Analysis

Broadcom to sign MoU agreements

30th June 2015
Jordan Mulcare
0

A series of Memorandum of Understanding (MoU) agreements with several Chinese companies, including H3C, Inspur and StarTimes, has been announced by Broadcom. The signing of these agreements at Broadcom's annual Asia Media Summit reflect the company's ongoing commitment to expand strategic relationships in the region and drive further innovation in home entertainment and the digital home.

"It's an exciting time for the China electronics market as it transitions from a manufacturing base to a global leader in design and development," said Michael Hurlston, Executive Vice President of Worldwide Sales, Broadcom. "This fast-growing and evolving industry represents an important element in our ongoing strategy for continued growth in existing markets and diversification into new areas. We're thrilled to work with the region's leading organizations in driving innovation forward."

As part of the company's increased emphasis on collaboration in China, Broadcom will sign MoUs.

A joint agreement with Hangzhou-based networking company H3C Technologies. Broadcom and H3C will work together to explore new market requirements and technical trends to optimise the interaction and performance of current and future platforms and architectures.

A joint development agreement with Shandong-based systems integrator Inspur Group to drive continued innovation in 4K Ultra HD STB offerings for China will be signed. This agreement will utilise the technology strength and market expertise of Broadcom and Inspur's unique position and previous collaboration to develop a new DOCSIS 3.0 Ultra HD STB that can power an entire digital home system.

A joint collaboration agreement with Beijing-based pay TV operator StarTimes to jointly define and develop STB offerings in Africa will also be signed. Both sides will invest engineering resources to develop a series of low-cost STBs and high-end Ultra HD home gateways.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier