CIL's investment in micro-packaging pays dividends

Although large scale SMT manufacture dominated growth for a number of years, recently CIL has invested in new automatic high speed die bonders and an automatic aluminium wirebonder capable of wiring at 25 micron. This provides the ability to attach and wirebond bare die to a variety of substrate materials ranging from ceramic, PCB laminates and flexi-rigid constructions.

John Boston, managing director of CIL, said: “We are seeing a significant increase in business in this area, particularly from overseas as there are only a few companies that still have the capability to work at chip and wire level. There are many occasions, for instance in the field of LED assemblies, where micro-packaging offers significant advantages over conventional assembly and using these techniques we can design and build bespoke products at relatively low cost.”

CIL offers a full chip-on-board service covering die bonding, wirebonding and globe topping encapsulation.