DSM Computer joins Intel's Embedded Building Blocks Initiative

As a member of the Embedded Building Blocks Initiative, DSM provides its robust embedded-PC housings for the COM Express standard, NanoCase E3-COM. The housings already provide an active cooling concept and so are also suitable for higher CPU power ratings. DSM Computer also offers the complete equipping with COM Express™ modules and standard baseboards for the complete industrial computer. The development and manufacturing of the IPCs, together with the logistics and the support in Germany, ensure a fast and flexible project realization.

Martin Engelhardt, Strategic Sales Development manager at Intel, said: We have found with DSM a powerful partner that has extensive know-how for the realization of industry-compatible computer systems and the optimized housing integration. With its distributor, MSC Vertriebs GmbH, the established IPC manufacturer is represented in all European countries.

Christian Lang, marketing manager at DSM Computer GmbH, added: Based on our long-term experience in the market for embedded systems and industrial PCs, we offer a broad portfolio of high-quality, robust housing solutions. Unlike consumer products, the long-term availability of the hardware and the satisfying of special requirements, such as an extended operating temperature range, are critical in the industrial environment. Our scalable computers, even in medium-sized quantities, are assembled and tested to the highest quality standards in Germany.