ARM and Cadence Achieve Industry Milestone with Tape Out of 20nm ARM Cortex-A15 MPCore Processor
ARM and Cadence Design Systems, Inc. announced the tape out of the industry's first 20nm design based on the ARM Cortex-A15 MPCore processor. The test chip, targeting TSMC's 20nm process, was jointly developed by engineers from ARM, Cadence and TSMC using a Cadence RTL-to-signoff flow. Today's milestone announcement is the result of an 18 month collaboration between ARM and Cadence on optimised design flows for the Cortex-A15 processor.
Point Grey Launches SuperSpeed USB 3.0 Flea3 Camera
Point Grey, announced another innovation in imaging with the release of its new Flea3 USB 3.0 camera series. Measuring just 29 x 29 x 30mm, the FL3-U3 is the smallest USB 3.0 camera in the world and is designed specifically for the demanding requirements of machine and computer vision applications. The first available models are based on monochrome and color versions of the Sony IMX036, a high-quality CMOS sensor capable of generating 3.2 megapixel images at 60 FPS.
Cadence Library Characterization Scripts Now Available in New TSMC Reference Kit
Cadence Design Systems, Inc. today announced that it has collaborated with TSMC to provide mutual customers access to a library characterization reference kit. The Cadence Library Characterizer (Altos Liberate) reference kit for TSMC's standard cell libraries is now available to TSMC customers for download on TSMC-Online.
Eurotech EverywareT Software Framework Deployed on Wide Portfolio of M2M Hardware Platforms
At CTIA Wireless, Eurotech will demonstrate the new DynaVIS rugged display computer, based on Intel AtomT processor, which is one of a broad portfolio of hardware platforms designed to enable machine-to-machine (M2M) communications in a variety of environments. While the Everyware Software Framework (ESF) simplifies development and debugging of application software, hardware options allow OEMs and enterprises to choose the M2M platform that delivers exactly what their business environment requires.
Keithley Publishes CD on High Performance Source Measurement Solutions
Keithley Instruments, Inc., Inc., a world leader in advanced electrical test instruments and systems, has published an informative CD entitled, "Configuring Cost-Effective, High Performance Sourcing and Measurement Solutions." A free copy is available upon request from Keithley at: http://www.keithley.com/promo/pr/092
36V, 4A Synchronous Step-Down Regulator Now Offered in High Temperature “H” Grade & High Reliability “MP” Grade
Linear Technology announces the high temperature (H-grade) and High Reliability (MP-grade) versions of the LT3690. This 36V input capable, synchronous step-down switching regulator can deliver up to 4A of continuous output current at efficiencies as high as 93%. The LT3690 operates within a VIN range of 3.9V to 36V, and offers transient protection to 60V, making it well suited for load dump and cold-crank conditions found in automotive applications.
New Vishay Foil Resistors Company Demonstration Highlights ESD-Withstanding Capabilities of Bulk Metal Foil Resistors
Vishay Precision Group today unveiled a new video that presents a demonstration of the ESD-withstanding capabilities of two resistor technologies: thin film and Bulk Metal Foil. Using an ESD testing system and 10 kilohm 1206 resistors, the demo shows that, while a single 3,500 V ESD pulse results in a relatively minor 1520 ppm resistance change to a thin film resistor, it also causes several cracks to its resistive element under the external coating. The Bulk Metal Foil resistor, however, experiences no change in resistance or latent defects even after 10 pulses of 3,500 V in rapid succession. Hidden ESD damage results in early-life failures during use and constitutes significant reliability risks in equipment.
Test Interface Boards – Multitest Meets Today’s Fine-Pitch Requirements
Multitest announces that the Santa Clara board fab has refined its pulse plating process to integrate it into Multitest's fabrication process to further enhance the high aspect ratio capability. The integration is a result of the Santa Clara board fab anticipating the market trend for chip scale packages, particularly for fine-pitch array packages such as BGAs or LGAs.
Altera Embeds Synopsys' Virtual Prototyping Technology in New ARM-based SoC FPGA Offering
Synopsys, Inc. today announced the use of its comprehensive and proven Virtual Prototyping Solution in Altera Corporation's newly announced SoC FPGA Virtual Target software development platform. The Virtual Target enables engineers to begin writing software for systems based on Altera's SoC FPGAs months before hardware availability, reducing development time and costs. Altera chose to leverage Synopsys' Virtual Prototyping Solution due to its comprehensive and proven technology, highly productive debugging and analysis tools for multicore platforms and broad model portfolio, which includes transaction-level models of the ARM® Cortex™-A9 processor and Synopsys DesignWare® IP.
IntegrIT’s DSP Math Library Now Available for Tensilica’s Baseband DSPs
Tensilica, Inc. today announced that the NatureDSP Math Library from IntegrIT DSP Design House, a leading supplier of DSP (digital signal processing) software solutions, is now available for Tensilica's ConnX BBE16 baseband DSP for system-on-chip (SOC) design.
Deeter add Modbus Gateway Integration to Wireless Sensor System
The Deeter Group, has added a Wireless Modbus Gateway to its range of Wireless Sensor Network products. Any users of Modbus communication protocols will find the new Deeter Wireless Modbus Gateway is a simple and cost effective way to connect a Deeter Wireless Sensor network to a Modbus system to monitor physical or environmental conditions, such as liquid levels, temperature, humidity, vibration, pressure and proximity.
Imec unveils innovative technology for an ECG patch, combining an ultralow-power ECG SoC with Bluetooth Low Energy
Imec and Holst Centre announce an innovative body patch that integrates an ultra-low power electrocardiogram (ECG) chip and a Bluetooth Low Energy (BLE) radio. This unique combination fuses power-efficient electronics and standardized communication, opening new perspectives for long-term monitoring in health, wellness and medical applications. The system integrates components from imec and Holst Centre's Human++ R&D program.
Imec demonstrates CMOS integrated poly-SiGe piezoresistive pressure sensor
Imec realized an integrated poly-SiGe-based piezoresistive pressure sensor directly fabricated above 0.13 µm copper (Cu) -backend CMOS technology. This represents not only the first integrated poly-SiGe pressure sensor directly fabricated above its readout circuit, but also the first time that a poly-SiGe MEMS device is processed on top of Cu-backend CMOS.
Imec demonstrates extremely high-speed heterojunction bipolar transistors
Imec realized a fT/fMAX 245GHz/450GHz SiGe:C heterojunction bipolar transistor (HBT) device, a key enabler for future high-volume millimeter-wave low-power circuits to be used in automotive radar applications. These HBT devices also pave the way to silicon-based millimeter wave circuits penetrating the so-called THz gap, enabling enhanced imaging systems for security, medical and scientific applications
Energy Micro awarded ISO 9001:2008 certification
Energy Micro has announced it has gained ISO 9001:2008 registration of its quality management system for the design and manufacture of its range of energy friendly microcontrollers and RF radios. The certificate of registration to the quality standard was awarded to Energy Micro by the certification body Det Norske Veritas (DNV).
Imec produces high-quality EUV sensors for ASML’s next-generation lithography tools
Imec announces that it has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field, improving the tools' overlay and critical dimension (CD) tool performance. With this milestone achievement, imec confirms that its CMORE business line is ready to provide its partners with custom specialty chip solutions.
GOEPEL electronic demonstrates IJTAG (IEEE P1687) support in SYSTEM CASCON
GOEPEL electronic introduces a prototype version of the Company's JTAG/Boundary Scan software platform SYSTEM CASCON with integrated tools supporting the current version of the upcoming IEEE P1687 (IJTAG) standard. IEEE P1687 focuses on the standardisation of the access to and the documentation of the control of chip-embedded instruments, without limiting the number or type of instruments.
Magma’s FineSim SPICE Enables Diodes Incorporated to Accelerate Tape Out of Two Highly Integrated Synchronous Switching Voltage Regulators
Magma Design Automation Inc. today announced that Diodes Incorporated has used FineSim™ SPICE multi-CPU circuit simulation technology to tape out two highly integrated synchronous switching voltage regulators. The AP6502 and AP6503, 340 kHz switching frequency external compensated synchronous DC/DC buck converters, are designed for use in consumer electronics systems such as digital TVs, LCD monitors and set-top boxes, which require ultra-efficient voltage conversion.
Atlona Introduces New AT-HSDI-VGA SDI to PC/HD Scaler With Audio
Atlona Technologies introduced the new AT-HSDI-VGA SDI to PC/HD scaler with audio to its Atlona Industrial line. Ideal for the integration of SDI sources into standard A/V environments, the AT-HSDI-VGA converts SD, HD, and 3G SDI signals to component or VGA formats with resolutions up to 1080p or 1920x1200, respectively. In addition, the unit's re-clocking technology allows SDI signals to be extended up to 1,000 feet with no signal degradation.
Multitest MT9928 XM Gravity Test Handler Chosen as Strategic Platform
Multitest announces that its well-established MT9928 XM Gravity Test Handler recently outperformed two major competitors during an extensive evaluation at a key player in semiconductor production. The benchmark process took more than one year and included an offline evaluation phase as well as a real production test.
