Agilent to Accelerate Development in Toxicology Testing with Funding from NIH Grant
Agilent Technologies Inc. and a team of scientists and investigators from six leading research organizations, are using a $6 million grant from the National Institutes of Health to pioneer transformative research in toxicology.
DSM’s Stanyl ForTii boosts connector performance at Amphenol East Asia, Taiwan
Industry trends such as miniaturization, integration or "thinnovation", combined with the move towards Cloud Computing, will mean that areas such as the server market will depend increasingly on reflow soldering assembly technology. The required power supplies to drive each of these systems can easily reach 500V or more.
Datest Completes Transition to New AS9100 Revision C Standard as Part of Its Continued Effort to Provide Quality Test on Demand
Datest announces that it has successfully completed the transition from the ISO 9001:2008, AS9100 Revision B standard to the new Revision C standard – the quality management system for the aviation, space and defense industries.
CMOS Image Sensors Begin Breaking Sales Records Again
After hitting a rough patch in the second half of the last decade, CMOS image sensors have finally regained growth momentum, and this once high-flying optoelectronics market segment is now expected to set record-high sales each year through 2016 (see Figure), according to IC Insights' new 2012 Optoelectronics, Sensors/Actuators, and Discretes (O-S-D) Report.
Altium and NXP collaborate to deliver component content online
Altium announces the release of a new range of board-level components for industry-leading ARM Cortex-M3, Cortex-M4 & Cortex-M0 based microcontrollers from NXP Semiconductors to their subscription customers through AltiumLive.
Success of 3D NanoCompass will enable Baolab to create low cost, smart, reconfigurable Inertial Measurement Unit
Baolab Microsystems has announced that it expects to be able to modify the structures that it designed for its 3D NanoCompass to build a range of other motion sensors and, ultimately, to create low cost, smart, reconfigurable Inertial Measurement Units (IMUs). These NanoIMUs will use Baolab's patented, award winning NanoEMS technology to create nanoscale MEMS (Micro Electro Mechanical Systems) within the standard metal structure of a high volume manufactured CMOS wafer.
Fujitsu Semiconductor Adopts Cadence Chip Planning System for MCU Chips at Its Design Centers Worldwide
Cadence Design Systems, Inc. today announced that Fujitsu Semiconductor Limited has adopted the newly updated Cadence Chip Planning System at its nine design centers spread around the globe. Fujitsu Semiconductor chose the Cadence system because of the time, accuracy and cost benefits it offers in the development of its MCU chips requiring large-scale integration (LSI).
UNIPOWER modules at the heart of “silent” power shelf from Communications Audit
Designers and builders of rack-based systems are not generally space constrained when it comes to specifying the power source. Not for them the constant need to consider size, weight and heat dissipation and very few need to be concerned with other factors such as the electrical "noise" generated by the power supply itself. And, if noise is an issue, most designers will select a linear power supply to do the job.
Addressing Power Challenges in High-Altitude Applications
Not every thermal challenge involves hot or wet environments, as we recently found out when GlobTek provided a power supply solution to serve an RFID application. In this case the manufacturer was concerned with high-altitude issues related to the shipping industry and airfreight. Many do not realize that the interior of an airplane, while pressurized, actually has an equivalent effective cabin altitude of around 7,000 feet (~2100 meters).
Microsoft Joins Hybrid Memory Cube Consortium, Which Aims to Break Down Memory Wall
The Hybrid Memory Cube Consortium (HMCC), led by Micron Technology, Inc. and Samsung Electronics Co. Ltd. today announced that Microsoft Corp. has joined the consortium. The HMCC is a collaboration of original equipment manufacturers (OEMs), enablers and integrators who are cooperating to develop and implement an open interface standard for an innovative new memory technology called the Hybrid Memory Cube (HMC).
Energy Micro EFM32 Gecko MCU powers SCUBAPRO-UWATEC Meridian dive computer
SCUBAPRO-UWATEC and Energy Micro today announced that the EFM32 Gecko microcontroller (MCU) has been selected to power the SCUBAPRO Meridian dive computer. Meridian is a sophisticated dive computer with a luxury watch design, powered by a single CR2032 lithium battery.
CISSOID Joins PRIMES
CISSOID, the leader in high-temperature and high-reliability semiconductor solutions, announced today it has joined PRIMES, the research center for power electronics based in Tarbes, France. Founded in 2001, PRIMES is a research and innovation platform gathering tier-1 players of the industry and five academic research laboratories.
Powerful Issues in Thermal Management
It seems that thermal-management issues are constantly cropping up in consumer electronics, plaguing manufacturers of products from game consoles to tablets to phones. Some issues involve devices that are merely unpleasantly hot (which tells me that it won't be very happy in a hot ambient), but other cases involved catastrophic thermal runaway (a fancy way of saying that the device burst into flames). What is wrong with this picture? Doesn't anyone remember that proper device design also involves proper thermal management?
