Analysis
PD Circuits Joins the HKPCA
P. D. Circuits, Inc., specializing in delivering the highest quality PCBs, technical support, and service to OEM and EMS companies worldwide, announces that it has joined the Hong Kong Printed Circuit Association (HKPCA). Established in 2000, the association is dedicated to promoting and protecting the rights and interests of its member companies in the electronics industry.
Engineered Conductive Materials’ Chief Technical Officer to Discuss New ECA Technology at Intersolar North America 2011
Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, announces that Rich Wells will present “Cost Reduction with High Performance Conductive Adhesives for Cell Interconnects” during the Innovation Exchange at the upcoming Intersolar North America, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco.
Bentek Solar to Debut New Product Line at Intersolar North America 2011
Bentek Solar, a leader in Balance of System (BOS) design and manufacturing for commercial and utility scale solar PV products, will debut its new product line for the first time in West Hall L1, Stand 7564 at the upcoming Intersolar North America 2011, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco.
Scintera Reaches Major Milestone with its Adaptive RF Power Amplifier Linearizer SoC
Scintera Networks, Inc., has announced that it has reached a major milestone with more than 50,000 units of its SC1887 Adaptive RF Power Amplifier Linearizer (RFPAL) deployed in the field. Based on Scintera’s RF predistortion technology, the SC1887 entered production in February 2010 and has been adopted by a broad range of customers for applications in the wireless infrastructure market.
Ecovelocity Goes ‘back To The Future’
■Ashes to Ashes 1983 motor needs eight passengers to be as green as low carbon cars ■EcoVelocity motor show to showcase latest in environmental innovations
NXP Announces Finalists in its First-Ever High Performance RF Design Challenge
NXP Semiconductors N.V. has announced three teams of finalists in its first-ever High Performance RF (HPRF) Design Challenge. Selected from among 400 entrants, three regional winning teams from EMEA, Asia Pacific and the Americas have been invited to the IEEE MTT-S International Microwave Symposium for 2011 (IMS2011) next week in Baltimore, Maryland.
CEVA and Carbon Design Systems Partner to Offer Fast Simulation Models for CEVA DSPs
Carbon’s virtual models available for CEVA-X and CEVA-XC DSPs, enabling cycle-accurate, pre-silicon hardware and software development
Radiocrafts and Kamstrup announce interoperability for new low power metering standard
Radiocrafts AS and Kamstrup, have announced interoperability for the new C-mode in prEN 13757-4:2010.
ASSET joins PCI-SIG so add-in cards can validate their access to Intel's embedded instrumentation
ASSET InterTech has joined the PCI-SIG® and plans to participate in the group's upcoming interoperability workshops. As a result, manufacturers of PCI Express (PCIe) add-in cards (AIC) will be able to validate that their cards interoperate with ASSET's ScanWorks platform for embedded instruments. This ensures that the AIC manufacturer can access Intel®'s embedded instrumentation technology, Interconnect Built-In Self Test (IBIST), because ScanW...
austriamicrosystems WINS 2011 “Best of Sensors Expo” Gold Award
austriamicrosystems has announced that it has won the gold Sensors Magazine “Best of Sensors Expo” Award in the sensors category for the AS5410 3D Hall encoder. Sensors Executive Editor Melanie Martella presented the award on June 7, 2011 at the Sensors Expo & Conference, which was held at the Donald E. Stephens Convention Center in Rosemont, IL.