GOEPEL electronic explores new Dimensions

18th April 2012
News Release from: GOEPEL electronic
Written by : ES Admin
Multidimensional test and inspection technologies are the focal aspect of GOEPEL electronics’ show appearance at this year’s SMT/Hybrid/Packaging in Nuremberg/Germany. The trade show will be used to introduce additional world premiere solutions.
At stand 410 in hall 6 the German Company will exhibit Automated Optical Inspection (AOI) systems with integrated 3D metrology. The AOI systems feature adaptive 3D technologies enabling maximum fault detection by means of precise height measurement as well multidirectional image capturing.
Additionally, GOEPEL electronic’s OptiCon THT-Line will be presented as an inline solution, approaching new dimensions in integrating advanced AOI systems in the THT production process.

A completely new solution for PCB solder paste inspection (SPI) will be the brand-new OptiCon SPI-Line 3D. Core element is a specifically developed 3D camera head functionally based on the fringe projection principle. In connection with a newly designed drive system for assemblies and measuring head a reliable monitoring of the solder paste printing at extraordinary speed is guaranteed.

In the field of Automated X-ray Inspection (AXI) GOEPEL electronic will demonstrate the worldwide unrivalled high inspection speed of its OptiCon X-Line 3D system, designed to be fully integrated into the production line environment. In addition to a newly developed automatic x-ray image chain stability control, the system software XI-Pilot version 3.0 will be introduced. It contains new features for automatic PCB deflection check and supports the ExtendedDynamicTechnology™ for even more detailed images.

The multi dimensionality of GOEPEL electronic’s JTAG/Boundary Scan solutions were recently emphasized by the introduction of “Embedded System Access” (ESA) technologies and consequently extension of application opportunities.

Alongside software solutions for, among others utilisations for multi-chip modules, 3D chips or multi-board applications, as market leader GOEPEL electronics’ will introduce its completely new, inline programming system named RAPIDO™. This extremely powerful on-board programmer is based on the well-established and severally awarded SCANFLEX® architecture and heralds GOEPEL electronics’ entry into a totally new market segment.

Automotive Testing Expo Europe 2012 in Stuttgart, 12.-14.06.2012
Boundary Scan Days 2012 in Jena, 24.-25.4.


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