NI Releases iOS and Android Mobile Apps for NI Hardware and LabVIEW
National Instruments today announced NI LabVIEW software- and NI hardware-compatible mobile apps for iPhone, iPad and Android devices, helping engineers integrate the latest mobile technology into their applications. By combining the portability, ease of use, faster start-up time and longer battery longevity of mobile devices with the power of LabVIEW, engineers can more productively access measurement data from data acquisition and embedded monitoring systems.
A Powerful Concern in Medical Device Design
When you consider that a power supply is essential to electronics, it is amazing that so many designers wait until the end of the design process to design-in their power source. This is especially amazing today given that so much can be gained in system performance and efficiency, regardless the core technology or end product, by properly integrating the power supply into it.
University of Manchester joins UK Electronics Skills Foundation
The University of Manchester has joined the UK Electronics Skills Foundation, which seeks to reverse the decline in the number of UK graduates entering the electronics industry by linking talented electronic engineering degree students with companies for scholarships with work experience.
MEMS Microphones from STMicroelectronics Build the Foundation of Future Voice-Enabled Homes
The world-class expertise in MEMS microphone and audio processing technologies of STMicroelectronics will play a pivotal role in the European research project on 'Distant Speech Interaction for Robust Home Applications' (DIRHA). The three-year program aims to investigate and prototype solutions for natural voice-enabled interaction between humans and machines in tomorrow's smart homes.
Advantech selects Innovasic’s RapID Platform for Profinet I/O Modules
Innovasic is pleased to announce that Advantech has selected the Innovasic RapID Platform solution with the fido1100 Communication Controller to provide Profinet Class B connectivity in their new ADAM-6100PN series of real-time Profinet I/O modules for factory automation.
Express Logic’s ThreadX RTOS Outshines Competition in 2012 Embedded Developer Survey
Express Logic, Inc. today announced that Express Logic's ThreadX RTOS ranked above competitive RTOSes in percentage of projects completed on time or ahead of schedule, according to data from the 2012 Embedded Market Forecasters' (EMF) survey of embedded developers. The survey showed that nearly 80% of ThreadX-based projects were completed on or ahead of schedule, a result far better than the average of 63% for all other RTOSes.
Machinery and Systems Networking with Sercos III and EtherNet/IP
The first practical results of the machinery initiative, which was launched jointly by Sercos International, ODVA, and OPC Foundation in April 2011, were announced at the 2012 Hannover trade fair.
Nujira files 150th Envelope Tracking patent
Nujira Ltd today announced the filing of its 150th patent relating to Envelope Tracking (ET). The milestone comes just 12 months after reaching the 100 patent landmark in April 2011, reinforcing Nujira's dominant position in the ET IP landscape.
Point Grey Launches High Definition 6.0 Megapixel FireWire Camera With Industry Leading CCD Sensitivity
Point Grey today announced the addition of new 6.0 megapixel models to its Grasshopper Express IEEE 1394b (FireWire-b) digital cameras series. Building on Point Grey's experience with Sony EXview HAD CCD II technology, the new Grasshopper Express GX-FW-60S6 uses the Sony ICX694 to deliver high resolution and extreme sensitivity in a compact and low-cost package.
Huawei and Intel Collaborate on LTE TDD
Intel Corporation and Huawei today announced a collaboration to advance the development of interoperability testing and deployment of LTE TDD solutions. The two companies will establish joint lab set-up based in China for IOT (Interoperability Test) and fast implementation of LTE TDD technology.
IPC Technology Trends Study Reveal Changes In Store For PCB Fabricators And Suppliers
PCB Technology Trends 2011, a new study published this week by IPC — Association Connecting Electronics Industries, shows how the demands of miniaturization and high-speed technology are driving changes in printed circuit board (PCB) processes and materials. The 53-page report presents the technology demands of today and foretells the changes expected by 2014 that will affect PCB fabricators as well as materials and equipment suppliers.
ARM and MStar Extend Relationship with License for ARM Cortex-A9 Processor
ARM today announced that MStar has licensed the ARM Cortex-A9 MPCore and ARM926EJ-S processors, in addition to a range of ARM system IP for use in smart-TVs, set-top-boxes (STBs) and smartphones. MStar is already a licensee of the ARM Mali-400 MP Graphics Processing Unit (GPU), which is used in mass production for MStar smart-TV system-on-chip (SoC) solutions. By extending its ARM IP portfolio MStar will be able to provide solutions featuring a range of feature-rich ARM technology.
Personalised workbench app empowers engineers
Starting today engineers can more easily browse, store and link products to projects using NXP Semiconductors' N.V. newest mobile app – 'Tech bench.' Tech bench is an intuitive, feature-rich iPAD app allowing engineers to access NXP's full product portfolio; to collect datasheets, application notes and quality information; and to 'drag and drop' product or application data in self-defined project sections.
Renesas Adopts Synopsys' Proteus LRC for Lithography Verification
Synopsys, Inc. today announced the production qualification and adoption of Synopsys' Proteus LRC at Renesas Electronics Corporation, the world's premier supplier of microcontrollers and a world's leading supplier of advanced semiconductor system solutions including microcontrollers, SoC solutions and a broad-range of analog and power devices. Proteus LRC provides large-scale integrated circuit (LSI) manufacturers like Renesas with a highly accurate and comprehensive lithographic verification solution.
