Tech News
VIA Labs VL811+ USB 3.0 Hub Controller Obtains USB-IF Certification
VIA Labs today announced that the VIA Labs VL811+ 4-port SuperSpeed USB Hub controllers has achieved SuperSpeed USB certification from the USB Implementers Forum (USB-IF). The VIA Labs VL811+ is among the first USB 3.0 hubs to achieve USB-IF certification.
NASA Relies on Wind River Simulation Technology for Long-Term Cost Savings
Wind River has announced that NASA's Independent Verification and Validation Program is using Wind River Simics, a full system simulator, for its high-fidelity simulator product, GO-SIM. NASA's IV&V Program was founded as part of NASA's strategy to provide the highest achievable levels of safety and cost-effectiveness for mission-critical software. Because its primary business includes software test and verification, software simulations are an essential part of the business.
Total Flash Memory Market Will Surpass DRAM for First Time in 2012
Driven by continued demand for smartphones, tablet PCs, and other personal media devices, the total flash memory market (NAND and NOR) is forecast to grow 2% to $30.4 billion in 2012, surpassing the $28.0 billion DRAM market in sales for the first time. With the exception of 2010, the DRAM and flash memory markets have been growing closer in size to each other for several years but demand for flash used in portable media devices, coupled with two years of weaker demand and price erosion for commodity DRAM used in personal computers, will finally be enough to push total flash sales beyond those for DRAM this year (see figure below).
VPG reveals new on-site bulk metal foil resistor trimming at Digi-Key
Vishay Precision Group today announced that the company has opened a new Vishay Foil Resistors (VFR) Precision Center within Digi-Key Corporation. Digi-Key can now build and ship VFR surface-mount precision resistors – with no minimum quantities – in 24 to 48 hours, including VFR's popular new Bulk Metal Foil VSMP (Z-Foil Technology) and VSM series resistors.
Affordable, Yet Innovative Pumps Are The Key To Success In The European Centrifugal Pumps Market
A new analysis from Frost & Sullivan, entitled: 'Strategic Analysis of the European Centrifugal Pumps Market' finds that energy efficient centrifugal pumps are well poised to survive the instability of the market. The Frost & Sullivan analysis found that the market achieved revenues of $6.95 billion in 2011 which is predicted to reach $7.57 billion in 2016.
GNAT Pro Safety-Critical used by Terma A/S for Space Monitor Project
AdaCore today announced that Terma A/S has selected the GNAT Pro Safety-Critical development environment to develop onboard software for the Atmosphere-Space Interactions Monitor that will be mounted on the Columbus module of the International Space Station. Terma will use GNAT Pro Safety-Critical combined with the GNATemulator and GNATcoverage dynamic testing tools to develop and test the application prior to deployment on the actual LEON 3 embedded processor.
Embedded Imaging Takes Off as Stand-alone Digital Cameras Stall
It took digital cameras less than 10 years to virtually eliminate film photography from the consumer market in the last decade. Almost as quickly, camera-equipped cellphones have played a major role in ending the meteoric rise of stand-alone digital cameras. For most consumers, camera phones have become more than adequate for taking photographs and capturing video clips.
Cogiscan invests in technological innovation with C2MI Partnership
Cogiscan announces its partnership with the MiQro Innovation Collaborative Centre (C2MI). The C2MI is an international research and development centre in microelectronics and advanced microsystems, located in the Bromont Scientific Park. The C2MI is a unique collaboration centre. In addition to state-of-the art equipment, the C2MI offers its members a true innovation ecosystem dedicated to the rapid commercialization of their prototypes.
Imec and Synopsys Expand FinFET Collaboration to 10Nanometer Geometry
The collaboration builds on extensive work done at 14-nm and several other process geometries, and will calibrate Synopsys' Sentaurus TCAD models to support the next-generation FinFET devices. The collaboration will include 3-D modeling of new device architectures and materials that will enable the semiconductor industry to continue to deliver products with higher performance and lower power consumption.
