Virtual Industries Debuts Air Ionizers for ESD Control of Workspaces
Virtual Industries, Inc., a leading supplier of ESD-safe manual vacuum handling solutions, introduces its VIR-STATTM line of air ionizers for eliminating static charges in ESD-sensitive assembly areas.
Engineered Conductive Materials Debuts DB-1538-2 Ribbon Attach Conductive Adhesive
Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces its DB-1538-2 Conductive Stringer Attach Adhesive, which is designed for use in thin-film, organic and thinned silicon solar modules.
JBC Tools Offers Demos for Compact CD Soldering Station
JBC Tools, a leading provider of hand soldering and rework tools, offers demos for its Compact CD Soldering Station. Sales representatives now can bring the station onsite for customers to demo.
Techcon Systems Introduces Blue End Caps for Syringe Barrels
Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, introduces its new Blue End Caps for Syringe Barrels.
Gemini Tec boosts capacity with MYDATA
To provide the increased capacity needed to address the strong and sustained growth of its business, Gemini Tec, a leading provider of complex mixed technology PCB assembly services, has purchased two new MYDATA MY100LX10 pick-and-place SMT machines. As supplied, the new machines are configured to operate together as a Synergy line, which gives exceptional flexibility and a total placement capacity of 21,000 cph. They can, however, also be operated independently should the flexibility of building two concurrent jobs be required.
Etek Europe - Quality Filters for Fume Extraction Equipment
Etek Europe, a leading supplier of products and services to the European electronics industry, have continued the expansion of their Fume Extraction Division and launched a new range of quality filters for fume extraction equipment.
Benefits of Using Laser Doppler Vibrometers against Accelerometers for the Manufacturing of White Goods
Thanks to the integration of non-contact laser vibrometers into the quality testing of actuators and other component for white goods, household appliance manufacturers can safeguard their competitive advantages.
Kyzen’s Dr. Bixenman to Hold IPC Webinar on Cleaning Highly Dense Circuit Assemblies
Kyzen announced that Dr. Mike Bixenman will host an upcoming IPC Webinar titled "Cleaning Highly Dense Circuit Assemblies and Advanced Packages" on Tuesday, July 19, 2011 from 10-11 a.m. CST.
Techcon Systems Debuts New Product Catalog
Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, introduces its updated product catalog. The new catalog highlights the TS5540-MS Micro-Spray Valve, designed to spray low- to medium-viscosity fluids through disposable dispensing tips. The valve features a field replaceable UHMWPE seat (seal) to provide positive shut-off and extend the valve lifecycle. The innovative design enables the valve to produce uniform spray patterns ranging from 0.180 to 0.60 (4.6 to 15 mm) in diameter.
STI Electronics’ Mark McMeen to Discuss Flex Circuit Assembly Issues at the IPC FLEX Conference
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Mark McMeen, Vice President of Manufacturing and Engineering Services, will present "Flex Circuit Assembly Issues: What the Fabricator needs to Know" at the upcoming IPC FLEX CONFERENCE, scheduled to take place June 21-23, 2011. The presentation will be held Wednesday, June 22, 2011 at 11:30 a.m. at the Sheraton Minneapolis West in Minneapolis, MN.
Techcon Systems Debuts Stand-Up Tip Caps for Syringe Barrels
Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, introduces the new Stand-Up Tip Caps for use with luer lock syringe barrels.
Surface Technology International (STI) Invests in Number Six Takaya Flying Probe.
STI are a contract electronic manufacturer that specializes in low to mid volume, of high technology, high value products. STI's, Hook facility, is one of the best equipped factories in the UK, utilizes the latest technology and equipment. STI services a number of industry sectors including aerospace, defence, energy, oil & gas, medical, industrial, commercial, automotive, telecoms and space. These customers demand the highest levels of quality, reliability and of service.
GPD Global to Demonstrate PCD Technology at SEMICON West 2011
GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R&D production will demonstrate its award-winning Positive Cavity Displacement (PCD) Dispensing in Booth #6186 in the North Hall at the upcoming SEMICON West, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco
Sono-Tek Corporation to Exhibit ExactaCoat at SEMICON West 2011
Sono-Tek Corporation (OTC BB: SOTK), the world leader in the development and application of ultrasonic coating systems for spray fluxing, today announced that it will highlight the ExactaCoat Tabletop Coating System in Booth #2631 in the South Hall at the upcoming SEMICON West, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco, CA.