X-FAB Qualifies Cadence Physical Verification System for All Process Nodes
Cadence Design Systems announced that X-FAB has qualified the Cadence Physical Verification System (PVS) for the majority of its process technologies. Foundry qualification means that X-FAB has given its stamp of approval for silicon accuracy of the Cadence Physical Verification System across all of its process nodes, and that mixed-signal customers can reap new performance and productivity advantages enabled by its tight integration into the Cadence Virtuoso® and Encounter flows.
NFC Enables Secure Wireless Access to Smart Meters
NXP Semiconductors will showcase smart meters with integrated NFC technology. NFC is a revolutionary wireless technology that enables devices such as smartphones to connect and interact securely with other NFC-enabled devices, such as smart meters. Using NFC, authorized utilities and end-consumers will be able to conveniently access and read smart meter data in real time using a smartphone.
Laird Technologies Expands Electrically Conductive Elastomer Line with EcE72 Silicone Gasket
Laird Technologies announced it has expanded its electrically conductive elastomer product line with the release of its new EcE72 silicone gasket. Utilizing both conductive and non-conductive materials, the EcE72 gasket is a nickel/graphite filled silicone elastomer that affords excellent EMI shielding properties and conductivity. Consisting of pure silicone, the gasket provides a stronger environmental seal at temperature extremes. It is flame retardant (developed to meet UL94 V-0 standards), and mold and mildew resistant.
Techsol's Enduring Medallion ARM SOM Gains Integrated Ethernet Support
While the Medallion CPU Module line is well known as the longest-running ARM System on Module or Computer on Module, it has not had integrated Ethernet as an option. That is, until now. This full-featured ARM-9 CPU module has all the features you'd expect — including USB Host & Device, LCD & Touch, SD/MMC, IrDA, SPI, I²C, UARTs, 32-bit bus, etc. and now Ethernet. The Ethernet feature uses a Micrel KSZ8851-16MLL Fast Ethernet controller supporting 10/100 Mb/s automatic detection and switching and has lines for link and activity LEDs.
Spirent Test Solution Validates Network Elements and Architecture In Juniper Networks’ Cloud Virtualization Environment
Spirent Communications' cloud computing testing solution has been selected to validate the performance of network designs created within the Junosphere Lab virtual environment, announced by Juniper Networks. Junosphere Lab, which enables the creation and modeling of networks and elements running the Juniper Networks Junos operating system, will include Spirent TestCenter Virtual to provide visibility into network infrastructures, as well as to accurately benchmark and optimize performance.
ESCATEC invests in new diebonder to triple throughput
ESCATEC has invested in a Hilbond DB 750 diebonder to increase the company's diebonding capabilities. The new machine is very accurate and fast, enabling ESCATEC to triple its existing diebonding throughput. The high degree of accuracy also means that the following production steps (e.g. wirebonding) have been accelerated.
X-REL Semiconductor launches XTRM: a new family of high-temp, extreme reliability electronics components
Following the announcement of the creation of French spin-off X-REL Semiconductor from EASii IC, X-REL introduces XTRM, its High-Reliability / High-Temperature product portfolio dedicated to fields such as Aeronautics & Space, Transportation & Automotive, Harsh Environments, Oil & Gas, Industrial and Geothermal.
Faster Clock Speed or More Parallelization? That is the Question!
Baseband processors for mobile devices typically run at as slow a clock speed as possible in order to minimize power consumption, generally in the order of 250-500MHz. However, the latest air interface standards are dramatically increasing throughputs, which is putting pressure on baseband processors to increase their performance, while simultaneously reducing latency. It doesn't take a rocket scientist to figure out why. LTE, or Long Term Evolution, is the latest air interface standard and is currently available from operators like Verizon, NTT DoCoMo and Telia Sonera.
Cadence Accelerates Adoption of Emerging Mobile Standards with Expanded Verification IP Portfolio
Cadence Design Systems, Inc. announced new protocol and memory model verification IP (VIP) that will accelerate the adoption of the latest mobile standards. Through close collaboration with leading system and semiconductor companies, and standards bodies, Cadence is delivering VIP at a very early stage – in many cases, ahead of the final specification – helping mobile SoC and system manufacturers to be first to market with increasingly feature-rich mobile devices, such as smartphones and tablets.
Huawei’s latest smartphone Honor packs a punch with its 16M true color HD display and three-day battery life, the longest in its class
Huawei officially unveiled the Huawei Honor, its latest Android 2.3.5 Gingerbread smartphone that features a 16M 16:9 true color high-definition (HD) 4-inch FWVGA capacitive touch screen. Powered by a 1,900 MAh battery, Honor frees consumers from the inconvenience of searching for an electricity source, allowing them to share and connect for up to three days on a single charge – the longest battery life among smartphones in the 4-inch screen range. With a 1.4 GHz processor, an 8-megapixel HDR -enabled camera and a 2-megapixel front-facing camera, Honor is a powerhouse in a sleek 10.9 mm-thin body and weighs just 140g.
