Huawei and Intel Collaborate on LTE TDD
Intel Corporation and Huawei today announced a collaboration to advance the development of interoperability testing and deployment of LTE TDD solutions. The two companies will establish joint lab set-up based in China for IOT (Interoperability Test) and fast implementation of LTE TDD technology.
IPC Technology Trends Study Reveal Changes In Store For PCB Fabricators And Suppliers
PCB Technology Trends 2011, a new study published this week by IPC — Association Connecting Electronics Industries, shows how the demands of miniaturization and high-speed technology are driving changes in printed circuit board (PCB) processes and materials. The 53-page report presents the technology demands of today and foretells the changes expected by 2014 that will affect PCB fabricators as well as materials and equipment suppliers.
ARM and MStar Extend Relationship with License for ARM Cortex-A9 Processor
ARM today announced that MStar has licensed the ARM Cortex-A9 MPCore and ARM926EJ-S processors, in addition to a range of ARM system IP for use in smart-TVs, set-top-boxes (STBs) and smartphones. MStar is already a licensee of the ARM Mali-400 MP Graphics Processing Unit (GPU), which is used in mass production for MStar smart-TV system-on-chip (SoC) solutions. By extending its ARM IP portfolio MStar will be able to provide solutions featuring a range of feature-rich ARM technology.
Personalised workbench app empowers engineers
Starting today engineers can more easily browse, store and link products to projects using NXP Semiconductors' N.V. newest mobile app – 'Tech bench.' Tech bench is an intuitive, feature-rich iPAD app allowing engineers to access NXP's full product portfolio; to collect datasheets, application notes and quality information; and to 'drag and drop' product or application data in self-defined project sections.
Renesas Adopts Synopsys' Proteus LRC for Lithography Verification
Synopsys, Inc. today announced the production qualification and adoption of Synopsys' Proteus LRC at Renesas Electronics Corporation, the world's premier supplier of microcontrollers and a world's leading supplier of advanced semiconductor system solutions including microcontrollers, SoC solutions and a broad-range of analog and power devices. Proteus LRC provides large-scale integrated circuit (LSI) manufacturers like Renesas with a highly accurate and comprehensive lithographic verification solution.
“A US $6.1 billion opportunity through the end of the decade,” announces Yole Développement
Yole Développement announces its report "III-V Epitaxy Equipment & Applications Market". In this report, Yole Développement covers established and emerging epitaxy technology for III-V semiconductors used in several applications. It provides quantifications for tools and wafer starts per application, an in depth analysis of recent technology trends and their impact on cost of ownership and a comprehensive company profile of the main players in MOCVD and MBE business.
Peak Group joins GOEPEL electronic’s GATE program
GOEPEL electronic announces the extended incorporation of Peak Production Equipment Ltd., into the global alliance program GATE (GOEPEL Associated Technical Experts). The focus of the cooperation is the development and practical implementation of new products based on combined functional and JTAG/Boundary Scan test as well as enhancements in the integration of JTAG/Boundary Scan products in existing test systems built by Peak, allowing a total test and integration solution to be provided from one source.
Tensilica’s ConnX BBE16 DSP IP Core for Digital Baseband Signal Processing Licensed to Renesas Electronics
Tensilica, Inc. today announced that the ConnX BBE16 DSP (digital signal processing) IP (intellectual property) core has been licensed to Renesas Electronics Corporation for upcoming products for digital TVs.
NI Releases iOS and Android Mobile Apps for NI Hardware and LabVIEW
National Instruments has announced NI LabVIEW software- and NI hardware-compatible mobile apps for iPhone, iPad and Android devices, helping engineers integrate the latest mobile technology into their applications. By combining the portability, ease of use, faster start-up time and longer battery longevity of mobile devices with the power of LabVIEW, engineers can more productively access measurement data from data acquisition and embedded monitoring systems.
