he launch of the EcoFilm range will help our customers comply more easily with their environmental responsibilities,” said Ruaridh Nicolson, Teknek’s sales and marketing manager. “As circuits become ever smaller the need to use efficient contact cleaning equipment becomes a greater priority. Increasingly smaller stencil apertures mean that smaller particles can block the opening leading to production problems. Furthermore with BGA boards becoming more common, numerous solder problems can arise if the board is not 100% clean. Our equipment offers a very rapid return on investment usually within months depending on production volumes. Before and after evidence using AOI and SPI equipment demonstrates a dramatic reduction in defective boards if contact cleaning is applied at key stages of the production process.”
Visitors to Productronica will be able to see a Teknek SMT contact cleaning machine in action on sister company Speedline Technologies’ stand (Hall A3, Stand 121).