Tech News

Murata improves acoustic characteristics of world’s thinnest piezoelectric speaker

Murata improves acoustic characteristics of world’s thinnest piezoelectric speaker

Murata has announced it has enhanced the audio characteristics of its ultra thin piezoelectric speaker. Measuring just 0.5 mm in thickness, the VSLBP2115E1100 series is believed to be the world's smallest piezoelectric speaker. By optimizing the product's structure and the use of new materials it has been possible to reduce distortion and increase sound pressure level without any change in the speaker's size. Distortion has been reduced by 50 % in the voice frequency region of 2 to 4 kHz. Sound pressure improvements have been made in the low frequency regions of 1 kHz and below.

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TI - 10 new Bluetooth low energy profiles for rapid design of consumer medical, fitness, alert applications and more

Texas Instruments Incorporated, the industry leader in highly integrated wireless connectivity solutions, today launched ten Bluetooth® low energy technology (Bluetooth v4.0) profiles with associated sample applications to boost market development of Bluetooth low energy-compliant sensor devices. The Bluetooth low energy application software is a part of TI's BLE-Stack, and is available royalty-free to all using TI's CC2540 Bluetooth low energy system-on-chip (SoC). TI's BLE-Stack is available today at www.ti.com/ble-pr-eu, and a corresponding CC2540DK-MINI development kit is available on TI's e-store. An enhanced, new CC2540DK development kit will also be available in mid September, providing a flexible platform for software development, extensive RF performance assessment and packet-sniffing testing.

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Dialog Semiconductor's DA6011 Power Management IC - Ideal Companion For INTEL ATOM Processor E6XX-Based Designs

Dialog Semiconductor has announced its companion IC for the Intel Atom processor E6xx series, DA6011, has been adopted by Taiwan based ADLINK Technology for its mini size COM Express type 10 module, nanoX-TC. Measuring just 84x55 mm the nanoX-TC is among the smallest computer-on-modules available.

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GOEPEL electronic - New Test and Programming Strategies for Texas Instruments DaVinci Media Processors

GOEPEL electronic, world-class JTAG/Boundary Scan vendor, has developed special VarioTAP® IP's for TI's DaVinci Digital Media Systems-on-Chip (DMSoC) for the TMS320DM3xx series. The solution enables the utilisation of dynamic processor emulation tests for detection and diagnosis of faults on board and at system level, supporting an ultra-fast programming of connected memory media. The user benefits are a significant increase in fault coverage and savings in additional investments for other test and programming equipment. The preconfigured IPs covers all DMSoC interfaces up to real-time tests of the communication interfaces.

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Microchip - Utility-band Power-Line Soft-Modem development kit

Microchip - Utility-band Power-Line Soft-Modem development kit

Microchip announces the Power-Line Modem PICtail Plus Daughter Board Development Kit (AC164145) for the utility frequency band. The kit supports the development of products which communicate using the same wiring that provides power, allowing instant networks to be created at low system and deployment costs. The kit provides communication over power lines using a Binary Phase Shift Keying (BPSK) modulation scheme, with the on-board modem using the CELENEC A utility frequency baseband of 72 kHz, for communication at a rate of 6 kilobits per second (kbps). In addition, the modem hardware is compatible with the universal power-line, and can operate on 110V or 220V electrical systems. The soft modem is based on the scalable dsPIC33F Digital Signal Controller architecture and interfaces with Microchip's Explorer 16 Development Board. It is supported with royalty-free schematics, demo code and software in source-code format.

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IAR Systems delivers hardware debug integration for TMS570 family

IAR Systems delivers hardware debug integration for TMS570 family

IAR Systems today announced XDS100v2 emulator debug support for Texas Instruments' TMS570 microcontroller family in IAR Embedded Workbench. The XDS100v2 integration enables software applications to be debugged on hardware in real-time using the IAR C-SPY debugger.

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Fujitsu - Single-Chip Solution for Automotive Hybrid Instrument Clusters

Fujitsu - Single-Chip Solution for Automotive Hybrid Instrument Clusters

Fujitsu Semiconductor Europe announced the expansion of its scalable line-up for instrument clusters, covering the range from MCUs for traditional clusters up to 3D graphic SoCs with the capability of driving virtual or free programmable clusters.

