MIRTEC will Present its Technologically Adavnced AOI Equipment at IPC Midwest 2012
News Release from:
Mirtec Company Limited
25 July 2012
MIRTEC has today revealed that it will be premiering its technologically advanced Automated Optical Inspection equipment in booth #109 at the upcoming IPC Midwest 2012, scheduled to take place August 22-23, 2012 at the Renaissance Schaumburg Hotel and Convention Center in Schaumburg, IL.
At the show MIRTEC will feature its award-winning MV-3L Desktop AOI System configured with the exclusive 10 Mega Pixel ISIS Vision System. This revolutionary optics system is comprised of a 10 Mega Pixel Top Down camera and a Precision 13.4 Micron Telecentric Compound Lens. MIRTEC’s patented “Quad Angle Lighting System” provides four independently programmable zones for optimal illumination of inspection areas.
The MV-3L also will be configured with four Ten Mega Pixel Side-View Cameras as well as MIRTEC’s exclusive Intelli-Beam Laser System. This advanced technology provides: Four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability in a cost effective desktop AOI system. The MV-3L is powerful yet simple to use. A comprehensive Package Type Library provides simple “Drag and Drop” component programming. The Automatic Teaching Tool software provides automatic teaching of component locations using CAD centroid data.
“MIRTEC has earned a solid reputation in the industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment,” stated Brian D’Amico, president of MIRTEC’s North American Sales and Service Division. “We look forward to welcoming visitors to our booth #109 during the two-day event.”
