GPD Global’s PCD Dispensing on Its MAX Series Platform Wins Another Industry Award

29th February 2012
Source: GPD Global
Posted By : ES Admin
GPD Global announces that it has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform. The award was presented to Sven Wedekin, Vice President / General Manager, during a Tuesday, February 28, 2012 ceremony that took place at the San Diego Convention Center in California.
“We are very pleased with our fourth award for the PCD Dispense Technology and thank Circuits Assembly for recognizing us. During the last 18 months, GPD Global has introduced and successfully installed the PCD pumps across the U.S. for a wide range of applications. We are now pleased to announce that we will be releasing the PCD Pump Series on a worldwide basis. This news means that our global sales team may now offer the pump and controller on an individual basis as well as with the Max and Island platforms. By providing customers with a wide range of ROI solutions for continuously volumetric dispense technology they are able to replace less repeatable dispense methods such as syringe-based-time-pressure,” commented Wedekin about the recent win.

GPD’s PCD Dispensing provides next-generation volumetric dispensing and is compatible with materials used in electronics assembly such as epoxies, thermal greases, underfills, oils, silicones and UV encapsulants, as well as materials outside of the electronics industry. PCD Technology is designed for GPD Global platforms and may be used with other robots or tabletop operations with an easy-to-use tabletop controller.

Viscous fluids are delivered to the substrate via luer nozzles and performance excels when using GPD Global ‘S’ Taper tips. The metering technique is not affected by variations in temperature or reservoir pressure, thereby improving day-to-day and start-to-finish process results. GPD’s enhanced flow rate luer dispense tips offer higher flow rates than standard luer nozzles with a much lower pressure build-up.

When coupled with the MAX II Dispense platform and UltiPath optimization software for the BGA underfill process, the result is increased throughput by reducing idle time from optimizing the dispense paths associated with multiple dispense pass products. The MAX Series platforms are ideal for die attach, underfill, MEMS, micro-volume conductive adhesive and paste applications. Max Series equipped with Micro-volume technology enables dispensing for 0201 components as well as die attach adhesives. Further expanding the MAX Series capabilities with the continuously volumetric PCD dispense pump yields outstanding results with underfills, encapsulation and LED applications.

Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

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