Tech News
EnSilica and Evatronix collaborate on USB connectivity for eSi-RISC processors
EnSilica, a leading independent provider of front-end IC design services and system solutions, has announced a collaboration with silicon Intellectual Property (IP) provider, Evatronix SA, to offer fully featured eSi-RISC processor SoC solutions incorporating USB 1.1, 2.0 and 3.0 connectivity. The collaboration with Evatronix adds an important building block to EnSilica's strategy of providing customers with eSi-RISC processor sub-systems complete with integrated peripherals. The collaboration also broadens the Evatronix USB IP sub-system portfolio with RISC processor combinations.
Blakell Process Technology Day set for 15th June 2011
Following the phenomenal success of last year's in-house Process Day, Blakell Europlacer are delighted to announce that they will be repeating the event again at their UK manufacturing headquarters in Poole, Dorset on the 15th June, 2011.
Cypress - TrueTouch Solution Offers Capacitive Touchscreen Benefits at Resistive Costs
Cypress Semiconductor unveiled a breakthrough feature for its TrueTouch touchscreen controllers that enables manufacturers of handsets, cameras, GPS systems and other mobile systems to offer the benefits of capacitive touchscreens at resistive touchscreen costs. The new feature available for Cypress's CY8CTST241 (single-touch with one-finger gestures) and CY8CTST242 (adds limited two-finger gestures such as "pinch" and "zoom") delivers high performance touchscreen accuracy and responsiveness with a true single-layer sensor panel, drastically reducing the cost of the most expensive component of the touchscreen.
Whitepaper: Cypress' CapSense Sigma-Delta Algorithm
CapSense Sigma Delta algorithm (CSD) is Cypress' latest capacitive sensing algorithm for the CY8C21x34 and CY8C24x94 PSoC device family.
Intel, Micron Extend NAND Flash Technology Leadership, Introduce Industry's Smallest, Most Advanced 20-Nanometer Process
Intel Corporation and Micron Technology Inc. today introduced a new, finer 20-nanometer (nm) process technology for manufacturing NAND flash memory. The new 20nm process produces an 8-gigabyte (GB) multi-level cell (MLC) NAND flash device, providing a high-capacity, small form factor storage option for saving music, video, books and other data on smartphones, tablets and computing solutions such as solid-state drives (SSDs).
Ramtron Ships First F-RAM Samples Built on New IBM Manufacturing Line
Ramtron International announced broad sampling of the first pre-qualification ferroelectric random access memory (F-RAM) devices built on the company's new manufacturing line at IBM Corporation (NYSE: IBM). The FM24C04C and FM24C16C are serial 5-volt devices with 4- and 16-kilobits of F-RAM memory, respectively. The devices offer a high-performance nonvolatile data collection and storage solution for electronic systems. Ramtron's F-RAM products provide nonvolatile RAM memory performance with NoDelay™ writes, high read/write endurance, and low power consumption.
Imec processes first power devices on 200mm CMOS-compatible GaN-on-Si
Imec and its partners in the GaN industrial affiliation program (IIAP) have produced device-quality wafers with GaN/AlGaN layers on 200mm silicon wafers. With these wafers, functional GaN MISHEMTs were processed using standard CMOS tools.
Micron Announces Sample Availability for Its Third-Generation RLDRAM Memory
Micron Technology, Inc., (Nasdaq:MU) today announced that early engineering samples are available for its third-generation reduced latency DRAM (RLDRAM 3 memory). RLDRAM 3 is a high-bandwidth memory technology that enables a more efficient transfer of information across the network. Designed for high-performance networking applications, including high-end routers and switches that require back-to-back READ/WRITE operations or completely random access, RLDRAM 3 memory is an ideal choice for 40 Gigabit Ethernet (GbE) and 100 GbE designs, packet buffering and inspection, and lookup tables. Additionally, RLDRAM 3 memory offers significant improvements in speed, density, latency and power consumption.
Polar Instruments adds modeling of matte and drum sides of PCB copper layers to the Si9000e transmission line field solver
Polar Instruments announces that enhanced modeling of both the drum and matte surfaces of copper layers in high-speed PCB stack-ups has been added to the Si9000e PCB transmission line field solver.
EVE, Xena Networks Link Hardware-Assisted Verification Platform with Ethernet Testing Solution
EVE, the leader in hardware/software co-verification, and Xena Networks of Copenhagen, Denmark, jointly announced today a strategic development partnership where EVE's best-in-class ZeBu hardware-assisted verification family has been integrated with Xena's high-density Ethernet testing solution.
Design Tool from Fairchild Assists Engineers in Selecting Motion-SPM Devices
Designers of home appliances – such as washers, refrigerators and air conditioners – are faced with the challenge of developing motor control solutions that meet stringent and evolving energy guidelines and regulations, such as ENERGY STAR and European Commission Energy Using Products (EUPs), all while reducing footprint, reducing electrical and mechanical design cycle, bringing system efficiency and reliability to the application.
Analog Devices’ iMEMS Dual-Axis Accelerometer Delivers Guaranteed High Temperature Operation Up To +175° C
Analog Devices released for general availability today the ADXL206 high precision, low power, dual-axis iMEMS accelerometer with signal conditioned analog voltage outputs. The single-chip ADXL206 measures acceleration with a full-scale range of ±5 g and measures both dynamic acceleration such as tilt and static acceleration such as gravity. Offering a guaranteed operating temperature range of -40° C to +175° C and excellent overall stability, the ADXL206 is well suited for geological down hole tools and other extreme high temperature industrial applications.
Mesuro demonstrates first pass design success Device data to MMIC in one step!
Mesuro demonstrates how Active Harmonic Load-Pull and Waveform Engineering can produce a multi-harmonically matched MMIC PA
Ramtron F-RAM Processor Companion with TCXO Targets High-Volume Consumer, Industrial, and Computing Markets
Ramtron announced at the Embedded Systems Conference upgrades to the company's family of Processor Companion products targeted at the high-volume, processor-based electronics system market.
Infineon First Semiconductor Supplier to Offer “80 PLUS Platinum” Compliant Computing Silver Box Reference Design
Infineon Technologies has developed the first marketable silver box reference design that enables PC and server power supply units to achieve up to 92.35 percent efficiency, while significantly reducing the material costs. Infineon's solution IFX90ATX300W is based on the latest generation of three ICs (Integrated Circuits) and meets the industry's highest energy efficiency standard: "80 PLUS® Platinum". Efficiency indicates what share of the power drawn is actually used. The difference between power input and power output is the power loss, which is converted into heat. High efficiency, therefore, translates into a reduction in power consumption and lowering of electricity bills.
Mercury Signal Processing Subsystems Support Spectral Dominance
Mercury Computer Systems, a trusted provider of commercially developed ISR subsystems, announced new 3U and 6U OpenVPX modules in support of customers developing Electronic Warfare/Signals Intelligence (EW/SIGINT) applications. The new modules combine multiple technologies used in systems to detect, deceive and defeat electronic transmissions from opposing forces in missions ranging from radar targeting suppression to counter-IED.
Evatronix Enhances its JPEG 2000 IP with DCI 2K 24p and Full HD 30p signal processing capability
Evatronix SA has announced today the next generation of its JPEG 2000 solution that achieves smooth image processing at much higher resolutions. The JPEG 2000 solution from Evatronix can now satisfy the requirements of demanding Digital Cinema Initiatives (DCI 2K) and Full High Definition TV (HDTV) applications by providing designers with 24p or 30p frame rate, respectively, as defined by these standards.
Altera, MIPS Technologies and SLS Announce the MP32 Core, the First MIPS-Based, FPGA-Optimized Soft Core Processor
Altera Corporation, MIPS Technologies (NASDAQ: MIPS) and System Level Solutions (SLS) Corporation today introduced a MIPS-Based™, FPGA-optimized soft processor for use on Altera's FPGA and ASIC devices. The MP32 processor is a MIPS® compatible applications class processor that inherits one of the largest ecosystems of software development tools and operating system support in the industry. The MP32 processor is the industry's first FPGA-based soft processor supported by Wind River's VxWorks RTOS and the MIPS Navigator ICS software development suite. When combined with Altera's broad portfolio of embedded intellectual property (IP) cores, innovative FPGA design tools and the industry's leading portfolio of programmable logic devices, the MP32 processor is ideal for the development of flexible, single-chip solutions used in networking, video and digital signal processing applications.
NXP Enables the “Internet of Things” with JenNet-IP Software
NXP announced its intent to make its JenNet-IP ultra-low-power, IEEE 802.15.4-based wireless connectivity network layer software available under an Open Source license, as part of its vision to enable the "Internet of Things."
Real Intent Highlights Latest Technology for Advanced Sign-Off Verification at DAC 2011
Real Intent Inc., the leading provider of software products that accelerate Advanced Sign-Off Verification of electronic designs, today announced it will highlight its latest technology and proven solutions at this year's 48th Design Automation Conference (DAC) in San Diego, California, June 6-8, 2011. Real Intent will feature its Ascent™ XV solution, the industry's first and only solution for comprehensive X-verification and sign-off.
AMD and Multicoreware Team to Help Developers Optimize the Use of OpenCL for AMD Fusion APUs
AMD today announced a new collaboration with Multicoreware, a leader in software solutions and tool development for multi-core and heterogeneous computing environments, to deliver an advanced set of tools for OpenCL optimization. The tools development effort accelerates software developers' ability to create and optimize software that fully exploits the unique processing capability of AMD Fusion Accelerated Processing Units (APUs).
Tektronix meets design goals with 8HP SiGe Technology in 30+ GHz Oscilloscope Development
Tektronix announced that validation of ASICs designed in IBM's 8HP silicon germanium (SiGe) BiCMOS Specialty Foundry technology are exceeding target specifications for a planned new performance oscilloscope capable of greater than 30 GHz bandwidth across multiple channels while minimizing noise found in older chip sets.
ROHM Semiconductor Develops New Motor Driver LSI
Semiconductor manufacturer ROHM has developed the BD65491FV (1-channel) and BD65492MUV (2-channel) high-speed motor drivers for use in a broad range of digital camera lens drive and home appliance motor drive applications.
Analog Devices Demonstrates A High Performance Development Platform for Rapid Deployment of Motor Control Systems
Analog Devices has demonstrated a development platform which can be used to design and optimise motor control systems with any type of motor.
Semikron - New packaging technology replaces wire bonding
Semikron has developed a revolutionary packaging technology for power semiconductors, which removes the need for bond wires, solders and thermal paste. The new SKiN technology is based on the use of a flexible foil and sintered connections. Current density is doubled to 3 A/cm2 compared with the 1.5 A/ cm2 achievable with standard wire bond technology. Converter volume can therefore be reduced by 35%. This reliable and space-saving technology is the optimum solution for vehicle and wind power applications.
TI's new digital power development kits, based on Piccolo microcontrollers, enhance performance
Bringing new efficiency and performance capabilities to digital power supplies, Texas Instruments announced three new development kits that further expand its TMS320C2000™ microcontroller (MCU) digital power portfolio of software, tools and training.
Intersil - Fisheye Lens Image Correction Technology
Intersil announced a new fisheye image correction technology, developed by the Intersil Techwell product group. This proprietary technology provides real-time correction of distorted video images generated by a fisheye lens' ultra-wide field of view, and delivers corrected images in a normalized rectangular output.
Educational Webcast Shows Engineers How To Overcome Embedded Design Challenges in Motor Control ADI's Motor Control webcast to broadcast May 18
Analog Devices will broadcast its Solving Embedded Design Challenges in Motor Control "webcast on May 18, 2011, at 17.00 GMT/18.00 CET. This 45-minute webcast is the latest tutorial in a monthly educational series by Analog Devices that covers a variety of design challenges for signal processing applications.
ARM Passes x86 and Power Architecture to Become The Leading MCU/eMPU Architecture in 2010
According to preliminary findings from the 2011 edition of Semicast's 32/64-bit Microcontrollers & Embedded Microprocessors study, ARM became the leading architecture for 32/64-bit MCUs/eMPUs in 2010.
Microchip Introduces Accessory Development Kits for Android
Microchip announces its Accessory Development Starter Kits for Android, which enable accessory development for Google's Android platform. Specifically, Android versions 2.3.4 and 3.1 and later include a new framework that allows apps to communicate directly with an accessory connected to a smartphone or tablet, via USB.
Cadence to Unveil OrCAD Capture Marketplace with Industry-first Online Apps; Puts a PCB Design ‘Universe’ at Engineers’ Fingertips
Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today unveiled OrCAD Capture Marketplace, a unique Web-enabled environment that brings a complete PCB ecosystem—including an industry-first online store for applications—to engineers' fingertips.
Quad Independent Resistor Networks with Guaranteed CMRR Matching of 0.005% from -40°C to 125°C
Linear Technology introduced the LT5400, its first family of precision matched resistors designed for high performance signal conditioning applications in difference amplifiers, precision dividers, references and bridge circuits.
NI Extends CompactRIO Platform With New Systems Built for Higher Volume Deployments
National Instruments (Nasdaq: NATI) has announced the release of the new NI cRIO-9075 and cRIO-9076 integrated chassis and controllers, which lower the cost of the NI CompactRIO platform for embedded control and monitoring applications.
Carbon Design Systems and MIPS Technologies Collaborate to Enable Virtual Platforms
Carbon Design Systems and MIPS Technologies (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores for digital, home, networking and mobile applications, announced today that they are collaborating to create and distribute virtual platform models of MIPS Technologies' processor intellectual property (IP) cores.
Explore the Latest Advances in Automated Test, RF Communications, and Measurement & Control at the 2011 Aerospace & Defence Forum Hosted by National Instruments UK & Ireland
Aeropace and defence engineers can learn more about the latest technologies and advances affecting their industry by attending the National Instruments Aerospace & Defence Forum, held at the Royal Air Force Museum, Hendon, London, on Thursday 9th June 2011.
Posedge selects EnSilica’s eSi-3250 processor for innovative 7-core Residential and SMB Gateway SoC
EnSilica, a leading independent provider of front-end IC design services, has announced that Posedge, a semiconductor intellectual property and solutions provider based in Sunnyvale (California, USA), has licensed its high-performance eSi-3250 32-bit processor core for an innovative, new Residential and SMB Gateway solution that performs Wire-Speed Routing at multi-gigabit rates. Posedge will initially use its next generation Residential and SMB Gateway processor in a 40nm SoC project it is currently developing for a customer. Posedge is using both EnSilica's Windows and new Linux-based toolchain to underpin the development process.
Freescale announces design contest, challenges engineers to ‘make it’ creative
Freescale Semiconductor today announced the Make It Challenge design contest, which is set to take place at the Freescale Technology Forum (FTF) June 20-23 in San Antonio, Texas. The contest will challenge attendees to develop and submit a unique sensor robotic or system design based on Freescale's latest sensor development kit in the form of a walking robot or the Freescale Tower System.
Repeaters from National Semiconductor Triple the Reach of PCI Express Gen-3 Standard
National Semiconductor introduced a new family of PCI Express (PCIe) Gen-3 (8 Gbps) repeaters that offer unprecedented signal conditioning performance and low-power consumption for data center servers and storage systems.
ARM Launches DS-5 Professional Edition And ARM Compiler V5.0
ARM today announced the release of v5.0 of the ARM Compiler, and the availability of the ARM DS-5 Professional Edition, which replaces the ARM RVDS toolkit as the reference software development toolchain for ARM processor-based ASICs and ASSP devices.
National Instruments Unveils NI LabVIEW for LEGO MINDSTORMS Robotics
National Instruments has introduced LabVIEW for LEGO MINDSTORMS, a new education-focused version of the company's professional LabVIEW graphical system design software. Developed specifically for secondary school students to use with the LEGO Education robotics platform in classrooms or competitions, LabVIEW for LEGO MINDSTORMS is a teaching tool that helps students visually control and program MINDSTORMS NXT robots, while learning the same software used by scientists and engineers.
