Analysis

TDK-Lambda announces collaborative research initiative with Thermastrate

22nd July 2010
ES Admin
0
Leading power supply manufacturer TDK-Lambda UK has entered into a collaborative research and development agreement with Thermastrate, a provider of advanced solutions in thermally efficient substrates for power electronic packaging applications. The aim of the project will be to commercialise the use of advanced thermal materials for power supply magnetics.
The collaborative R&D initiative is borne out of an extensive research project started in 2007 to evaluate methods for substantially improving the power density of AC-DC power supplies funded by TDK-Lambda UK and carried out by the Electrical Machines and Drives (EMD) Group at The University of Sheffield. During this successful industry and academic research cooperation, a strong relationship with Thermastrate developed.



“We are moving ahead to a new phase on this project with Thermastrate,” comments Andrew Skinner, Chief Technology Office of TDK-Lambda UK. “The aim will be to overcome the thermal challenges inherent with traditional materials used for power supply magnetics, and underlines our commitment to leading edge power supply development.”



Based at the hi-tech NETPark complex in Sedgefield, County Durham, United Kingdom, Thermastrate provides advanced solutions in thermally efficient substrates for a wide range of power electronic packaging applications. “We are excited to extend our expertise and technologies in thermal management to help solve the challenges identified by TDK-Lambda. The product development effort is in the advanced stages and the results so far are very encouraging,” says Felix Hirzel, CEO of Thermastrate Ltd. Thermastrate’s core products include Flexitherm® and Ultratherm®, which the company currently sell into the solar energy, solid-state lighting, high brightness LED (HBLED), high power electronics, and hybrid electric vehicle (HEV) markets.



Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier