Renesas - LED Driver IC Design Support Tool to Simplify Design of LED Lamp Control Circuits
Lineup of six product versions for highly efficient control of a variety of circuit configurations
HDDs and Flash Memory: A Marriage of Convenience
This report examines a new storage architecture that has been named Paired Storage by the Storage Networking Industry Association - SNIA. Paired storage is the combination of flash memory with conventional rotating storage.
TI's development kit helps engineers quickly and easily design Bluetooth technology-enabled applications based on Stellaris microcontrollers
Kit merges Stellaris ARM Cortex-M3 MCU performance with TI's seventh-generation CC2560 Bluetooth solution to enable streaming audio, data transfers and other advanced capabilities.
Microchip simplifies global Smart Meter interoperability with DLMS User Association certified stack for PIC Microcontrollers
Microchip announces that it has partnered with Kalki Communication Technologies Ltd. (Kalkitech) to provide a Device Language Message Specification (DLMS) protocol stack that is optimised for 16-bit PIC® microcontrollers (MCUs). The DLMS protocol has become the worldwide standard among smart meter designers for interoperability among metering systems for different types of energy such as electricity, gas, heat and water; in residential, transmission and distribution applications; and over a wide range of communication methods such as RS232, RS485, PSTN, GSM, GPRS, IPv4, PPP and PLC; as well as for secure data access via AES 128 encryption.
ICSI-7 conference to be held in Leuven, Belgium, from Monday August 29 until Thursday September 1st 2011.
In addition, the Nagoya University, KULeuven and imec will organize the 2nd workshop "GeSn developments and future applications" as a satellite event on Friday September 2 in the same location.
Cognovo Software Defined Baseband chip released to Samsung Foundry 45nm Low Power process
Cognovo, the software defined modem developer, builds momentum with the successful tape out of a Software Defined Modem (SDM) device in Samsung Foundry's advanced 45nm LP (low power) process. The device – based on Cognovo's latest Modem Compute Engine (MCE) IP core, MCE160 – will enable licensees to develop soft modems in all cellular and wireless standards including WiFi, 2G, 3G, HSPA+, LTE and LTE-Advanced. Samples will be available to lead customers in the autumn.
Renesas Achieves 4X Faster Performance with Synopsys' HAPS FPGA-Based Prototyping Solution
Renesas Electronics Adopts HAPS-64 Systems and UMRBus in their EDA Teams for FPGA Prototyping Used by Multiple Design Groups.
Fairchild Semiconductor’s Class-G Headphone andClass-D Speaker Amplifiers Help Audio Designers Balance Audio Power Versus Battery Life
Fairchild has developed the FAB1200 stereo Class-G ground-referenced headphone amplifier with integrated buck converter, as well as the FAB2200 audio subsystem with stereo Class-G headphone amplifier and 1.2W Class-D mono speaker amplifier.
Premier Farnell and Micriµm sign global distribution agreement enhancing element14’s ‘knode’ interactive design automation hub
Premier Farnell and Micriµm sign global distribution agreement enhancing element14's 'knode' interactive design automation hub. Global agreement adds Micriµm's suite of OS, RTOS and Middleware products to the element14 knode, all available at the click of a button
TSMC Qualifies Magma's QCP Extractor for 28-nm Designs
Magma Design Automation today announced TSMC has included the QCP extractor in TSMC's quarterly EDA qualification report for 28-nanometer (nm) integrated circuits (ICs). This qualification gives designers additional confidence in using QCP to address the increasing complexity of ICs implemented in TSMC's 28-nm processes.
PLX and Avago Technologies Team-Up to Prove PCI Express over Fiber Optics at 64Gbps
PLX Technology and Avago Technologies announced a collaboration using optics to demonstrate PCI Express (PCIe) extending beyond its dominant role within the box to a cabled box-to-box solution. This higher-performance alternative is paving the road for next-generation data center applications where lower latency, lower cost, extended cabling distances, and I/O conversion minimization create simpler architectures for cleaner PCIe end-to-end environments.
