Analysis
Dialog Semiconductor and TSMC create a process platform to advance BCD power management leadership
Dialog Semiconductor plc today announced it is working closely with TSMC to develop its next generation of bipolar-CMOS-DMOS technology specifically tailored to high-performance power management ICs (PMICs) for portable devices.
ITT Interconnect Solutions exhibit at eCarTec, Paris
ITT Interconnect Solutions announces its participation at eCarTec, Porte de Versailles, Paris, April 3 – 5. One of the world’s longest-established connector manufacturers, ITT’s Engineered for Life product portfolio has contributed to many advances in technology across multiple markets, from space travel to industry. Substantial R & D investment in developing electric vehicle charging solutions achieved an industry first in summer 2010, w...
Echelon Highlights Fast Payback Applications for Smart Street Lighting and Smart Buildings at the Light+Building Fair
Echelon Corporation will showcase several Smart Street Lighting and Smart Building solutions, built on Echelon’s proven, open standard, multi-application energy control networking platform, at the world's leading trade fair for lighting and intelligent buildings, Light+Building, held at the Frankfurt Fair and Exhibition Centre on April 15-20 in Hall 9.0, Booth E10. Echelon and its partners will demonstrate how these solutions reduce energy use ...
“Market for key RF components to reach $4.7B in 2016,” announces Yole Développement
Yole Développement announces its report “RF filters, PAs, Antenna Switches & Tunability for Cellular Handsets”. Discover how emerging technologies are driving the RF architecture changes and will create new market opportunities.
SEHO to Showcase Innovative Developments at SMT/Hybrid/Packaging 2012
SEHO Systems GmbH will highlight several machines in hall 9, stand 209 during SMT/Hybrid/Packaging, scheduled to take place May 8-10, 2012 at the Messezentrum Nuremberg, Germany.
Aeroflex awarded A|D|S 21st Century Supply Chains Silver Award
Aeroflex Limited announced today that Aeroflex Test Equipment Services has been awarded the A|D|S 21st Century Supply Chains (SC21) Silver Award for high quality service and continuous improvement to its calibration, repair, and asset management services.
BTU to Feature Next-Generation PYRAMAX Capabilities at NEPCON China
BTU International, Inc. will highlight its next-generation High Efficiency (HE) Flux Management and dual-lane, dual-speed capabilities of the PYRAMAX solder reflow system as well as its latest WINCON 5.0 control system software in booth #1G65 at the upcoming NEPCON China 2012, on April 25-27, 2012 at the Shanghai World Expo Exhibition & Convention Center.
Pintelon Receives 2012 IEEE Joseph F. Keithley Award for Innovative System Identification Methods for Measurement Applications
The IEEE has named Dr. Rik Pintelon as the recipient of the 2012 IEEE Joseph F. Keithley Award in Instrumentation and Measurement. Pintelon is being recognized for the development of innovative system identification methods for measurement applications. The award, sponsored by Keithley Instruments, Inc., a world leader in advanced electrical test instruments and systems, is presented for outstanding contributions in the field of electrical measur...
Mike Konrad to Present “Cleaning in a World of No-Clean” at the SMTA Intermountain Vendor Day in Idaho
Aqueous Technologies Corp. announces that CEO Michael Konrad will present at the upcoming SMTA Intermountain Vendor Day and Tech Conference. Mr. Konrad will present “Cleaning in a World of No-Clean” on Wednesday, April 4, 2012 at Boise State University in the Simplot Ballroom.
P. D. Circuits Adds a New Member to Its Engineering Team
P. D. Circuits, Inc has hired a new Product Engineering Technician – Dennis Perry. In his new role, Dennis will apply his strong PCB DFM, frontend engineering and manufacturing background to prepare data packages for assigned orders according to documented guidelines and SOPs. He is responsible for reviewing and modifying electronic circuit board data files, and preparing data packages for manufacturing.