Analysis
Densitron Opens New Office in India
Densitron has now opened a new office in Bangalore, India. The city is a growing metropolis and is considered by many as the “Silicon Valley of India.” The fast expansion of the city makes it an ideal location for Densitron, a global display company.
Green Hills Software and Jungo Announce Collaboration Initiative for Automotive Infotainment
Green Hills Software and Jungo Ltd, have announced a strategic collaboration that focuses on the creation of a comprehensive connectivity, device media and internet management platform for next-generation automotive infotainment systems. The platform is based on Green Hills Software’s industry-leading secure operating system, INTEGRITY Multivisor technologies, and Jungo’s Automotive Connectivity Middleware. This solution will enable automotiv...
Dealership Creatively Cuts Lighting Use/Costs
Auto dealerships, like most high profile retail businesses today, are fighting an uncertain economy and pulling out all the stops to service existing customers and attract potential buyers. In many cases an extreme makeover is the only viable solution to create a truly attractive and efficient selling environment.
BAE Systems and Caterpillar sign HybriDrive agreement
BAE Systems and Caterpillar Inc. have signed a long-term supply agreement to collaborate on an energy efficient parallel hybrid propulsion system for heavy-duty trucks. Under the 20-year agreement, BAE Systems will integrate the Cat CX family of transmissions into its HybriDrive parallel propulsion system, and will establish an aftermarket field services model leveraging Caterpillar's vast global service network to support the growing installed b...
Solid State Supplies to spotlight motor control at UK-wide seminar series
Solid State Supplies has announced a series of four one-day seminars to be held across the UK in collaboration with Microsemi and Allegro Microsystems Inc., two leading suppliers of mixed signal semiconductors for motor control applications. The first seminar will take place on Wednesday 7th March 2012 in Redditch, Worcestershire.
Texas Instruments’ research advancements build upon leadership in low power, energy efficiency and greener designs to help make the world a better place
Next week at the prestigious International Solid State Technology Conference (ISSCC) in San Francisco, Texas Instruments Incorporated is presenting several papers and participating in presentations to outline accomplishments and opportunities in areas of low power, energy management and improved energy efficiency.
IPC Apex Expo keynote panel forecasts game changers in the industry
What will have the greatest impact on the electronics industry in five years? Will it be technology, manufacturing, government regulations or global competition? The Wednesday Keynote at IPC APEX EXPO 2012, February 28–March 1 at the San Diego Convention Center, will feature five panelists who will provide their unique perspectives on what the game changers will be for the industry.
Broadcom Completes Acquisition of NetLogic Microsystems, Inc.
Broadcom Corporation today announced it has completed its $3.7 billion acquisition of NetLogic Microsystems, Inc. The combination enables Broadcom to deliver best-in-class, seamlessly integrated network infrastructure platforms to its customers, reducing both time-to-market and development costs.
Agilent Technologies Announces PXT Will Be Used in SK Telecom Hybrid Network Demonstration
Agilent Technologies Inc. today announced that the E6621A PXT wireless communications test set will be used in an SK Telecom Hybrid Network demonstration during Mobile World Congress in Barcelona, Feb. 27-March 1. The SK Telecom solution allows two networks of different technology and frequency band to work as one, doubling the speed of the Internet connection.
SPI and ESCATEC announce the merger of their high precision manufacturing operations in Shanghai to form a joint venture company
Swiss Precision Industries announces the formation of a joint venture company with ESCATEC that will combine SPI's precision stamping and die making facility in Shanghai, China with ESCATEC's injection moulding and mould making facility located nearby. The new company, Swiss Precision Component Manufacturing, in which SPI is the lead partner and majority shareholder, will merge the staff, equipment and expertise of both organisations to create a ...