Cadence Encounter Digital Flow Instrumental in Tapeout of Samsung 20-Nanometer Test Chip
Cadence today announced that technology leader Samsung Electronics, Co., Ltd. deployed the Cadence unified digital flow, from RTL to GDSII, to tape out a test chip at 20 nanometers. The Cadence Encounter-based flow and methodology were integrated to address the requirements of Samsung's advanced 20-nanometer process technology for the test chip. The flow handled IP integration and validation, as well as the complex design rules at 20 nanometers.
Synaptics Announces Groundbreaking InterTouch TouchPad Interface
Synaptics unveiled InterTouch at Computex. InterTouch is an open high speed interface standard that expands the capabilities of Image Sensing technology inside TouchPad and ClickPad equipped notebook PCs by enabling more sophisticated multi-touch gestures and highly accurate, multi-finger touch tracking, as well as providing enhanced suppression of inadvertent touch activations.
Tanaka Precious Metals and SUSS MicroTec to Jointly Develop Sub-micron Gold Particle Pattern Transfer and Bonding Technology
Tanaka Kikinzoku Kogyo K.K.(1) and SUSS MicroTec KK will begin joint development of pattern transfer and bonding technology using sub-micron sized (1/10,000mm) gold particles.
Synopsys - Critical Milestone in 20-nm Design Enablement Collaboration With Samsung Electronics
Synopsys announced that its design enablement collaboration with Samsung Electronics, Co., Ltd., a global leader in advanced semiconductor solutions, has achieved a critical milestone with the successful tapeout of the first 20-nanometer (nm) test chip based on Samsung's High-k metal gate (HKMG) process technology. The test chip was implemented using Synopsys' Galaxy™ Implementation Platform, including the Design Compiler® synthesis, IC Compiler place-and-route, In-Design physical verification with IC Validator, StarRC™ extraction and PrimeTime® signoff tools.
Temperature-to-Voltage Converter Measures - Remote Diodes with 1°C Accuracy
Linear Technology introduced the LTC2997, a high accuracy temperature-to-voltage converter with built-in series resistance cancellation for 2.5V to 5.5V systems. Many low voltage systems today rely on temperature to assess overall system health and reliability. Traditional implementations require a series of filters, a precise reference and a current source, resulting in a complex conversion scheme prone to inaccuracies if not carefully designed.
Synopsys and GLOBALFOUNDRIES Collaborate to Deliver Interoperable Process Design Kits (iPDKs)
Synopsys, Inc. a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that it has collaborated with GLOBALFOUNDRIES to jointly develop, validate, support and distribute interoperable process design kits (iPDKs) for GLOBALFOUNDRIES' mainstream and advanced process technologies. The GLOBALFOUNDRIES 65-nanometer (nm) iPDKs are available now with additional iPDKs planned for delivery later in 2011. The iPDKs have been fully validated with Synopsys' custom design solution, including the Galaxy Custom Designer® tool, HSPICE® circuit simulator, CustomSim™ circuit simulator, IC Validator physical verification tool and StarRC™ extraction tool.
Mentor Graphics Expands Verification Academy Portal with Additional UVM/OVM Content
Mentor Graphics announced that the Mentor Verification Academy website, which provides access to information and online training on advanced functional verification technologies, has been expanded to serve the growing information requirements of companies adopting the Universal Verification Methodology (UVM) and the Open Verification Methodology (OVM). The use of these methodologies has skyrocketed in recent years as they continue to deliver on the promise of improved design and verification productivity, verification data portability, and tool and verification IP (VIP) interoperability.
Top Electronics Products in the Last 30 Days...
From the thousands of product and technology searches conducted on the site each month, we bring you the most popular and searched for items from the last 30 days, with real-time stock levels and pricing info.
Point Grey and AMD Demonstrate HD Video Streaming over USB 3.0
Point Grey, a world leader in advanced digital camera products, and AMD, a global semiconductor innovator, jointly demonstrated uncompressed streaming HD video across USB 3.0 during AMD's A-Series APU official launch event in Seattle.
Cypress Brings USB 3.0 to Mobile Handhelds With New West Bridge Peripheral Controllers
Cypress Semiconductor Corp today introduced the industry's first USB 3.0 (SuperSpeed USB) solution specifically built to improve the performance of mobile handhelds. The new West Bridge Benicia (CYWB0263) peripheral controller is a highly optimized Data transfer Offload Engine (DtOE) that enables mobile devices to double the IOPS (Input/output Operations Per Second) throughput, stream high-definition video, "sideload" multimedia content at up to 200 MB per second, and reduce battery charging time by 50 percent with increased charging currents up to 900mA. The additional performance afforded by Benicia results in a state-of-the-art user experience.
TI achieves first Netflix HD certification, brings new streaming capabilities to Android devices
Texas Instruments has become the first partner to achieve the Netflix Silicon Reference Implementation (SRI) certification for the Netflix HD application on Android. TI's OMAP 4 platform, complete with M-Shield™ security technology, met the Netflix requirements for mobile content streaming, including the ability to run up to full high-definition (HD) 1080p video within strict security measures. This milestone reflects the strength of TI's M-Shield technology on the OMAP 4 platform and marks the first time Netflix has certified its 1080p streaming application with end-to-end protection on a mobile device.
Lattice - First PCI Express 2.0 Compliant Low Cost FPGA
Lattice Semiconductor announced that its LatticeECP3 FPGA family is compliant with the PCI Express 2.0 specification at 2.5Gbps. The LatticeECP3 FPGA and its PCI Express (PCIe) IP core passed PCI-SIG PCIe v2.0 compliance and interoperability testing for 1- and 4-lane configurations at a recent PCI-SIG workshop, ensuring that Lattice's solution is interoperable with existing PCIe 2.0 supported systems. Achieving this significant industry milestone enables cost and power reduction with higher reliability for 2.5Gbps PCIe v2.0 systems for communications, multimedia, server and mobile platforms, and adds to the broad range of design solutions from Lattice and its IP partners that support the widely adopted serial interconnect standard.
Microchip launches 60 MIPS Enhanced Core
Microchip just announced the 60 MIPS 16-bit dsPIC Digital Signal Controllers (DSCs) and PIC24 microcontrollers (MCUs). Based on the next-generation core, the 60 MIPS dsPIC33 and PIC24 'E' devices introduce more memory and higher integration compared to dsPIC DSCs and PIC24 MCUs with the previous-generation core. This includes 536 KB of Flash memory, 52 KB RAM, greater I/O capability with 144-pin packages, a USB 2.0 OTG interface, and expanded motor-control, graphics, audio, and real-time embedded-control capabilities.
Baolab uses its NanoEMS technology to create ultra-low cost 3D Digital MEMS Compasses in CMOS
Until now, 3D Compasses have typically used non-standard technologies such as magneto-resistive materials or Hall-effect structures combined with magnetic field concentrators to detect the direction of the Earth's magnetic field. Baolab Microsystems is first to design a pure CMOS Lorentz force MEMS sensor and, as a result, its new 3D Digital NanoCompass™ matches performance benchmarks for sensitivity, power consumption and package size, but at a dramatically lower cost. An additional unique feature resulting from this integration is that the device auto-calibrates to maintain consistent accuracy.
Mini-ITX with QM67 chipset supports 2nd generation Core i7/i5/i3 Mobile CPUs
The LV-67H Mini-ITX motherboard is the latest addition to BVM Group's extensive range of the popular 170mm square format. The impressive computing power of the unit, combined with its extensive I/O capability and lower power consumption makes it ideal for demanding applications. Typical uses are in industrial control and automation, gaming machines, kiosks, medical instruments, video security surveillance server, print imaging and digital signage and other areas where a powerful engine is needed.