“A US $6.1 billion opportunity through the end of the decade,” announces Yole Développement
Yole Développement announces its report "III-V Epitaxy Equipment & Applications Market". In this report, Yole Développement covers established and emerging epitaxy technology for III-V semiconductors used in several applications. It provides quantifications for tools and wafer starts per application, an in depth analysis of recent technology trends and their impact on cost of ownership and a comprehensive company profile of the main players in MOCVD and MBE business.
Peak Group joins GOEPEL electronic’s GATE program
GOEPEL electronic announces the extended incorporation of Peak Production Equipment Ltd., into the global alliance program GATE (GOEPEL Associated Technical Experts). The focus of the cooperation is the development and practical implementation of new products based on combined functional and JTAG/Boundary Scan test as well as enhancements in the integration of JTAG/Boundary Scan products in existing test systems built by Peak, allowing a total test and integration solution to be provided from one source.
Tensilica’s ConnX BBE16 DSP IP Core for Digital Baseband Signal Processing Licensed to Renesas Electronics
Tensilica, Inc. today announced that the ConnX BBE16 DSP (digital signal processing) IP (intellectual property) core has been licensed to Renesas Electronics Corporation for upcoming products for digital TVs.
NI Releases iOS and Android Mobile Apps for NI Hardware and LabVIEW
National Instruments has announced NI LabVIEW software- and NI hardware-compatible mobile apps for iPhone, iPad and Android devices, helping engineers integrate the latest mobile technology into their applications. By combining the portability, ease of use, faster start-up time and longer battery longevity of mobile devices with the power of LabVIEW, engineers can more productively access measurement data from data acquisition and embedded monitoring systems.
Solid Wires Face Keen Challenge from Flux Cored Alternatives, Cautions Frost & Sullivan
The global solid wires market was deeply impacted by the economic crisis in 2009, but staged a recovery in 2010, with compound annual growth rates (CAGR) projected at 9% from 2010 to 2017. Notable drivers in this growth will include the wider adoption of alloyed solid wires in emerging geographic markets, increasing automation and MIG applications, heightened awareness and the rising preference for solid wires in pipelines industries.
Imec’s resistive RAM research shows momentum in 2012 VLSI Technology Symposium papers
At this year's Symposia on VLSI Technology and VLSI Circuits (June 12-15, 2012 - Honolulu, USA,), imec and its partners will present 10 papers on memory and logic scaling technology and circuits. With 4 RRAM (resistive RAM) papers accepted, the VLSI reviewing committee endorses the value of imec's R&D program on emerging memory devices. And 5 papers will address logic device scaling and characterization for next-generation CMOS technologies.
Fujitsu Technology Puts Big Data to Use in Minutes
Fujitsu Laboratories today announced that it has developed new parallel distributed data processing technology that enables pools of big data as well as continuous inflows of new data to be efficiently processed and put to use within minutes.
ON Semiconductor to Jointly Develop Next Generation Star Tracker CMOS Image Sensor with the European Space Agency
ON Semiconductor today announced that the European Space Agency (ESA) has awarded it a joint development contract for the next generation star tracker CMOS Image Sensor (CIS), referred to as HAS3. Once developed and qualified, the High Accuracy Star Tracker 3 (HAS3) image sensor will expand the STAR family of radiation-tolerant CIS.
Fujitsu Develops Power Saving System Control Technology for Container Data Centers
Fujitsu Laboratories Limited today announced the development of a power conservation system control technology that reduces overall power consumption in container data centers by closely coordinating the operation of servers and air-conditioning (A/C) systems.
Cypress's EZ-USB FX3 Controller Enables USB 3.0 Test Platform for Microsoft
Cypress Semiconductor Corp. today announced the EZ-USB FX3 USB 3.0 controller has been chosen for the SuperSpeed Microsoft USB Test Tool (SuperMUTT). SuperMUTT can be used with virtually any USB 3.0-enabled host driver to test USB compliance and compatibility with Microsoft's upcoming Windows 8.
“The MEMS packaging, assembly, test & calibration market will reach $2.3B value by 2016, growing three times faster than the overall IC packaging industry,” forecasts Yole Développement
Yole Développement announces its report "MEMS Packaging". This report is featuring a full analysis of packaging, assembly & test requirements application by application as well as a dedicated focus on MEMS package substrates.
New Supercomputer System Begins Operations at the University of Tokyo's Information Technology Center
Fujitsu today announced that it has completed construction of the new supercomputer, nicknamed Oakleaf-FX, for the Supercomputing Division of the University of Tokyo's Information Technology Center (SCD/ITC). The new system will begin operations from today.
High Demand For Scorpion, Essemtec’s New Dispensing System
Since the premier of the Scorpion at productronica 2011 in Munich, Essemtec has noted a record high in demand. Due to its outstanding price-performance ratio, the new dispensing machine is among the best dispensers in the world. Its accuracy of ±25 μm is extraordinary and it can dispense up to 100,000 dots per hour.