Solid Wires Face Keen Challenge from Flux Cored Alternatives, Cautions Frost & Sullivan
The global solid wires market was deeply impacted by the economic crisis in 2009, but staged a recovery in 2010, with compound annual growth rates (CAGR) projected at 9% from 2010 to 2017. Notable drivers in this growth will include the wider adoption of alloyed solid wires in emerging geographic markets, increasing automation and MIG applications, heightened awareness and the rising preference for solid wires in pipelines industries.
Imec’s resistive RAM research shows momentum in 2012 VLSI Technology Symposium papers
At this year's Symposia on VLSI Technology and VLSI Circuits (June 12-15, 2012 - Honolulu, USA,), imec and its partners will present 10 papers on memory and logic scaling technology and circuits. With 4 RRAM (resistive RAM) papers accepted, the VLSI reviewing committee endorses the value of imec's R&D program on emerging memory devices. And 5 papers will address logic device scaling and characterization for next-generation CMOS technologies.
Fujitsu Technology Puts Big Data to Use in Minutes
Fujitsu Laboratories today announced that it has developed new parallel distributed data processing technology that enables pools of big data as well as continuous inflows of new data to be efficiently processed and put to use within minutes.
ON Semiconductor to Jointly Develop Next Generation Star Tracker CMOS Image Sensor with the European Space Agency
ON Semiconductor today announced that the European Space Agency (ESA) has awarded it a joint development contract for the next generation star tracker CMOS Image Sensor (CIS), referred to as HAS3. Once developed and qualified, the High Accuracy Star Tracker 3 (HAS3) image sensor will expand the STAR family of radiation-tolerant CIS.
Fujitsu Develops Power Saving System Control Technology for Container Data Centers
Fujitsu Laboratories Limited today announced the development of a power conservation system control technology that reduces overall power consumption in container data centers by closely coordinating the operation of servers and air-conditioning (A/C) systems.
Cypress's EZ-USB FX3 Controller Enables USB 3.0 Test Platform for Microsoft
Cypress Semiconductor Corp. today announced the EZ-USB FX3 USB 3.0 controller has been chosen for the SuperSpeed Microsoft USB Test Tool (SuperMUTT). SuperMUTT can be used with virtually any USB 3.0-enabled host driver to test USB compliance and compatibility with Microsoft's upcoming Windows 8.
“The MEMS packaging, assembly, test & calibration market will reach $2.3B value by 2016, growing three times faster than the overall IC packaging industry,” forecasts Yole Développement
Yole Développement announces its report "MEMS Packaging". This report is featuring a full analysis of packaging, assembly & test requirements application by application as well as a dedicated focus on MEMS package substrates.
New Supercomputer System Begins Operations at the University of Tokyo's Information Technology Center
Fujitsu today announced that it has completed construction of the new supercomputer, nicknamed Oakleaf-FX, for the Supercomputing Division of the University of Tokyo's Information Technology Center (SCD/ITC). The new system will begin operations from today.
High Demand For Scorpion, Essemtec’s New Dispensing System
Since the premier of the Scorpion at productronica 2011 in Munich, Essemtec has noted a record high in demand. Due to its outstanding price-performance ratio, the new dispensing machine is among the best dispensers in the world. Its accuracy of ±25 μm is extraordinary and it can dispense up to 100,000 dots per hour.
Unique Collaboration Yields Secure and Resilient Virtual Computing Platform for Sensitive Cloud Deployments
LynuxWorks, Inc., TransLattice and Fritz Technologies Corporation, today announced a collaboration of their technologies and expertise to provide a new platform for building cloud deployments in sensitive environments. The resulting S.E.C.U.R.E. (Secure, Enterprise, Cross-Domain, Unified, Resilient Environment) platform solution creates the ideal environment for situations requiring secure hosting of applications, geographic redundancy of applications and data, and secure cross-domain transfer of information. Technology demonstrations at DoDIIS will be available in both the LynuxWorks (#752) and TransLattice booths (#460).
Schroff case provides sturdy housing for Owlstone modular calibration gas system
A Schroff desktop case with integral 19in. subrack and plug-in units is being used to protect the sophisticated electronics of a modular calibration gas generator developed by University of Cambridge spin-out Owlstone Nanotech.
