Production
Professional Printing in a Tabletop Format - Essemtec Debuts Fino Programmable Precision Printer
Compact, precise and exceptionally easy to use: These are the characteristics of Fino, the new printer from Essemtec. The programmable precision printer can be placed on a table, making it is ideally suited for smaller, flexible production. Optionally, the printer is available mounted on a robust steel stand.
Kea: High-Precision Stencil Printer for Versatile Production
The new Kea from Essemtec is the preferred screen/stencil printer for versatile production processes that value high quality and process control. Its software controls all printing parameters, and it is converted quickly and setup easily.
Essemtec to Highlight New 3-D Dispense and Placement System
Essemtec has developed this fully automatic 3-D dispensing and SMD placement machine Hydra in a close collaboration with a producer of 3D-MID products. The system operation of Hydra is similar to a standard SMD pick-and-place machine. Therefore, it can be integrated easily into a typical electronics production.
ULVAC Develops and Sells 'ENTRONTM-EX2 W300 CVD-Ni/CVD-Co' Film Formation System for the Silicide Process for 3D Devices
ULVAC, Inc. announces that it has developed a new system to enhance its ENTRONTM-EX W300 300mm system series, which has a proven track record at plants mass producing semiconductors worldwide. The newly-developed ENTRONTM-EX2 W300 CVD-Ni/CVD-Co system offers CVD-Ni and CVD-Co processing for 3D devices. Its processing capabilities vastly improve productivity and enable greater investment efficiency.
Cliff Electronics Extends Control Knob Options
CLIFF Electronics announce new introductions to their wide range of control knobs. The new K88 range of space saving skirt-less knobs is suitable for use with rotary switches, potentiometers and encoders. Standard colours available are black and grey with opaque caps available with or without a marker-line - in standard colours of black, white, red, grey, yellow, blue and green. The cost effective Cliff K88 knobs are available to fit 4, 6 and 6.35mm D fit shafts and 6 and 6.35mm splined shafts. Typical applications include audio mixing and lighting desks and instrumentation panels.
Conduction-cooling assemblies take the heat out of VPX, VME and CompactPCI boards
Now available from electronics packaging specialist Schroff is a range of conduction-cooling assemblies (CCAs) that have been designed specifically for use in VPX, VME and CompactPCI systems. As well as removing the heat from PCBs where convection alone is insufficient, the CCA devices also provide mechanical support for the boards to enable them to withstand conditions of severe shock or vibration.
Timers increase flexibility while reducing part number count
Finder has announced the introduction of a range of eight modular, 22.5mm wide rail-mounted timers designed to provide a complete range of timing functions, while keeping part number holdings to the absolute minimum. The multi-voltage 83 Series of multi-function and mono-function timers handles 14 different timing functions, with time scales between 0.05 seconds to 10 days and offers either single or double pole variants.
Micronic Mydata opens new possibilities for the electronic packaging industry with groundbreaking LDI solution
Micronic Mydata AB launched a new Laser Direct Imaging solution it says will help manufacturers align to the future production needs of advanced electronics. At the same time as mobile phones, notebooks, PCs and other devices are growing smaller and more powerful, their functionality is becoming increasingly complex. A leap forward in direct imaging technology, the new Micronic Mydata LDI 5s Series will enable IC substrate producers to maintain current writing speeds, but with improved feature size control and alignment - while pushing resolution below 10µm.
eMIS from Essemtec allows planning and traceability down to the component level
The new eMIS Management Software Suite for SMD production includes functions for job planning, feeder setup optimization, stock management, traceability and much more. With eMIS, managers and operators can keep track of actual, future and past production. Flexible interfaces simplify integration into the existing ERP environment.
Count On Tools Inc. Develops New LED Nozzle Series
Count On Tools announces the development of a new series of LED nozzles. Recognizing issues with LED component handling during the pick-and-place process, Count On Tools went back to the drawing board to create a new nozzle approach to overcome the tackiness or stickiness of the LED substrates.
Essemtec’s Cobra Picks Four Components at Once Simultaneous pickup increases speed of the multi-nozzle head
Essemtec's Cobra is the world's first machine that features the Quattro-Pick feature, allowing it to pick four components from four different feeders simultaneously. It is therefore faster than other pick-and-place machines with multi-nozzle pickup head.
Aerotech's new MPS75SL miniature positioning stage is ideal for research and development - delivering accuracy, repeatability, and ultra-fine positioning resolution in a small footprint
Aerotech's new MPS75SL series miniature linear positioning stages are just 75 mm wide and available in four travel ranges from 25 mm to 100 mm. Aimed at applications in university labs, or R&D centres that require precision alignment, or for assembly, test and measurement in industrial production environments, the small footprint and low-profile stage design is optimised in the use of the latest generation of miniature 1 mm pitch precision ballscrews, high resolution encoders and anti-creep crossed roller bearings for ultra smooth velocity and reduced error motion. The MPS75SL is available in a choice of standard precision or with Aerotech's HALAR linear error-corrected certified precision.