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Silicon Labs Targets Next-Generation TV Tuner IC For Massive China TV Market

Silicon Laboratories today introduced a silicon TV tuner solution designed to provide an optimal balance of affordable cost and high performance for TV makers in China and Taiwan. The new Si2155 TV tuner IC extends Silicon Labs' field-proven and industry-leading silicon TV tuner architecture into high-growth emerging markets for digital TVs and set-top box (STB) products.

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GALEP-5 Universal Device Programmer from Conitec

GALEP-5 Universal Device Programmer from Conitec

GALEP-5 is a new, diminutive, palm-sized programmer with a 60,000 device output. Its high speed allows it to double as a fast production programmer in ganged arrays, while its JTAG debugging capabilities enable GALEP-5 to be used for microcontroller development.

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TI - Bipolar, 12-bit, 1-MSPS, 4- and 8-channel SAR ADCs for industrial process control, data acquisition

TI - Bipolar, 12-bit, 1-MSPS, 4- and 8-channel SAR ADCs for industrial process control, data acquisition

Texas Instruments introduced two new bipolar, 12-bit, 1-MSPS successive approximation register (SAR) analog-to-digital converters (ADCs) for programmable logic control (PLC) and data acquisition. The 4-channel ADS8634 and 8-channel ADS8638 provide the widest temperature range available for demanding industrial measurement applications up to 125 degrees and are fully characterized over the extended industrial temperature range. They also allow an input range of ±12 V, an improvement of 20 percent over the competition, when used with an external reference. For more information and to order samples, visit www.ti.com/ads8634-preu.

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TI announces mobile app for iPhone and Android users

TI announces mobile app for iPhone and Android users

Texas Instruments has announced the availability of its mobile app for the Apple iPhone and Android-powered smartphones, making it the first semiconductor supplier to offer both a mobile app and a mobile-optimized website for designers to explore the company's portfolio of products and system solutions. The app, which is free on both platforms, allows users to search for TI products using a TI part number or that of a competitor, or browsing by product family to view descriptions, specifications, features, and pricing information.

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Mouser Electronics partners with Young Designers for University Science & Engineering Initiatives

Mouser Electronics is helping develop new programs to support young design engineers with the challenges of designing "what's next." These educational programs encourage technical free-thinking and innovation in design. Two programs that stand out are the WMR Rescue Robot Project and the UCLA Rocket Project.

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Design Concept for Transformer-less Solar Inverter application support information for transformer-less single phase solar inverters

Vincotech is able to offer a wide spectrum of power modules for solar applications.

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ON Semiconductor enhances sharing of multimedia content with new high speed 3:1 USB Mobile High Definition Link switch

ON Semiconductor enhances sharing of multimedia content with new high speed 3:1 USB Mobile High Definition Link switch

ON Semiconductor, a premier supplier of high performance silicon solutions for energy efficient electronics, has introduced the NCN1188, the industry's first 3:1 high speed USB switch with the capacity to support the new Mobile High Definition Link (MHLTM) interface standard for High Definition (HD) video and digital audio.

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Microchip - Analog Resistive USB Touch-Screen Controller available as turnkey chip or board product - Free drivers for most major operating systems

Microchip - Analog Resistive USB Touch-Screen Controller available as turnkey chip or board product - Free drivers for most major operating systems

Microchip has launched the mTouch AR1100 Analog Resistive USB Touch-Screen Controller. Building upon the AR1000 Analog Resistive Touch-Screen Controller series, the AR1100 controller is a high-performance, USB plug-and-play device that offers advanced calibration capabilities as a USB mouse or single-input digitizer. The new controller is available as a turnkey chip or board product, supporting all 4-/5-/8-wire touch screens, with free drivers for most major operating systems. The AR1100 is an ideal solution for customers who want a drop-in touch controller to universally support their entire standard resistive-touch portfolio.

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TT electronics Qualifies an Increased Range of Sulphur Resistant Components

TT electronics Fixed Resistors business unit today announced that it is now able to offer a superior range of components qualified for use in sulphur rich environments. The TT electronics portfolio of chip resistors and resistor arrays is ideal for use in applications such as road side systems, telecommunications equipment, industrial control, automotive and manufacturing processes such as wine production where sulphur bearing gases can corrode similar un-qualified devices.