Dialog Semiconductor and TSMC create a process platform to advance BCD power management leadership
Dialog Semiconductor plc today announced it is working closely with TSMC to develop its next generation of bipolar-CMOS-DMOS technology specifically tailored to high-performance power management ICs (PMICs) for portable devices.
“A strong market transition from R&D modules to research and production systems”, announces Yole Développement
Yole Développement announces its report "Flow Chemistry Technologies - Microtechnologies for chemical process intensification". Over the last five years, supply chain for Microreaction technologies started to get structured. The range of products available on the market became wider in terms of both performance and price, and from modules to systems. In the meanwhile, market consolidation occurred and strategic collaborations have been set-up.
Express Logic’s NetX Achieves Near-Wire Speed on STM32 Platform
Express Logic, Inc. announced that its NetX Duo TCP/IP stack has achieved 93–95 Mbps, an outstanding near-wire speed on STM32F207 and STM32F217, STMicroelectronics' ARM Cortex-M3 processors. NetX Duo, Express Logic's dual IPv4/IPv6 TCP/IP stack, ships with over 12 application protocols, including DHCP, FTP, and many others, making it ideal for the small footprint, high-performance connectivity needs of today's consumer, medical and industrial devices.
NuWaves Engineering Partners with the University of Dayton Research Institute Center for Unmanned Aerial System Exploitation
NuWaves Engineering has been selected to join the University of Dayton Research Institute's Center for Unmanned Aerial System Exploitation (CUE) consortium. CUE was established in September 2009 under a grant from the Ohio Third Frontier program to meet increasing demand for sensor & payload integration, systems analysis, and flight demonstration & test of unmanned aerial systems.
AVX delivers world’s first validated conflict-free tantalum capacitors
AVX Corporation, has shipped the world's first tantalum products manufactured from validated conflict-free tantalite ore mined in the Democratic Republic of the Congo (DRC) to Motorola Solutions, a leading provider of mission-critical communication solutions and services for enterprise and government customers.
Sales of Optoelectronics, Sensors, and Discretes Set Record in 2011
Strong demand for MEMS-based sensors, fiber-optic laser transmitters, CMOS image sensors, light-emitting diodes (LEDs), and power transistors enabled the optoelectronic, sensor/actuator, and discrete semiconductors marketplace to grow by a slightly better-than-average 8% in 2011 to a new record-high $57.4 billion despite a substantial pullback in most product categories at the end of the year, according to IC Insights' new 2012 Optoelectronics, Sensors/Actuators, and Discretes (O-S-D) Report.
IPC International Technology Roadmap Provides OEM Vision of Future Board and Assemblies
The long-awaited 2011 IPC International Technology Roadmap for Electronic Interconnections was released last month at IPC APEX EXPO 2012. Published biennially, the IPC Roadmap serves as an authoritative guide to interconnect technological trends, providing a vision of imminent, innovative technology.
Luxtera and STMicroelectronics to Enable High-Volume Silicon Photonics Solutions
STMicroelectronics and Luxtera Inc. has announced a new agreement to bring Luxtera's leading-edge IP and knowledge in silicon photonics to a dedicated process to be developed by ST at its 300mm facility in Crolles, France. Production at ST's Crolles site will enable the two companies to support the market with the world's most advanced low-cost, high-volume solution for silicon photonics components and systems.
Sumavision Deploys Broadcom DOCSIS-based EoC Cable Architecture Solution in China
Broadcom Corporation today announced that Sumavision is deploying its DOCSIS-based Ethernet over Coax (EoC) cable architecture to Chinese cable operators.
Rigel passes the test in South Africa
Rigel Medical analysers have been specified for a ground breaking project in South Africa designed to improve standards of medical device safety and performance inspection. The Rigel 288 electrical safety analyser, Uni-Pulse defibrillator analyser and Uni-Sim - the first all in one vital signs simulator - are among several precision testers being used by the National Department of Health in Pretoria for its health technology audit and asset management scheme.