SuVolta Announces Circuit-level Performance and Power Advantages of DDC Technology at IEDM
SuVolta announce silicon results that demonstrate the performance and power advantages of its Deeply Depleted Channel technology. The results are based on analog and digital logic circuits designed with SuVolta's PowerShrink low-power CMOS platform implemented in Fujitsu Semiconductor's 65 nanometer low-power process. The results will be presented in a SuVolta-Fujitsu Semiconductor jointly-authored paper at the International Electron Devices Meeting being held in San Francisco beginning on December 10.
Successful Fabless Semiconductor 2013: Technology and Supply Chain Challenges for Fabless Semiconductor Companies
Yole Développement and Serma Technologies are proud to announce that the Successful Fabless Semiconductor 2013 Conference, jointly organized with Novotel Vaugirard, will take place in Paris from April 10 - 12, 2013. With four sessions dedicated to the fabless industry -- including design, industrialization and a special focus on "fabless in Power Electronics" -- the SSF 2013 program covers all business, technology and supply chain challenges, and both Yole Développement and Serma Technologies have invited a host of players (from large global companies to SMEs) to participate. In addition to the sessions, debates, networking time and an exhibition area are featured attractions.
Tiny Compound Semiconductor Transistor Could Challenge Silicon’s Dominance
Silicon's crown is under threat: the semiconductor's days as the king of microchips for computers and smart devices could be numbered, thanks to the development of the smallest transistor ever to be built from a rival material, indium gallium arsenide. The compound transistor, built by a team in MIT's Microsystems Technology Laboratories, performs well despite being just 22 nanometers (billionths of a meter) in length.
Broadcom Study Outlines Connectivity Personality Types and Top Habits of Highly Connected People
Broadcom Corporation today announced the results of the Broadcom Connectivity Study, a survey of 2,500 U.S. adults measuring connectivity trends across behavioural and demographic lines in today's digital life. The survey revealed seven distinct connectivity personality types among American adults, defined by two key dimensions: Connectivity, or the level of device and social media use, and Behaviour, or how web-enabled devices and online platforms are used to connect to others. It also identified a range of characteristics of those with the greatest connectivity quotient.
Shipments of Lattice iCE FPGA Family Reach 15 Million
Lattice Semiconductor today announced that since December 2011 it has shipped 15 million iCE FPGA devices, including its flagship ultra-low density iCE40 FPGA family, making this the company's fastest shipping product of the past decade.
IC Insights predict Standard PCs Will Lose Status as Largest IC Application in 2013
For most of the last two decades personal computers have accounted for a third or more of annual IC sales, but standard PCs are now on the brink of being replaced as the largest end-use product category for integrated circuits, according to IC Insights' new 485-page 2013 edition of IC Market Drivers—A Study of Emerging and Major End-Use Applications Fueling Demand for Integrated Circuits. With cellphones and tablet computers racking up stronger growth rates, standard PCs are expected to use just one quarter of the ICs sold in 2012, and that share will fall to slightly less than 20% in 2016, based on the forecast in the new report.
Crocus and SMIC take steps to accelerate availability of MLU technology based micro-controllers
Crocus Technology and SMIC today announce a new strategic manufacturing agreement. SMIC will supply CMOS wafers to produce Magnetic Logic Unit(TM) (MLU) devices at 90 nanometer, 65 nanometer and 45 nanometer nodes, with a path to process the entire flow.
Plextek Announces Xilinx Alliance Certification
Plextek has revealed its status as a certified member of the Xilinx Alliance Program, following a rigorous corporate audit and Plextek's engineers successfully completing the certification training process. Plextek's experience in both embedded software and FPGA design allow the company to quickly take on board the considerable challenges of the capability and complexity of this technology.
Thin Film Thermoelectric Handbook published by Laird
Laird Technologies has today announced the publication of its "Thin Film Thermoelectric Handbook." The handbook was authored by the company's thermal management subject matter experts. The handbook focuses on thin film thermoelectric modules and provides in-depth insight into the advantages of TFM's over traditional bulk technology, as well as the basic structure and function of TFMs, system level considerations required for device selection and thermal management design.