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Fairchild Semiconductor’s Single and Dual Comparators Help  Solve Supply Chain Management Challenges; Standardises  Multiple SourcesSolution Enables Different Audio Jacks to be Used in Same Device

Fairchild Semiconductor’s Single and Dual Comparators Help Solve Supply Chain Management Challenges; Standardises Multiple SourcesSolution Enables Different Audio Jacks to be Used in Same Device

Purchasing managers and supply chain management are faced with many challenges. Among them – the need to ensure they have a constant, reliable source for the devices they need. Working closely with a key customer, Fairchild Semiconductor, a leading global supplier of high performance power and mobile products, developed the FAN156 low voltage comparator and the FAN256 dual low voltage comparator to provide supply chain flexibility.

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Renesas Electronics Announces V850 Microcontroller Demonstration Platform for Continua-Certified Blood Glucose Meter Agent

Renesas today announced the availability of a Continua® demonstration platform based on the Renesas Electronics V850 energy-efficient microcontroller (MCU) with certified Continua Blood Glucose agent software. Implementing a blood glucose meter as defined by the Continua Health Alliance, the platform shows how the V850 MCUs implement complete software functionality at a level of power efficiency that ensures long battery life. As medical devices such as blood glucose meters gain enhanced connectivity in compliance with Continua guidelines, the energy-efficient V850 MCUs, at about 350uA/DMIPS with up to 1 megabyte (MB) of Flash memory and integrated USB function support, make it possible to handle the added software load without sacrificing the long battery life that end users have come to expect. Low-power, high-performance microcontrollers enable Continua healthcare devices to store time-stamped measurements and automatically send the data to healthcare professionals. By eliminating the error-prone process of manually collecting such measurement data, Continua devices help improve the quality of medical data and of the diagnosis.

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Going spare: boosting voltage using spare MCU peripherals

Going spare: boosting voltage using spare MCU peripherals

With a few discrete components and some creative thinking, spare microcontroller peripherals can be used to provide a low-current, regulated voltage boost, as Keith Curtis, Technical Staff Engineer, Microchip Technology Inc. explains.

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Xentrotec selects the LatticeECP3 FPGA Family For Multi-Channel HD Video Multiplexer And HD-DVR Solutions

Xentrotec selects the LatticeECP3 FPGA Family For Multi-Channel HD Video Multiplexer And HD-DVR Solutions

Lattice Semiconductor has announced that XENTROTEC CO., LTD., Seoul, Korea, has chosen the mid-range LatticeECP3 FPGA for use in its digital video recorder (DVR) solution. XENTROTEC, which recently introduced its new multi-channel HD video multiplexer and HD digital video recorder solution at ISC WEST 2011, selected the LatticeECP3 FPGA over competing FPGAs and application-specific alternatives because the LatticeECP3 device's built-in transceivers, high-speed memory controllers and HD-SDI capability met the rigorous end market requirements for superior DVR video and image processing performance.

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Shrinking Chip Geometry for Maximum Returns

Shrinking Chip Geometry for Maximum Returns

Recently two competing semiconductor companies, each one producing ICs in high volumes, chose significantly different process nodes for new system-on-chip products targeting the same application. How did the two reach an almost identical unit price, and which one has achieved the best result overall?

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Microsemi Announces Availability of Intrinsic-ID’s Security IP on its Flash-based cSoCs, FPGAs and Development Boards

Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the immediate availability of Intrinsic-ID's Quiddikey security intellectual property (IP) on its flash-based devices and development board including the SmartFusion® customizable system-on-chip (cSoC), as well as ProASIC®3, IGLOO® and Fusion FPGAs.

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Baker Solar Is Set to Revolutionize Wet Process Development

Baker Solar, a division of M.E. Baker, introduces FlexTool, an inline wet bench conceived and designed specifically for the R&D and pilot-scale requirements of today's wafer and cell manufacturers. In the dynamic world of process development, Baker Solar understands that PV companies need highly flexible tools to handle a variety of wet chemistries through a range of single- and double-sided applications. FlexTool does precisely that.