Molex Antenna Business Unit Joins Forces with Aalborg University to Conduct 4G LTE Measurements
Collaboration between Molex and Aalborg University yields realistic 4G LTE measurements aimed at improving data connections for better mobile surfing in the future - Molex Incorporated has announced that researchers from Aalborg University and antenna experts from Molex are conducting measurements in dense environments to ensure realistic results. The indoor experiments conducted in downtown Aalborg with prototypes of next generation LTE mobile phones will help give consumers better data connections to the portable devices of the future.
Laird Technologies Publishes Common Mode Choke Application Note
Topic Discusses How Common Mode Choke Filtering Improves CMRR in Ethernet Transformer Applications - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the publication of its newest application note titled "Common Mode Choke Filtering Improves CMRR in Ethernet Transformer Applications".
Metro Network Services Launches Turn-Key Optical Networking Systems Integrator Solutions
Providing Fully Integrated Optical Network Planning, Design and Construction for the Enterprise, Financial, Wireless and Carrier Markets - Metro Network Services (Metro|NS), a leading optical network planning, design, construction and maintenance firm, announces today the launch of its optical networking systems integrator solutions. With the ability to build, design and manage optical networks, Metro|NS offers full, turn-key solutions for both enterprise and telecommunications companies looking to build optical networks. Led by the former management team of Lexent Metro Connect, Metro|NS executives have extensive, optical layer knowledge as well as proven proficiency as a construction firm.
Power switches from Diodes Inc enhance USB port protection
Ensuring fast and accurate latching-off of output current in the event of over current detection, the AP2401 and AP2411 single channel power switches from Diodes Incorporated are designed to help raise USB port protection levels. These 2A rated, high-side power switches provide a choice of active low enable and active high enable operation and are optimized for self-powered and bus-powered USB 2.0 and 3.0 and other 3-5V hot-swap consumer electronics applications.
ON Semiconductor and Stegia collaborate to bring ultra small smart motor solutions to market
ON Semiconductor and leading Nordic motor supplier Stegia have announced that ON Semiconductor's AMIS-30624 2-phase stepper motor driver, with built-in position controller and I2C serial interfacing, has been incorporated into Stegia's stepper motor product line. This enables the creation of highly compact motor systems with next generation functionality.
Microchip brings advanced control to cost-sensitive designs
Microchip just announced a new series of 16-bit PIC microcontrollers (MCUs) and dsPIC Digital Signal Controllers (DSCs) that bring advanced control to cost-sensitive general purpose and motor-control designs. The new devices enable low-cost, sensor-less motor control designs, with support for a wide range of motor-control algorithms, plus an on-chip Charge Time Measurement Unit (CTMU), 10-bit Analogue-to-Digital Converter (ADC) and mTouch™ capacitive touch sensing to enable intelligent sensor applications. The devices are supported by three new Plug-In Modules (PIMs) and a single-board Motor Control Starter Kit that includes capacitive-touch sliders and an onboard BLDC motor. This makes it easy for designers to create high-performance appliances, such as washing machines, medical products such as infusion pumps, and industrial AC-induction motors, as well as other cost-sensitive applications.
Mouser’s Library of Product Knowledge Training Sites exceeds 1,000 - Design engineers benefit from easy-to-access data on newest products and applications.
Mouser announced it has surpassed more than 1,000 Product Knowledge training sites that focus on the newest products and technologies.
Saelig - Versatile Serial Camera Module Transfers Camera Images via Serial or NTSC
Saelig announces the availability of the C429-RS232 - a highly integrated, compact serial and encoded video camera module which can be attached to any host system requiring an economical video or still camera for embedded imaging applications. The module uses an OmniVision CMOS MT9V011 VGA color sensor, matched with a versatile Vimicro VC0706 control chip to provide a complete low cost, low power camera system. The C429-RS232 has an on-board RS232 serial interface for direct connection to any host PC system with a COMport for control or image communication. Video output in NTSC or PAL is also simultaneously provided.
