Analysis
Vishay Intertechnology Introduces Streaming Video Highlighting Vishay Dale LCD Displays on Website
To assist customers in selecting the best Vishay Dale LCD products for their applications, Vishay Intertechnology, Inc. announced that it has added a new streaming video to its website www.vishay.com providing an overview of the complete portfolio using a series of demonstration cases that contain the company's latest LCD products.
WIN Semiconductor chooses VIPER RF as approved design partner
VIPER RF, have announced that they have entered into an agreement under which VIPER RF will offer design support and specialised RF expertise to help customers develop chips using WIN Semiconductors’ process technologies and design tools. VIPER RF is a UK microwave and RF consultancy and product-based company that serves a range of markets including defence and security, communications and wireless applications, covering frequencies in the rang...
Redpine Signals announces ultra-low power 802.11n Wireless LAN connectivity products for Freescale processor platforms
Redpine Signals, Inc., Inc has announced the availability of a set of ultra-low power, single stream, 802.11n modules ported on to multiple processor platforms from Freescale Semiconductor.
mobeam Closes Initial Venture Round
mobeam announced that it has closed a $4.9 million Series A venture round, receiving funding from yet2Ventures, Samsung Ventures and Mitsui, together with other independent investors. mobeam’s patented technology overcomes the technical barrier preventing mobile phones from interacting with the laser scanners used at retail locations around the world. Funds from this multimillion dollar funding round will be used to establish mobeam’s light b...
Spirent Test Solution Validates Network Elements and Architecture In Juniper Networks’ Cloud Virtualization Environment
Spirent Communications’ cloud computing testing solution has been selected to validate the performance of network designs created within the Junosphere Lab virtual environment, announced by Juniper Networks. Junosphere Lab, which enables the creation and modeling of networks and elements running the Juniper Networks Junos operating system, will include Spirent TestCenter Virtual to provide visibility into network infrastructures, as well as to...
Synopsys' DesignWare SuperSpeed USB 3.0 IP Achieves More Than 40 Design Wins
Synopsys announced that its DesignWare SuperSpeed USB 3.0 IP has surpassed 40 SoC design wins and more than 30 customer licensees worldwide. Because Synopsys' DesignWare USB 3.0 Digital Core and PHY IP has been broadly adopted by leading semiconductor companies targeting a variety of applications and process technologies, designers can be confident the IP is silicon-proven and can lower their SoC integration risk.
Huawei and the Subscriber Profile User Group (SPUG) Hosted the Second Annual SDM & Policy Control Seminar in China
Huawei and the Subscriber Profile User Group jointly hosted the second annual SDM & Policy Control seminar 2011 on September 14-15 in Xi’an, China. The theme of this year’s seminar was “Utilize SDM and Policy Control to Generate Revenue,” and over 120 delegates from more than 30 leading global telecom operators attended and shared their perspectives, strategies, and best practices.
Cypress Reports Break Down of Talks Regarding Alleged GSI Patent Infringements
Cypress Semiconductor said that negotiations with GSI Technology, Inc. regarding the alleged infringement of Cypress’s SRAM patents by GSI have ended without a resolution. In June, Cypress filed a complaint with the International Trade Commission alleging infringement by GSI of four of its SRAM patents. The complaint seeks an exclusion order from the ITC that would prevent the importation of all infringing GSI SRAMs. The ITC requires disputing ...
NXP strengthens Asian presence with appointment of Loh Kin Wah to management team
NXP Semiconductors N.V. announced the appointment of Mr. Loh Kin Wah as a member of NXP’s management team and as executive vice president, sales & marketing. Mr. Loh, who will be based in Singapore, brings over 30 years of experience in the semiconductor industry and an in-depth knowledge of the Asian market.
ESCATEC invests in new diebonder to triple throughput
ESCATEC has invested in a Hilbond DB 750 diebonder to increase the company’s diebonding capabilities. The new machine is very accurate and fast, enabling ESCATEC to triple its existing diebonding throughput. The high degree of accuracy also means that the following production steps (e.g. wirebonding) have been accelerated.