Tensilica Reaches 200 Licensees Milestone for Dataplane Processor IP Cores
Tensilica has revealed today that 200 companies have licensed Tensilica's dataplane processor unit technology. Over 500 licenses have been signed with these 200 companies, and several thousand unique DPUs have been optimized by Tensilica (standard products) and its licensees (customized products) and deployed in silicon.
NI Instrument Driver Network Reaches 10,000 Drivers for Automating Stand-Alone Instrumentation
National Instruments today announced that the NI Instrument Driver Network has reached a new milestone of 10,000 instrument drivers for automating stand-alone instrumentation. From IDNet, you can access free, NI-certified instrument driver downloads for NI LabVIEW system design software, NI LabWindows/CVI and Microsoft Visual Studio.NET. IDNet instrument drivers simplify instrument control across a variety of buses including GPIB, USB, PXI, PCI, Ethernet, LXI and RS232.
Frost & Sullivan Analysis of Global Level Sensors and Transmitters Markets
Multiple advantages will fuel the continued dominance of non-contact level sensors in the global level sensors and transmitters markets. Overall, the market will make a recovery on the back of revived projects that were shelved or postponed during the economic recession. New analysis from Frost & Sullivan, Global Level Sensors and Transmitters Markets, finds that the global level sensors and transmitters markets earned revenues of $4,048.7 million in 2011 and estimates this to reach $5,319.5 million in 2018.
Imec and CANON ANELVA to collaborate on STT-MRAM
CANON ANELVA and the Belgian nanoelectronics research centre imec will collaborate on advanced STT-MRAM (spin-transfer torque magnetoresistive random access memory) research and development. The collaboration will run in the framework of imec's R&D program on advanced emerging memory technologies.
Imec expands collaboration with TEL on next-generation memory
Imec announced today that Tokyo Electron and imec have further extended their collaboration. The new agreement comprises joint R&D on advanced STT-MRAM (spin-transfer torque magnetoresistive random access memory) within imec's research and development program on emerging memory technologies.
Raspberry Pi creators given NMI award for advancing next generation’s skills
The UK electronic systems trade organisation NMI, honoured the Raspberry Pi Foundation for its low-cost PC platform and its potential to develop a generation of creative and curious individuals with a deeper understanding of technology – both hard and software.
Akros Silicon and Broadcom Interoperability Collaboration Supports New PoE 60 Watt Deployments
Akros Silicon have recently announced an interoperability collaboration with Broadcom to provide fully integrated support of the emerging Power over Ethernet 60 Watt extension. Broadcom has a family of PoE Power Sourcing Equipment controllers (model BCM59111) that supports the rapidly emerging 60W application requirements.
RS Components enhances its 3D CAD model selection tools for engineers
RS Components has launched a new, dedicated 3D-CAD microsite, which gives customers faster, easier access to its extensive library of more than 30,000 3D CAD models from over 40 manufacturers, downloadable free-of-charge from the RS website.
Altium Subscription Model a Global Success Continuous updates for Altium Designer and design ready content seen as valuable resources
Altium achieves high customer satisfaction for their AltiumLive and Altium Designer subscription model. After the introduction of this new model in March 2011, which was coupled with the release of Altium Designer 10, Altium has delivered 22 updates to Altium Designer and through AltiumLive have released 100,000+ design ready components which include live supply chain data to their Subscribed users.
Win a Kindle Fire Every Day at Electronica with Electroinc Specifier A6.124
Electronic Specifier is delighted to announce an exclusive giveaway in which you could win a Kindle Fire every day at this year's electronica. Visit Stand A6.124 to enter and to be in with the chance of winning the daily Kindle Fire!
New Opportunities on Digital Identification Market: All Lights Green on the Road to Success, Says to Frost & Sullivan
"Smart cards massive deployment started in the 80's with memory cards for payment. More than 30 years after, this technology is a standard for many application and services. For this reason Frost & Sullivan, when analysing this sector, has started using "digital identification" name instead of "smart cards" to emphasis the service approach.