Manncorp debuts 2-pot dual-wave solder machine for easy lead-free/Pb switchover
PCB assemblers -- particularly contractors -- faced with the need to go lead-free while maintaining a tin/lead soldering presence, will welcome Manncorp's 16.350 wave solder machine. In place of the usual single pot, the 16.350 can now be configured with two pots on roll-out carts to provide lead-free-to-Pb switching with ease.
High Performance Uv Curing Adhesives From Intertronics Aids Efficiency
Increasing production throughput of bonded plastic assemblies is high on the list of priorities these days for both design and production engineers judging from the experience of the adhesive specialists at Intertronics. In these situations Intertronics are delighted to offer the DYMAX Ultra Light-Weld 3069 which is a UV/Visible light-curable adhesive designed for rapid bonding and laminating of a variety of plastic substrates. This high performance, solvent-free adhesive cures in seconds to enable faster processing, increased output and lower processing costs.
Essemtec’s Cobra Feeder Threads Tapes Quickly
Essemtec's Cobra Feeders simplify and hasten setup of component reels to SMD pick-and-place machines. Regarding speed, accuracy and reliability, these feeders rank in the world's top class. They integrate an active tape pull-back system as well as a cutter. Cobra Feeders now are available for both 8 and 12 mm tapes.
Customized RFID Tags Introduced by Uson to Speed Throughput of Electronic Products Leak Testing
Global electronic products manufacturers (including AV and outdoor lighting products) seeking the highest standards of lean manufacturing by using RFID tags for parts identification and information tracking can now use a unique electronic label system built by Uson with both standard and custom components tailored to application requirements. The custom elements of Uson RFID tags streamline parts processing and help manage test data while cutting overall production cost.
Essemtec Introduces Fast Tray Changer for Cobra and Paraquda
The new TCQ automatic Tray Changer can replace a component tray in less than five seconds and align it with accuracy better than 50 µm. The 18-bin changer is available for Cobra and Paraquda pick-and-place machines. Essemtec will highlight the new module at the upcoming productronica 2011 exhibition in Munich, Germany.
Rob’s new at NuStart Electronics
Leading contract manufacturing services (CMS) specialist NuStart Electronics announces the appointment of a new Sales Manager based at its Newbury, Berkshire production facility.
Techcon Systems Adds 34 Gauge Tip to Its Product Line
Techcon Systems introduces the new 34-gauge despense tip to its product line. With an inside diameter range of 0.003-0.0045 (0.076-0.114 mm), the new 34-gauge tip is ideal for dispensing micro shots of low-viscosity fluids.
LVDTs from RDP well suited for hydraulic proportional control
Thanks to their ability to be immersed or flooded by non-corrosive and non-degrading oils often used in hydraulic systems, LVDTs from RDP Electronics Ltd are ideal for providing feedback for control valve positions.
Preview for the print media for Seica SpA for Productronica, Munich, November 15st – 18 th 2011, Hall A1, Booth 445, New Munich Trade Fair
Seica, dedicates a specific space to automation, presenting the Pilot V8 Flying Prober with automatic loader, the innovative in-circuit and functional line tester, Compact SL, and the model Top-bottom of Firefly Laser Selective Soldering. In addition, it will be possible to view the RTE-200 Boundary scan system, a combination of Analog test and Boundary scan performance.
3DX-RAY takes the industry out of industrial x-ray inspection
3DX-RAY has announced CatSpect, a new software module, within the 3DX-RAY standardised software suite, that will make the analysis of items even easier for customers. A brand new icon-based interface enables quick and simple set up of analysis parameters and other functionality requirements - whether users are setting up highly automated, rapid, in-line scanning, batch inspection or one-off scans. The new software will be implemented across 3DX-RAY's entire range of industrial x-ray screening products.
Practical Components to Premier New Amkor PoP Stacked Packages at SMTAI 2011
Practical Components Inc., including the new TMV PoP, will be exhibiting its full line of dummy component packages in Booth #604 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
Cobar’s Easy-to-Use Cobrush Featured in the IPC’s First Ever Hand Solder Competition
Cobar Solder Products Inc. announces that its Cobrush flux applicator was demonstrated at the First Ever Hand Solder Competition at the recently held IPC Midwest exhibition. A precise, inexpensive and handy tool for applying liquid flux to tiny chip components as well as individual solder joints, Cobar's Cobrush flux applicator puts flux only where it is needed — in just the right amount — and is ideal for applying liquid no-clean fluxes to any site that needs to be soldered. It is disposable and compatible with many different types of fluxes. Its fine bristle tip allows the user to apply flux to very small areas in densely populated assemblies. This inexpensive applicator cuts down on waste and prevents overfluxing, thus reducing possible cleaning time and preventing contamination.