Multitest’s MT2168 Optimizes for Cost and Throughput — Even for Less than 16 Sites
Multitest contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that the MT2168 fully leverages today's tester capabilities in terms of shorter test times and higher parallelism, e.g. 16 sites. However, there are many applications in the market where the number of simultaneously tested devices is lower than 16. The MT2168 is the best choice for these applications as well because of its innovative and fast internal material handling system, high soak capacity, and its highly scalable design.
Nihon Superior Debuts Selector Guide for SN100C Solder Pastes
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, introduces the new Selector Guide for SN100C solder pastes. The guide includes a detailed list of features for SN100C Solder Pastes.
IAR Systems tools improve software performance for STM32 ARM Cortex-M4 family from STMicroelectronics
IAR Systems today announced full tool support for all devices in the STM32 F4 family of ARM Cortex-M4 based microcontrollers, recently launched by STMicroelectronics. Intelligent compiler optimizations and integration of the CMSIS DSP library in IAR Embedded Workbench enhances software performance to the outstanding control functionality and high-efficiency signal-processing capabilities found in the STM32 F4.
TE Connectivity Launches New Website Featuring Data Center Agility - The Key to Successful Data Center Design
TE Connectivity has launched a new website, datacenteragility.com, to help data center managers get a better understanding of how TE can help build agility into their data centers. According to the 2011 Gartner Scenario for Data Center Providers, Flexibility and speed are key requirements from the new data center designs. Put these two factors together and it is clear that data centers require products and solutions that build agility into their design and operation: both in terms of meeting business needs for new services and to flex capacity. It is this same need for agility that is also driving the growth of cloud-based data centers.
ITT ICS design engineers create custom value-added Mil-DTL 38999 connector with printed circuit board contact and rear seal
A customer recently requested a high durability, low cost Mil-DTL 38999 series II connector which included a contact for a printed circuit board and a rear seal for use in corrosive environments. In addition to the requested custom features, they wanted the ability to withstand thermal cycling and be air pressure sealed to a mandatory 5 psi.
Express Logic’s NetX™Achieves Near Wire Speed on Freescale Kinetis
Express Logic, Inc., announced that its NetX TCP/IP stack has achieved 94 Mbps, an outstanding 94% wire speed on Freescale's ARM Cortex-M4-based Kinetis processor. The Kinetis has a 100-Mbps Ethernet port, which enables transfers at up to wire speed. Generally, TCP/IP stacks are less than 100% efficient, leading to performance well below wire speed. To facilitate rapid data transfer, the closer to wire speed, the better.
Teknek Announces Step Change In Contact Cleaning Technology
Teknek has announced another market leading innovation with its new patent pending, EcoFilm Product. The Teknek contact cleaning process uses sheeted adhesive rolls, which once consumed, have to be disposed of. After extensive research and testing Teknek is now ready to release its new EcoFilm adhesive rolls.
Marvell Delivers New Network Connectivity Options for wired home network performance
To support current and surging consumer demand for high-speed and highly robust home networking, Marvell announced the ITU-T G.hn compliant transceiver chipset, which enables the complete unification of the home wireline network for distributing more content to more screens in more rooms in the home. The new G.hn transceiver chipset family is designed to provide optimized home network performance over any wired medium (including powerline, coax and phoneline/twisted pair) in a single chipset, reducing overall cost, complexity of design and time to market (TTM) for system designers. With up to a 1 Gbps wire data rate, we expect the G.hn chipset to be an ideal solution for the wireline distribution of bandwidth-intensive and real-time applications such as HD IPTV, VoIP, gaming, multi-room DVR and beyond.
CERN Deploys Coverity Static Analysis and Fixes More than 40,000 Defects in Large Hadron Collider Software
Coverity, Inc. today announced that the European Organisation for Nuclear Research (CERN) has successfully deployed Coverity Static Analysis to improve the integrity of the source code found across a number of projects analysing data from CERN's Large Hadron Collider (LHC).
ITTIA DB SQL Rocks Android SDK
ITTIA, announces the availability of its flagship database for embedded systems and intelligent devices, ITTIA DB SQL, on Android. With an enhanced alternative to Android's built-in data storage now available, Android applications can benefit from high-throughput write operations, large data set scalability, in-memory table performance, and synchronize with other devices and back-end databases.