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Greenpeak Launches Zigbee RF4CE USB Stick

Greenpeak Launches Zigbee RF4CE USB Stick

GreenPeak Technologies, a leading fabless semiconductor company, today announced the first reference design for an RF4CE USB stick for the integration of RF4CE technology in PC's and home entertainment applications like set-top boxes, TV's and media players.

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HiSilicon Licenses ARM Technology for use in Innovative 3G/4G Base Station, Networking Infrastructure and Mobile Computing Applications

ARM has announced that HiSilicon, a leading supplier of ASICs and solutions for communication networks and digital media, has licensed a range of ARM IP for use in 3G/4G base stations, networking infrastructure, mobile computing and power management applications. The broad agreement includes licences for the high performance, energy efficient ARM Cortex™-A15 MPCore™ processor, ARM CoreLink™ CCI-400 Cache Coherent Interconnect fabric IP and the ARM Cortex-M3 processor

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Data I/O Corporation Introduces New RoadRunner3 Inline Programming System

Data I/O Corporation Introduces New RoadRunner3 Inline Programming System

Data I/O Corporation today announced the new RoadRunner3 inline programming system, the next generation of the world's only just-prior-to-placement programming solution. With its Factory Integration Software (FIS), RoadRunner3 streamlines the production process and eliminates operator errors through its connection to a firm's manufacturing execution system (MES) or other shop-floor control software and through that connection all the way to the firm's enterprise resource planning (ERP) system.

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mimoOn integrates LTE PHY software on Texas Instruments' new system-on-chips for small cell base stations

mimoOn, a pioneer in LTE software licensing for Software Defined Radio (SDR) platforms, has announced its collaboration with Texas Instruments (TI) for 3GPP compliant LTE PHY software. TI will offer complete PHY software for LTE Release 8 and 9 for its' KeyStone multicore architecture, with a specific focus on its newest TMS320TCI6612 and TMS320TCI6614 System-on-Chips (SoCs). These SoCs are especially designed for small cell base stations in the enterprise, pico and metro markets.

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Cypress and UMC Deliver ICs On New 65-Nanometer SONOS Embedded Flash Technology

Cypress Semiconductor and United Microelectronics Corporation announced that they have produced working silicon on a new, 65-nanometer SONOS (Silicon Oxide Nitride Oxide Silicon) technology for embedded Flash memory. UMC will manufacture next-generation PSoC® programmable system-on-chip products for Cypress on the new process, along with nvSRAMs and other products. UMC will also make this technology available to other companies under a licensing agreement with Cypress.

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STMicroelectronics and the BioRobotics Institute of Scuola Superiore Sant’Anna Establish a Joint Lab to Develop Advanced Robots and Smart Systems to Make a Difference in Life

STMicroelectronics and the BioRobotics Institute of Scuola Superiore Sant’Anna Establish a Joint Lab to Develop Advanced Robots and Smart Systems to Make a Difference in Life

STMicroelectronics and Scuola Superiore Sant'Anna of Pisa, a world center of excellence in advanced robotics and one of Italy's most prestigious universities, have today announced the creation of a joint laboratory for research and innovation in bio-robotics, smart systems and microelectronics.

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Toshiba makes optical isolation selection quick and easy with new guide.

Toshiba makes optical isolation selection quick and easy with new guide.

Toshiba Electronics has announced the availability of a free guide for engineers looking to build galvanic isolation and noise protection into their designs using photocoupler-based technology. The new 80-page Photocouplers and Photorelays Product Guide will speed the identification, comparison and selection of photocouplers such as high-speed photo-IC couplers, phototransistor couplers, phototriac couplers, photovoltaic couplers and photorelays.

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IDT’s Patent Pending HyperGear Technology Reduces Motherboard Power Consumption and Boosts CPU Performance Simultaneously

IDT’s Patent Pending HyperGear Technology Reduces Motherboard Power Consumption and Boosts CPU Performance Simultaneously

Integrated Device Technology announced that it has developed a power savings and performance enhancement architecture for high frequency voltage regulator designs targeted at computing applications. The new patent pending "HyperGear" technology dynamically adjusts the CPU voltage, peripheral bias voltage, and CPU clocking frequency based on the CPU usage demand and can provide more than 10% efficiency improvement while simultaneously boosting CPU performance. This new technology saves significant power and cooling costs in cloud-based datacenter environments and extends battery life in portable applications.