Cobar Solder Products to Introduce SELective Soldering Package at SMTAI 2011
The Balver Zinn Group announces that Cobar Solder Products Inc. will introduce a complete SELective soldering package in Booth #314 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
LEEF Produces Finer Meshes
Single-part meshes and grids for a wide range of applications are proven to be cost effective alternatives to their woven wire mesh counterparts. In the majority of cases they provide superior performance, tailored to the specific application and size and shape requirement. When used in charged applications such as RFI shielding, they offer enhanced conductivity by having no cross-over areas and facilitate far easier electrical termination, by having integrated bus bars.
Nihon Superior to Introduce the Newest Addition to the SN100C Lead-Free Solder Series at SMTAI 2011
Nihon Superior Co. Ltd., will introduce the newest addition to its SN100C lead-free solder series, in Booth #310 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
Learn About Kyzen’s New AQUANOX A4638 Advanced Packaging Cleaning Chemistry at SMTAI 2011
Kyzen, will feature its new AQUANOX A4638 Advanced Packaging Cleaning Chemistry in Booth #500/501 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
See Aqueous Technologies’ Environmentally Friendly Trident XLD at SMTAI 2011
Aqueous Technologies Corp., will highlight the Trident XLD in Booth #505 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
Juki to Demonstrate Industry-Leading SMT Assembly Systems at SMTAI 2011
Juki Automation Systems, will exhibit its KE-1080 modular placement system and FlexSolder W510 in Booth #309 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
SEHO Systems to Showcase Its SelectiveLine at SMTA International 2011
SEHO North America, Inc. will showcase its SelectiveLine soldering module in Booth #237 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
New 1200V/5A SiC diodes from SemiSouth offered in true surface mount DPAK packaging
SemiSouth Laboratories, Inc., has launched new 1200V/5A diodes in the true, compact DPAK (TO-252) surface mount packaging which provides the necessary creepage distance and does not require a center pin.
ACD to Highlight Offshore Manufacturing Services at SMTA International 2011
ACD, manufacturing services in Booth #529 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. Since 1984, ACD has worked hard to meet or exceed customers' requests and requirements. ACD recognizes that its customers outsource their manufacturing needs for several reasons. Among those reasons are to reduce cost, to maintain focus on core activities and to leverage similar business processes between unrelated industries.
3M’s new silicone laminating adhesive tapes solve the problem of bonding to silicone and other hard-to-bond substrates
3M, has used its continuous innovation and creativity to develop and introduce three new lines of 3M silicone laminating adhesive tapes, giving OEMs and converters the ability to achieve high bond strengths to silicone, one of the hardest to bond surfaces because of its very low surface energy.
Only solder solders, the rest suffer
Soldering, 3-D placement and the future of high-precision screen printing: These were the topics addressed during Essemtec's Technology Day, which took place in Aesch, Switzerland, on September 8, 2011. More than 100 people visited the free event, making it a success for all.
Teknek To Present At Aimcal Web Coating Conference
Teknek presentation will focus on the appropriate application of contact cleaning within the production of coated products. In particular the talk will look at the impact of contamination in emerging technologies such as OPV (Organic Photovoltaic) and plastic electronics where the requirement for high barrier coatings means that even miniscule defects are detrimental to product lifespan.
Viscom Appoints Representative in Spain and Portugal
Viscom AG, a leading supplier of AOI and AXI inspection systems in the electronics industry, is now working with SILGAL IBERICA S.L. as its new representative for the entire Iberian peninsula. SILGAL will represent Viscom throughout Spain and Portugal. With the company's expertise in electronics production – from paste print to the soldering and refinement of products – SILGAL also is a competent contact partner where investment in AOI and AXI systems are concerned.
STI Electronics Introduces Alternative to Standard Rigid Arrays
Electronics, Inc., has introduced its new Micro-Coil Spring Array as an improved alternative to standard rigid arrays.
New Tip Extraction Machine From Purex
Purex International has developed a new fume extraction machine to protect workers from exposure to hazardous solder fumes. When soldering without effective control, solder flux fume is likely to enter the breathing zone of the solderer causing the development of occupational asthma, long term carcinogenic diseases, damage and irritation to the respiratory tract, and other serious complaints.
Post-Assembly Test for PCBs
Multitest has expanded its post assembly, flying probe test capacity to meet the growing demands of PCB assembly. As ATE assemblies become more complex, the probability of costly delays increases.