Digia sets out bold strategy for Qt and demonstrates progress to date
Digia outlined a series of ambitious goals for the Qt application development framework at the Qt Developer Days 2012 in Berlin and also showcased a number of new projects begun since Digia assumed full responsibility for Qt. Digia senior vice president Tommi Laitinen and Lars Knoll, CTO, Digia Qt and Qt Project Chief Maintainer, outlined a strategy and roadmap that aims at Qt becoming the world's leading cross-platform development framework within five years.
Atmel Launches Industry’s First Integrated App Store And Collaboration Workspace
Atmel today further simplified the software design process for embedded MCU designers with the introduction of Atmel Gallery, an app store for development tools and embedded software that evolves Atmel Studio 6 into a comprehensive integrated development platform. Atmel is the first company to bring the convenience of an app store to the embedded MCU community.
Top 20 Semiconductor Suppliers’ Sales Growth Rates Forecast to Range from Great (+31%) to Terrible (-17%) in 2012.
A forecasted ranking and discussion of the 2012 top semiconductor suppliers will be included as part of IC Insights' upcoming November Update to The McClean Report. Also included in the November Update will be a listing of the top semiconductor industry capital spenders and a description of a "new" IC industry cycle model.
NXP’s SmartMX Technology to Secure German eHealthcard
NXP Semiconductors today announced that its secure microcontrollers represent the major share in Germany's eHealthcard deployment. Enabled by the "elektronische Gesundheitskarte," the system aims to enhance the public health system in Germany by improving the availability and accessibility of patient data. NXP's secure SmartMX technology will ensure that access to this data is conducted securely, providing the best possible protection of patient data and privacy.
BeagleBoard.org unleashes Cape Plug-in Board Design Contest
Capes aren't just for Halloween. The beloved cartoon superhero Beagle had a cape that he flew with year-round, and now BeagleBoard.org is asking BeagleBone enthusiasts to create their own cape plug-in boards to fly BeagleBone to greater heights. Starting today, developers, makers and hobbyists worldwide are invited to enter the BeagleBone Cape Plug-in Board Design Contest.
IC Insights forecast Better days ahead in 2013 for the O-S-D Market
After a strong surge in 2010 from the 2009 downturn and solid growth in 2011, the market for optoelectronics, sensors/actuators, and discrete semiconductors (O-S-D) lost most of its momentum in 2012 as the world's weak economy wobbles forward and uncertainty clouds the near-term outlook—particularly in Europe and the U.S.
275 different ‘Middle-End’ factories for packaging at the wafer-scale Profiled
Yole Développement announces its 2012 Wafer Packaging Fabs Database. Yole Développement provides the most comprehensive information about worldwide fabs with technical information related to Wafer Level Packaging technologies or "Middle-End" capabilities. Also, it includes key charts of the WLP fab landscape.
Crucial Supports Intel Demo Depot Program With High-Density Server Memory Modules
Crucial and Intel today announced the inclusion of Crucial server memory modules in the Intel Demo Depot Program. This service lends fully configured Intel Xeon-based servers to customers for evaluation and testing prior to final purchase.
Strategic Analysis of North American and European Small and Medium Semiconductor Enterprises
The semiconductor market, well-known for its disruptive technology, revolves around products with superior performance, better integration, high linearity, smaller size and low power consumption. Its innovative capability, along with continued venture capital funding, keeps customers interested in the market. As companies vie for product differentiation by offering unique features, functionalities and designs, the demand for semiconductors in all verticals will continue to soar.
Imec and Nantero Launch Joint Carbon Nanotube Memory Program for High-Density Next-Generation Memory Below 20nm
Imec and Nantero have announced a joint development program. The collaboration will focus on the carbon-nanotube-based memory developed by Nantero, NRAM, and its application in high-density next-generation memories with a size under 20nm. NRAM arrays will be manufactured, tested and characterized in imec's advanced nanoelectronics facilities.
New FCI CD Catalog Provides Innovative Flow/Level Measurement & Application Solutions
With helpful case studies, applications notes and best practices information, the new FCI Flow/Level Measurement Product and Services Catalog CD Release 13.0 from Fluid Components International (FCI) provides a wide range of innovative instrument solutions that increase process productivity, reduce plant maintenance and lower operating costs.