Synopsys and Applied Materials Collaborate on TCAD Models for Next-Generation Logic and Memory Technologies
Synopsys, Inc. and Applied Materials, Inc. today announced a collaboration to develop technology computer-aided design (TCAD) models for next-generation semiconductor devices. The models derived from this TCAD collaboration will enable customers to speed up process development for 14-nanometer (nm) and 11-nm logic and new memory chip technologies, allowing them to lower cost and reduce time-to-market.
Riber and imec extend successful collaboration on next-generation III-V logic CMOS
Riber today signed an agreement with imec to further collaborate on epitaxy process technologies for next-generation III-V CMOS devices. The agreement follows a successful collaboration in the field of advanced channel materials for high-performance CMOS scaling, germanium and compound semiconductor (III-V) materials.
GUC and Synopsys Achieve Design Milestone
Global Unichip Corp. and Synopsys, Inc. today announced the tape out of 30 customer devices during the past four years using a combination of Synopsys' DesignWare IP and GUC's ASIC design services. This milestone marks GUC's emergence as an ASIC industry leader, demonstrates the quality and breadth of Synopsys' IP portfolio and underscores the successful partnership between the two companies.
NanoKTN Helps V-SMMART Nano EU Project Secure €3.1m for Product Development
The Nanotechnology Knowledge Transfer Network has helped secure €3.1 million of funding for V-SMMART Nano, an EU funded programme. The funding, which comes from the FP7-NMP call, will support development of the Volumetric Scanning Microwave Microscope (VSMM), for non-destructive 3D nanoscale structural characterisation of samples.
Texas Instruments and iRobot team up to shape future robotic innovation
Texas Instruments Incorporated and iRobot Corp. today announced a partnership to develop robotic technologies using TI's smart multicore OMAP platform. The relationship stems from the companies' shared vision to create intelligent and practical robots capable of enhancing people's lives. The two companies will achieve this vision by leveraging iRobot's long history in advancing the field of robotics and TI's strength in applications processors and related technologies.
Growth in Mobile Backhaul Spurs Demand for Gigabit Ethernet Test Equipment, States Frost & Sullivan
The key factor driving the global gigabit Ethernet test equipment market is the need for extra bandwidth caused by a flood of video applications on smartphones that offer anywhere/anytime access. This trend is motivating carriers to change from synchronous technology over to Ethernet and is particularly visible in the mobile backhaul segment.
U.S. Presidential Election Years Influence Semiconductor Market
Over the past several years, the world has witnessed bloviating U.S. political leaders butting heads and verbally sparring with each other. Just when you begin to believe that pontificating representatives are unable to work together to resolve differences on significant issues, along comes an election year and it seems "leaders" put aside many of their differences.
PMC-Sierra acquires the server storage 12Gb/s expander product line from Maxim
PMC-Sierra, Inc. has announced the Company has acquired Maxim Integrated Products, Inc.'s 12Gb/s SAS expander technology. PMC expects the acquisition will strengthen its SAS design footprint with leading server OEMs. Combined with PMC's 12Gb/s SAS RAID-on-Chip (RoC) products, Maxim's expander technology enables PMC to offer end-to-end 12Gb/s SAS solutions tailored for server platforms.
NanoKTN Launches Medical Devices Focus Group
The Nanotechnology Knowledge Transfer Network is pleased to announce details of its new focus group, Nanotechnology in Medical Devices (NiMeD) which will showcase the use of nanotechnology in the medical technologies sector. The group aims to bring together companies working in the medical devices industry to work together to further commercialise the use of nanotechnology in healthcare.
New embedded consortium for standardization management
Today, at the Embedded World tradeshow, the founding of the Standardization Group for Embedded Technologies ('SGET' for short) has been announced. Leading embedded computer manufacturers, namely Advantech, congatec, DATA MODUL, Kontron, MSC, SECO, and the publishers WEKA Fachmedien and Vogel Business Media have announced to be among the founding members.