Analysis
Ecovelocity Goes ‘back To The Future’
■Ashes to Ashes 1983 motor needs eight passengers to be as green as low carbon cars ■EcoVelocity motor show to showcase latest in environmental innovations
NXP Announces Finalists in its First-Ever High Performance RF Design Challenge
NXP Semiconductors N.V. has announced three teams of finalists in its first-ever High Performance RF (HPRF) Design Challenge. Selected from among 400 entrants, three regional winning teams from EMEA, Asia Pacific and the Americas have been invited to the IEEE MTT-S International Microwave Symposium for 2011 (IMS2011) next week in Baltimore, Maryland.
CEVA and Carbon Design Systems Partner to Offer Fast Simulation Models for CEVA DSPs
Carbon’s virtual models available for CEVA-X and CEVA-XC DSPs, enabling cycle-accurate, pre-silicon hardware and software development
Radiocrafts and Kamstrup announce interoperability for new low power metering standard
Radiocrafts AS and Kamstrup, have announced interoperability for the new C-mode in prEN 13757-4:2010.
ASSET joins PCI-SIG so add-in cards can validate their access to Intel's embedded instrumentation
ASSET InterTech has joined the PCI-SIG® and plans to participate in the group's upcoming interoperability workshops. As a result, manufacturers of PCI Express (PCIe) add-in cards (AIC) will be able to validate that their cards interoperate with ASSET's ScanWorks platform for embedded instruments. This ensures that the AIC manufacturer can access Intel®'s embedded instrumentation technology, Interconnect Built-In Self Test (IBIST), because ScanW...
austriamicrosystems WINS 2011 “Best of Sensors Expo” Gold Award
austriamicrosystems has announced that it has won the gold Sensors Magazine “Best of Sensors Expo” Award in the sensors category for the AS5410 3D Hall encoder. Sensors Executive Editor Melanie Martella presented the award on June 7, 2011 at the Sensors Expo & Conference, which was held at the Donald E. Stephens Convention Center in Rosemont, IL.
AWR and LFoundry Introduce 0.15µm RF CMOS Process Design Kit for Analog Office RFIC Design Environment
AWR Corporation and LFoundry GmbH today announced the availability of a process design kit (PDK) for LF150. LFoundry’s LF150 is a modular 0.15µm RF CMOS process, offering up to six levels of Aluminum plus thick metal (2 - 6µm), optionally a MIM capacitor, a polyimide passivation and I/O voltages of 1.8V, 3.3V and 5.0V. This new PDK for LF150 targets those customers designing RFICs for telecom, automotive, industrial and energy s...
Rutronik: System solution from Micronas with CMOS-based gas sensor technology
The GAS85xyB is a new gas sensor chip generation from Micronas based on the mySENS technology. The novel GAS85xyB chip generation is based on a standard CMOS technology which has been proven successful in automotive and industrial applications. Samples are available now at distributor Rutronik.
Plextek’s design expertise helps PneumaCare to receive double award win at coveted 2011 Medical Futures Innovation Awards
Plextek, the leading Cambridge design house and technology innovator, today announced that PneumaCare has won two highly sought after healthcare and business accolades at the Medical Futures Innovation Awards – a Dragon’s Den-style assessment of new healthcare ideas from around the world. PneumaCare’s PneumaScan(tm) device, which monitors patients breathing without any contact with their body, received Best Business Proposition ...
Renesas Electronics Announces Resumption of Wafer Lines Production at Naka Factory, Moves Up the Schedule for Shipment of Products from October to September
Following the announcement made on May 11, 2011, Renesas today released an updated production schedule for its Naka wafer fabrication factory in Hitachinaka, Ibaraki. Having resumed mass production at both the 200- and 300-mm wafer fabrication lines, the key highlight of the new schedule is that Renesas expects it will be capable of significantly moving up the schedule by one month from the end of October to the end of September for when the supp...