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Wolfson claims world’s-first Audio System-on-a-Chip

Wolfson has announced the WM5100, said to be the world's first Audio System-on-a-Chip (SoC), integrating a high performance, low power, multi-channel Audio Hub, with full transmit path (Tx) noise cancellation, receive path (Rx) noise cancellation and Wolfson's class-leading myZone(tm) adaptive Ambient Noise Cancellation (ANC) technology in one device.

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Microsemi Announces SmartFusion cSoC Support with FreeRTOS

Microsemi Corporation today announced its SmartFusion customizable system-on-chip (cSoC) devices are now supported by FreeRTOSTM (www.freertos.org), a scale-able real time kernel designed specifically for small embedded systems, and can be used in any type of application.

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RFMD Announces availability of new pHEMT process technologies for foundry customers

RF Micro Devices, Inc. , a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced its Foundry Services business unit has expanded its portfolio of process technologies to include two additional GaAs process technologies – RFMD's FD25 low noise pHEMT process and RFMD's FET1H switching pHEMT process. The two additional GaAs pHEMT process technologies are available immediately to foundry customers.

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Silicon Labs Introduces Industry's Most Advanced Slic Solution for Voice-over-IP Gateways

Silicon Labs Introduces Industry's Most Advanced Slic Solution for Voice-over-IP Gateways

Silicon Laboratories today announced the industry's most integrated, cost-effective and power-efficient subscriber line interface circuit (SLIC) solution for voice-over-IP (VoIP)gateways. The new Si3226x Dual ProSLICR family delivers the smallest bill of materials and board area and the lowest power consumption of any dual SLIC available. The Si3226x family provides an ideal solution for low-channel-count VoIP customer premises equipment (CPE) such as fiber to the home (FTTH) gateways, DSL integrated access devices and cable embedded multimedia terminal adaptors (EMTAs), as well as high-channel-count products including multiple-dwelling-unit gateways and PBX systems.

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Zarlink Accelerates Customer Design Time with Programmable Service for ClockCenter Products

Zarlink Semiconductor introduced a new service that allows equipment designers to customize the company's recently released ClockCenter free-run clocking products to meet specific application requirements. With this new level of customization, Zarlink's customers can simplify and accelerate design to speed time-to-market for new equipment.

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Hynix and Toshiba Sign Joint Development for MRAM

Hynix Semiconductor and Toshiba Corporation today announced that they have agreed to strategic collaboration in the joint development of Spin-Transfer Torque Magnetoresistance Random Access Memory (MRAM), a fast emerging next generation memory device. Once technology development is successfully completed, the companies intend to cooperate in manufacturing MRAM products in a production joint venture. Hynix and Toshiba have also extended their patent cross licensing and product supply agreements.

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Datalight Announces Initiative to Support Latest JEDEC eMMC Standard

Datalight announced an initiative to provide software support for JESD84-B45, Embedded Multi-media Card (e•MMC), Electrical Standard (4.5 Device), just published by JEDEC, enabling device manufacturers and their customers to make full use of the performance characteristics inherent in flash memory.

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eASIC Announces easicopy ASIC

eASIC Corporation today announced the immediate availability of "easicopy", an ASIC migration product that provides custom chip designers with a simple, low-risk migration path from eASIC Nextreme and Nextreme-2 NEW ASICs to cell-based ASIC devices.The addition of easicopy™ enables OEMs to continue to innovate and quickly ramp to volume production using eASIC Nextreme series devices, and now migrate to lower cost easicopy™ cell-based ASIC when designs ramp to extremely high volumes.

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Renesas Selects Wind River FAST for Android Software Testing

Wind River announced Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has selected Wind River Framework for Automated Software Testing (FAST) to test Renesas Electronics' Cortex-A9-based system-on-chip (SoC) platform for Android-based smartphones and consumer products. Wind River FAST for Android is a fully automated software testing solution that assists silicon vendors, device manufacturers and mobile operators in improving the software quality of their Android implementations and test performance, compliance and device user interface and user experience.

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