SABIC Paints a Bright Future for Laser Direct Structuring with New Custom-Colorable LNP Thermocomp Compound
The Innovative Plastics strategic business unit of SABIC announced at Chinaplas, the first new custom-colorable LNP Thermocomp thermoplastic compound for laser direct structuring (LDS) to save space and reduce the weight of mobile devices. LDS is a sophisticated process for integrating electronic and mechanical functionality into a single module, such as mobile phone and notebook antennas. Previously, only black plastic materials were available, typically forcing designers to confine LDS components to the device's interior. The introduction of the company's new colorable LNP Thermocomp compound vastly expands device design options. This new material introduction demonstrates Innovative Plastics' pioneering leadership in advanced technologies for the design and manufacture of tomorrow's portable devices.
Low Viscosity, Room Temperature Curing Epoxy Complies With FDA and USP Class VI Requirements
Ideal for potting and encapsulation applications, Master Bond EP21LV features a low viscosity and outstanding electrical insulation properties. It is broadly used in the medical and food industries, as it conforms to USP Class VI and Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements.
AWS Group accredited by Nadcap – completes ‘full set’ of process and quality approvals
AWS Group – one of the UK's leading independent Electronic Manufacturing Solutions (EMS) providers – has just received notice of accreditation by Nadcap, the body which aims to provide continual improvement within the aerospace, defence, automotive and related industries.
Spray Fluxer for Wave Soldering Systems Launched by Etek Europe
Etek Europe, a leading supplier of products and services to the European electronics industry, has announced the launch of their branded Spray Fluxer for Wave Soldering Systems – The EcoSpray.
UV masking for high value components from Intertronics
Intertronics has found solvent-free, UV curable temporary masking resins to significantly simplify component masking processes while greatly reducing costs. This is experienced in lower scrappage rates, reduced labour rates and enhanced process speed. It has proven possible to reduce costs in the case of aircraft components by some 40% with 60% to 70% time saving.
Blue Chip Technology increases SMT capacity by up to 400%
Blue Chip Technology is a leading UK innovator and manufacturer of industrial computer and single board computer platforms. Their extensive off-the-shelf portfolio includes rackmount computers, COM boards, SBCs, fanless embedded systems, Panel PCs and digital signage hardware.
Juki Receives Contract for IFS-X2 Intelligent Feeders from ACD
Juki Corporation, a world-leading provider of automated assembly products and systems, recently received an order from ACD (Automated Circuit Design) for its IFS-X2 RFID-based intelligent feeder platforms. Based in Richardson, TX, ACD is a leading supplier to the electronics industry.
Magma Announces Reference Flow for GLOBALFOUNDRIES’ 28-nm Low-Power Technology
Magma Design Automation announced the availability of a netlist-to-GDSII reference flow for GLOBALFOUNDRIES' 28-nanometer (nm) super low-power (SLP) high-k metal-gate (HKMG) technology.
Finetech Sells 12 Bonding Systems to University Labs to Advance Research
Finetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including a Nanofabrication Facility as well as Electrical Engineering and Physics departments.
Two International Industry Awards For Assembleon's Twin Placement Robot
Assembléon's Twin Placement Robot, the latest addition to its A-Series pick & place equipment, has been received multiple innovation awards at this year's Nepcon China in Shanghai. The Twin Placement Robot (TPR) received EM Asia's Innovation award 2011 in the high volume assembly category. In the same category it also received the award for best exhibited technology from the SMT Association China.
Juki Successfully Launches KE-1070/KE-1080 Modular Machines
Juki Corporation, a world-leading provider of automated assembly products and systems, announces that its KE-1070/KE-1080 modular placement systems have greatly exceeded sales forecasts since their release in late 2010.
Kyzen’s Technical Cleaning Event A Complete Success
Kyzen, the leading global provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, successfully held a technical cleaning day on May 24th, 2011 at the Brno Comsa Palace Hotel in Czech Republic.
Intertronics - LED spot-curing system and compatible adhesives
The adhesives specialists at Intertronics recently launched the new BlueWave LED prime UVA high-intensity spot-curing system and a new line of compatible adhesives from technology partners DYMAX. The unit offers many advantages over conventional spot-curing systems, including no consumable bulbs to change, no warm-up, cool cures and constant intensity up to 50,000 hours.
Essemtec Provides High-Resolution SPI for Printing and Dispensing Processes
Traqu is a high-resolution digital 3-D inspection device from Essemtec used for 3-D measurement and analysis in processes such as solder paste inspection (SPI). Measurement tasks are programmed with a few mouse clicks, and DXF and Gerber data can be imported.
