Analysis

iPower Event Announces A “Call-For-Papers”

17th January 2011
ES Admin
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The UK Microelectronics Packaging Society (IMAPS-UK) has announced a call for papers and abstracts for their forthcoming “iPower” event which is intended to ‘Showcase UK Power Electronics’. The event will be held on 30 November & 1 December 2011 at the University of Warwick’s prestigious IDL Conference Centre.
“iPower”, being held in conjunction with the University's Electronics, Power and Microsystems Research Group, will bring together leading experts in the field of power electronics from Science, Academia, Supply and Industry, providing a unique insight into the fields latest developments and technologies.



The two day event and accompanying exhibition will offer delegates the chance to discover technical information on a wide range of topics, including: Applications, Trends & Emerging Markets, Packaging, Test and Reliability, Assembly Materials & Technologies, Integrated Processes (micro-machining, micro-moulding), Thermal Management & Efficiency, Product Design Development & Modeling, Interconnection Integration & Systems, Solutions For Harsh Environments, High Reliability & Temperature, Novel Designs & Future Concepts.



Researchers and innovators in industry, supply and academia who would like to take part and consider that they can offer original and exciting technical presentations or poster displays on any of the topics listed above, should contact the Society with their abstract or proposal for consideration prior to the closing date of 30 March 2011.

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