rom the beginning, Inphi has used its engineering design discipline to innovate broadly and execute relentlessly to solve the most difficult communications and computing problems,” said Young Sohn, President and CEO, Inphi. “We are proud to have shipped 100 million products, providing our customers with the high-performance analog components they need for systems that deliver cloud services, and which require more speed and scale than ever before.”
“Inphi continues to execute consistently with its high-speed analog technology and product portfolio,” said Mario Morales, Vice President of IDC's Semiconductors Research Program. “The company’s focus and execution provide a solid foundation to leverage for growth in the emerging data center and cloud services build out.”
The emergence of cloud computing, which allows multiple users to simultaneously execute applications and access data at high speeds, is creating additional demand for network bandwidth and computing resources. According to the IDC, IT Cloud Services Spending Forecast: 2009-2014, June 2010, spending on public cloud-based server and storage services is expected to grow from $3.5 billion in 2009 to $15 billion in 2014, representing a compound annual growth rate of 27 percent.
Inphi’s products are designed to address bandwidth bottlenecks in networks, minimize latency in cloud computing environments and enable the rollout of next generation communications infrastructure. These core competencies enable Inphi to take a leadership role in the main markets it serves, including Networking and Communications, Computing and Storage and Multi-Markets for Test and Measurement, Military and Aerospace.
Since delivering its first product in 2000, Inphi has been continuously focused on delivering semiconductors that offer the highest signal integrity at leading-edge data speeds. Inphi’s success is a direct result of its core strengths in analog design expertise, which enabled the company to design and deliver:
* The industry’s first JEDEC-compliant Isolation Memory Buffer (iMB™) with the Inphi iMB 02-GS02 that helped to drive the creation of a new class of standards-based memory modules – LRDIMMS.
* The industry’s first 18 GHz track-and-hold amplifier, 40 GHz transimpedance amplifier (TIA) and 50 GHz MUX and DEMUX components.
* The industry’s first 100G coherent TIA with its 2850TA that enabled OIF-based 100G integrated coherent receivers.
* The industry’s first single chip 40G modulator driver in a surface-mount technology (SMT) package with the Inphi 2811DZ.