Agilent, IC-CAP 2011.04
Agilent Technologies Ships Latest IC-CAP Platform for DC and RF Device Characterization and Modeling
News Release from:
13 May 2011
Agilent Technologies announced shipment of the latest release of its device modeling software platform, Integrated Circuit Characterization and Analysis Program. IC-CAP 2011.04 provides significant improvements in the modeling flow of semiconductor devices by enabling the IC-CAP Wafer Professional automated measurement solution to link with IC-CAP's CMOS model extraction packages.
Modern CMOS device modeling requires that a high volume of measurements be performed to analyze process trends and identify data required for extraction of typical and corner-case device models. Managing and analyzing this data to ensure the right choices are made for model extraction and verification is challenging. It often requires modeling teams to use multiple software tools, converting data from one format to another, with loss of precision and efficiency. IC-CAP WaferPro helps the user to collect and manage high volume data in the most efficient way. Now, for the first time, the IC-CAP CMOS modeling packages work seamlessly with WaferPro.
With IC-CAP 2011.04, users are able to define devices and measurement tests in the Agilent CMOS Package environment and then automatically create a WaferPro test plan that they can execute on a variety of test equipment. Once the devices of various geometries have been characterized via WaferPro, the CMOS extraction module automatically reads the measurement data for use in model extraction. This greatly improves the efficiency of the flow since there is no need to transfer or reformat data between the measurement and modeling applications.
Since its release in 2010, IC-CAP WaferPro has become increasingly popular among customers due to its performance, flexibility, wide support for test instruments and systems, and the way it helps maximize the utilization of lab equipment, said Roberto Tinti, product manager with Agilent's EEsof EDA organization. We are pleased to extend WaferPro's powerful capabilities to all the Agilent CMOS extraction package users. By doing so we are helping them make their overall flow, from measurement to extraction, more efficient.
In addition to the WaferPro and CMOS packages link, IC-CAP 2011.04 adds support for Windows(r) 7 and several platform improvements in the areas of simulation, measurements and programming environment. Enhancements include the ability to simulate with Verilog-A and Agilent's ADS simulator (included in the IC-CAP analysis module license at no extra cost), and support for PARAM statements in spice netlists. Additionally, WaferPro now supports Tokyo Electron P8/P12 fully automated probers, while Agilent's B1505A DC power analyzer driver supports pulsed-bias on multiple-bias units.
About IC-CAP WaferPro and the CMOS Modeling Packages
Agilent's W8510 IC-CAP WaferPro lets users perform automated on-wafer measurements at different temperatures by controlling semiautomated and fully automated probe stations and advanced instruments such as the Agilent 4080 parametric testers. It is the most powerful measurement suite for DC-CV and RF device modeling measurements. The IC-CAP CMOS measurement and extraction packages provide a dedicated software environment to extract typical and corner-case models of advanced CMOS devices. Efficient parameter extraction procedures for CMOS industry-standard models such as BSIM3, BSIM4, PSP, and HiSIM are fully supported. The packages provide the right balance between the efficiency offered by a turnkey solution and the necessary customization capabilities to extract diverse complex models of today's CMOS devices.
About IC-CAP Software
Agilent IC-CAP software is a device modeling program that delivers powerful characterization and analysis capabilities for today's semiconductor modeling processes. Providing efficient and accurate extraction of active device and circuit model parameters, IC-CAP performs numerous modeling tasks, including instrument control, data acquisition, graphical analysis, simulation and optimization. It is used by semiconductor foundries and design houses to characterize foundry processes.