he introduction of a CMOS image sensing module to the Sony ISS product portfolio, which has previously been based on CCD sensors only, is a new move for us. Customers have been demanding such a product from Sony for integration in portable applications and we are proud to be delivering on that request. Working closely with our OEM and system integration customers we expect the versatile MCB-882P to take Sony ISS into new applications and market sectors we were unable to previously penetrate. These are exciting times,” said Pascal Wojciechowski, Director, Sony Image Sensing Solutions Europe.
The Sony MCB-882P has been designed to provide the flexibility to design very compact systems. The CMOS-based progressive scan unit delivers 30 fps and features an auto focus Lens, 16x digital zoom, electronic Image stabilization, auto exposure, auto white balance and I²C control interface, all in a small package size of only 18.8 x 15.6 x 8.63mm. The complete unit weighs just 3.5 grams.
The MCB-882P camera provides a high-quality image of with up to 16x digital zoom. The lens delivers a wide viewing angle of up to 53 degrees and a high performance ‘minimum object distance’ of 100mm. The unit has an operating temperature range of -10 to 45°C, and has a maximum power consumption of 230 mW.
The 3.15 MPixel (2048 H x 1536 W) progressive scan CMOS sensor enables digital YUV video or JPEG still image outputs. The use of progressive scan techniques to eliminate interlace effects will make the MCB-882P series a particularly attractive alternative for users who need to capture high-quality images of moving objects; and for those who need to view footage in slow motion or acquire still images from video. Progressive scan capture also simplifies the processing in intelligent surveillance applications such as motion detection.
The advantages of CMOS has continued to gather momentum as an alternative to CCDs in image sensors. The integration of the lens into the sensor, together with other circuitry, eliminates any need for assembly of optical components when building the device into applications that reduces manufacturing costs, and enables shorter development times.