Picochip and InterDigital demonstrate converged gateway with integrated 3G femtocell and Wi-Fi at Femtocells World Summit 2011
Policy-aware access point combines Wi-Fi and Femto for managed data offload - Picochip and InterDigital are collaborating on delivering advanced broadband traffic management solutions across cellular femtocells with embedded Wi-Fi access. During the Femtocells World Summit 2011 in London both companies successfully demonstrated how InterDigital's converged gateway technology, integrated on Picochip's 3G femtocell with Wi-Fi, delivers novel offloading solutions by intelligently managing data flows across multiple physical transports or networks and simultaneously enhances the overall user experience.
Synopsys Announces Immediate Availability of Reprogrammable Non-Volatile Memory IP in 180-nm CMOS Process Technology
DesignWare AEON Embedded Non-Volatile Memory IP Improves Electrical Performance and Lowers Integration Risk for Wireless and Analog SoC Designs - Synopsys, Inc. , a world leader in software and IP for semiconductor design, verification and manufacturing, today announced the immediate availability of DesignWare® AEON® Non-Volatile Memory (NVM) IP for multiple 180-nanometer (nm) process technologies. The DesignWare AEON NVM IP products include few-time programmable (FTP), multiple-time programmable (MTP) radio-frequency identification (RFID) and erasable programmable read-only memory (EEPROM) IP solutions. Synopsys offers DesignWare AEON NVM IP for leading process technologies in more than 100 different memory configurations, all qualified to the appropriate industrial specifications. Implemented in standard CMOS process technology with no additional mask or process steps required, the DesignWare AEON NVM IP is ideal for wireless, RFID and analog and mixed-signal SoC designs.
Movea unveils full body motion capture and gesture recognition system with 9 axis IMU Body Area Network -Low cost, wireless MotionPods with SmartMotion™ technology prove valuable for gaming and sports applications
Movea now enables full body gesture recognition with its recently launched MEMS-based MotionPod solution for low cost, full body motion capture. The solution can be used to enable more realistic avatar motion for gaming or highly accurate biomechanical analysis for sports applications and is now available for B2B customers in the sports and entertainment markets.
TI high-temperature H.E.A.T. evaluation module speeds safe testing of electronics for harsh and hot environments
Texas Instruments has the H.E.A.T. (harsh environment acquisition terminal) evaluation module (EVM), the industry's first high-temperature data acquisition system, which includes a complete set of TI signal chain components qualified for extreme temperature operation from -55ºC to 210ºC. The H.E.A.T. EVM is test-oven ready and qualified to operate up to 200 hours at oven temperatures of up to 200ºC. It accepts eight channels of analog data and conditions, digitizes and processes these signals for a variety of applications in ruggedized, high-temperature environments including downhole drilling, jet engines and heavy industrial applications.
SST and INSIDE Secure enter design partnership - Agreement provides access to third-generation Superflash embedded NVM technology
Silicon Storage Technology and INSIDE Secure today announced the two companies have entered into a design partnership agreement to utilize third-generation Superflash embedded flash memory technology (ESF3). Through this agreement, INSIDE Secure will work in partnership with SST to design and introduce numerous nonvolatile flash memory macrocells based on the proprietary SST split-gate flash memory cell as part of the technology migration for future INSIDE secure microcontrollers products.
Emerson Network Power Showcases Industry's Latest COM Express Computing Modules Powered by Freescale QorIQ Processors
Attendees of the Freescale Technology Forum Americas 2011 this week can see the latest COM Express embedded computing modules powered by Freescale Semiconductor QorIQ processors. Emerson Network Power, a business of Emerson and the global leader in enabling Business-Critical Continuity, is announcing the COMX-P3041, COMX-P4040 and COMX-P5020 modules at this renowned industry event.