optimized for use as control MOSFETs featuring low gate resistance (Rg) to reduce switching losses. For synchronous MOSFET use, devices are available as a FETKY (monolithic FET and Schottky diode) configuration to offer enhanced efficiency and EMI performance by reducing reverse recovery time.
“The new family of performance PQFN package devices offers a high density, highly reliable and flexible solution optimized for DC-DC applications. Moreover, by expanding IR’s PQFN offering, customers can now select from many package combinations to achieve the optimal result for their design,” said George Feng, marketing engineer for IR’s Power Management Devices Business Unit.
With a low profile of less than 1 mm, the devices are compatible with existing Surface Mount Techniques, feature industry-standard footprint and are RoHS compliant.