Analysis
electronica 2012 Presents Products And Solutions For Electromobility Of The Future
At electronica from November 13 – 16, leading international companies will present their products, the latest solutions and the most important trends that pertain to the topic of electromobility. In the automotive Forum, industry experts will provide insights into technologies and markets that are relevant to actual practice. On November 12 and 13, industry specialists at the electronica automotive conference at the ICM - Internationales Congr...
Most-Needed Chemicals for New Disruptive Electronics and Electrics: De-risk your investment
The new electronics and electrics span from nano-sized to very large devices. No one term covers all this, though organic electronics, beyond the silicon chip, wide area electrics and flexible electronics and electrics cover large parts of it. For example, one of the key enabling technologies - printed electronics - gives us viable electronic billboard sheets and huge areas of photovoltaics (solar cells) printed reel to reel.
New President and Organisational Restructure for Sono-Tek
Sono-Tek has today revealed that it has restructured its organization, with Stephen Harshbarger assuming the duties of President and reporting directly to Dr. Christopher L. Coccio, Chairman and CEO.
Bolt it, Bond it, Rivet, Clinch and Assemble it at the FAST & IASE Exhibitions
Bolt it or bond it? Rivet it or clinch it? Drill it or self-pierce it? Assemble it for subsequent disassembly or put it together forever? When it comes to fastening and bonding in engineering or industrial applications there is only one exhibition dedicated exclusively to the subject – the FAST & IASE events being held at the National Motorcycle Museum on October 18th this year.
Europlacer Expands SMT Equipment Support Team with new Senior Field Service Engineer
Europlacer recently added a new member to its customer support team – Senior Field Service Engineer Viet Nguyen. In his new role, Nguyen will be responsible for supporting customers’ SMT pick-and-place process requirements, machine maintenance and service along with technical support.
Penn State Wins Finetech Die Bonder Donation
Pennsylvania State University was selected in a university donation drawing for a FINEPLACER Pico MA bonder on August 15, 2012. The multi-application system with 5 micron placement accuracy is valued at $100,000. As part of its 20th anniversary celebration this year, Finetech chose to give back to the university R&D segment of its business by donating a bonder for research and education. Nearly 400 entries were received, representing 95 unive...
Denso Gains Significant Productivity and Quality-of-Results Advantages with Cadence Mixed-Signal, Low-Power Solutions
Cadence Design Systems, Inc announced today that automotive parts manufacturer Denso Corp. experienced significant quality and productivity improvements on a low-power mixed-signal IC design after switching to Cadence custom/analog and digital flows. After deploying the Cadence Encounter RTL-to-GDSII flow on the digital portion of the design, Denso reported a 10 percent reduction in area and a 20 percent reduction in power compared to previous ve...
Transonics Are Driving Down the Cost of PCBs
Transonics are now the number one trusted source for PCB supply with many of their own customers and it's the largest area of growth within the company. Transonics PCBs are high quality, competitively priced and are supplied with TS16949 accreditation, the level required for automotive standard. Transonics PCB design offers full Gerber manipulation services, fast turn-around time, with samples delivered in 1 week and production quantities in 2 we...
Robert Bosch GmbH becomes the first company from the automotive sector to join the AVX “Solutions for Hope” Project
AVX Corporation announced today that the major automotive electronic part manufacturer Robert Bosch GmbH, has joined the AVX “Solutions for Hope” Project. “We are very pleased to have Bosch, one of the world’s premier electronics suppliers to the automotive sector participate in our project,” said Peter Collis Executive Vice President of the AVX tantalum division.
Lightfair International 2013 Call For Speakers Now Open
The LIGHTFAIR International (LFI) 2013 Call for Speakers opens today for the world’s largest annual architectural and commercial lighting trade show and conference. LFI invites speakers seeking opportunities to present in Philadelphia April 21-25, 2013, at the Pennsylvania Convention Center.