SchmartBoard Expands SOIC to DIP Adapter with “ez” Soldering
SchmartBoard, a company that makes prototyping electronic circuits easier, has expanded our product offering with a new family of products that support the use of Surface Mount Technology (SMT) components with breadboards. Schmartboard has released three new SMT to DIP adapters that use the patented ez technology, which means soldering the surface mount component is simple. As with all ez boards, SchmartBoard is the only company with a patented solution for easily soldering surface mount parts.
Versatile Food Grade Epoxy Resists High Temperatures & Harsh Conditions
Master Bond announced the release of EP42HT-2FG, a new food grade epoxy system. EP42HT-2FG has been independently tested and certified by a leading national laboratory to meet the stringent requirements of FDA CFR 175.300. It also was toxicologically evaluated to meet the NSF/ANSI 51.4.1 (2009) standard for food equipment materials.
Protonic gears up for 55,000 CPH with MYDATA
With demand for its products and services enjoying unabated growth, Protonic Holland BV, a leading European developer and manufacturer of custom electronic equipment, has invested in a new MYDATA MY100DX14 pick-and-place machine. This complements the company's existing MYDATA MY19 machine to give a total throughput capacity of 55,000 cph. The new configuration also offers positions for up to 384x8 mm feeders and up to 32 tray feeders.
Essemtec to Highlight Paraquda SMD Pick-and-Place in Utrecht
At the upcoming Electronics & Automation exhibition, taking place from May 25-27 in Utrecht, Netherlands, Essemtec will highlight the Paraquda SMD pick-and-place, the first system using ePlace operation software. Also highlighted will be the new Cobra feeder.
Teknek Introduces High Performance Solution For Cleaning Thin Film
The problem of cleaning thin films has been solved by Teknek, the global leader in contact cleaning technology, with the introduction of the Ultracleen range of cleaning roller.
Essemtec to Premier Cobra Pick-and-Place in Paris
Essemtec will introduce the Cobra SMD pick-and-place at the upcoming Cien Exhibition in Paris, from May 24-26. Cobra is the latest product from Essemtec, the Swiss manufacturer of production machines for electronics. It combines very high flexibility with the fast placement speed of an 8-axes placer.
New issue of SIPLACE SMT Insights Concise information about progressive setup concepts
The flexibility of an electronics manufacturing plant is determined by the processes around the SMT line such as materials management, production scheduling, and especially setup techniques. In the latest edition of its series of SMT Insights brochures, the SIPLACE team presents a compact overview of new, progressive setup concepts. Interested readers will learn how to implement efficient, fast and even non-stop setup changeovers for small lot sizes and rapid production job sequences.
Essemtec to Introduce New Pantera-X Options at SMT Nuremberg
Essemtec, the Swiss manufacturer of production systems for electronics, will debut a new type of exchangeable vacuum table at the upcoming SMT Nuremberg exhibition. It allows foils and double-sided PCBs to be processed on the same machine, and installation is simple with only a few steps. Essemtec also will present a new inline system during the exhibition.
AWS Group supports manufacturing from creation through to end-of-life
AWS Group – one of the UK's leading independent Electronic Manufacturing Solutions (EMS) providers – has developed its group capabilities to support all phases of a contact, from new product introduction, through ramp up and full production, to MRO (Maintenance, Repair and Overhaul) and end-of-life. This is especially important in sectors such as defence, telecoms, security and mass transport, where products are expected to have a working life running to 10 or 20 years' service or longer.
Juki to Premier New High-Speed Modular Mounter
On May 9, 2011, Juki will release the FX-3R High-speed Modular Mounter. The newest model in the series, the FX-3R has significantly higher production capacity than its predecessor. the FX-3. Through design improvements to both hardware and software, the FX-3R realizes a production capacity of 90,000 CPH (0.040 second/chip under optimal conditions).
Cobra Feeder to Increase Placement Rates by 25 Percent
Essemtec, the Swiss manufacturer of production systems for electronics, will premier the Cobra Feeder, a new type of SMT component feeder, at the upcoming SMT Exhibition that is taking place May 3-5 in Nuremberg, Germany. The double-8-mm feeder can increase the placement rate of Cobra and Paraquda pick-and-place machines by up to 25 percent.
Laird Technologies Releases New Tpcm 580SP Series Screen Printable Phase Change Material
Laird Technologies announced the release of its new Tpcm 580SP Series phase change material. The Tpcm 580SP Series is the latest phase change material (PCM) offered in Laird Technologies' thermal interface material (TIM) product line. It is an exceptionally high-performance, screen printable or stencilable TIM with a thermal conductivity of 4.0 W/mK that provides an alternative to thermal grease.