HGST Reaches 10-Nanometer Patterned-Bit Milestone
HGST is leading the disk drive industry to the forefront in nanolithography, long the exclusive purview of semiconductor manufacturers, by creating and replicating minute features that will allow the doubling of hard disk drive (HDD) density in future disk drives.
Multitest’s MT9510 Test Handler Selected By Melexis For Gesture Recognition IC
Multitest has today announced that Melexis has chosen Multitest's Standard MT9510 Pick and Place Test Handler for an infrared, light sensing application. Multitest cooperated closely with Melexis to successfully develop a dedicated conversion kit to support this sensor application by integrating a 3rd party stimulus provided by Melexis.
Intertronics Pots the Green For Variohim
In setting up a new production project for in-house potting of temperature probes the engineers at Variohm considered a number of well-known industry standard potting compounds – and they called in the materials specialists at Intertronics.
Elite Electronic Systems Grows with Europlacer
Elite Electronic Systems has been a long-term user of Europlacer placement systems, having bought its first Progress 6 back in 1997 and following a very successful period of steady growth over the ensuing years increased to three lines of high-technology assembly equipment, including Europlacer iineo machines purchased in 2010 and 2011.
MagnaChip Selects Synopsys' Proteus LRC for Lithography Verification
Synopsys today announced the adoption of Synopsys' Proteus LRC by MagnaChip Semiconductor Corporation. MagnaChip uses Proteus LRC in their production mask synthesis flow to identify hotspot locations in designs that are sensitive to variations in the manufacturing process.
Viscom presents new XM camera module for extreme cycle times and highest inspection depth
Viscom AG has developed a totally new camera module. The new XM camera module was introduced for the first time at the IPC APEX EXPO that took place February 19-21, 2013 at the San Diego Convention Center in California.
BPM Microsystems to debut improved configuration of its model 3800 automated programming system at the IPC APEX Expo
BPM Microsystems announces that its model 3800 automated programming system is now available with a side-mount option for the V-TEK TM-50 tape output media. This reconfiguration offers additional flexibility by allowing the machine to utilize options for tape, tray, tube and marking simultaneously.
Infineon Completes 300-Millimeter Thin-Wafer Production Qualification
Infineon Technologies has achieved a major breakthrough in the manufacturing of power semiconductors on 300-millimeter thin wafers. In February, the company received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at the Villach (Austria) site. The production process based on the new technology has completed qualification from start to finish and customers have given the go-ahead.
Key Electronics Chooses Cogiscan for Factory Wide Traceability
Cogiscan announces that it was selected by Key Electronics to expand its existing traceability structure into a complete Track, Trace and Control system that spans the entire factory. In early 2012, Key Electronics purchased two new Juki pick-and-place lines equipped with Juki's IFS-X2 (Intelligent Feeder System) and Traceability options, which utilize Cogiscan technology.
Juki to Introduce Ultra-Fast Setup Software from KIC for JT Reflow Ovens
Juki Automation Systems announces that its JT ovens will be shipping standard with KIC's Auto-Focus software. The new capability will be launched at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California
New Micro Drill from Intertronics for PCB Rework
The new CircuitMedic Micro Drill system from Intertronics is versatile and powerful – making it ideal for milling, drilling, grinding, cutting and sanding circuit boards. It removes coating, cuts circuits, cuts leads, drills holes, cuts slots, shapes FR4 and performs many other procedures using various interchangeable bits.
Going Green: Europlacer Upcycles Old Machines into New Solution
Europlacer debuts Project iico, a concept that combines outdated systems with new, innovative parts to result in an environmentally smart, technologically advanced assembly system. In the 1990s and early 2000s, Europlacer manufactured then-progressive placement systems, EP600 and Progress6.
A New Technology for Void-Free Reflow Soldering Is Now Available
SEHO Systems now offers a new technology for virtually void-free soldering results with the MaxiReflow HP. Whether for power electronics, electronic aviation systems, medical equipment or electronic systems for the automotive industry, voids in solder joints represent one of the main problems.
New High-Speed Pick & Place Machine From Manncorp For LED Board Production
Manncorp introduces the MC-LEDV3, a new high-speed pick and place machine built to assemble LED tube lights, flexible LED strips and LED bulb boards. The MC-LEDV3 features three pick-and-place heads mounted on a high-precision, ball-screw-driven gantry. Simultaneous pickup, on-the-fly (vision based) component alignment, and feeder placement optimization combine to achieve placement rates of up to 10,000 LEDs per hour, per IPC-9850.
UMC Adopts Synopsys IC Validator for Pattern Matching-Based Lithography Hot-Spot Verification at 28 nm
Synopsys today announced that United Microelectronics Corporation has selected Synopsys' IC Validator physical verification product for lithography hot-spot checking at the 28-nm process node. UMC standardized on IC Validator pattern matching, a patented technology enabling ultra-fast detection of manufacturing-limiting layouts, which can dramatically accelerate final design signoff.
Essemtec Premiers the Innovative Reflow Oven Control Deluxe Duo
RO-CONTROL and RO-SOFT from Essemtec are state-of-the-art software packages for simulation, control and documentation reflow and curing ovens and processes. Operators, process engineers and quality managers profit from the advanced functionality of the new version 7. Beginning January 2013, all new Essemtec reflow ovens from the RO300 and RO400 series are delivered with RO-CONTROL 7 and RO-SOFT 7. Both software packages require Windows 7 and can be upgraded from older versions.
GLOBALFOUNDRIES and Samsung Support New Cadence Virtuoso Advanced Node for 20- and 14nm Processes
Cadence Design Systems announced today that two of its major foundry partners—Samsung Foundry and GLOBALFOUNDRIES—are supporting new Cadence custom/analog technology targeting designs at the advanced nodes of 20 and 14 nanometers. The two foundries are providing SKILL-based process design kits for the newly introduced Cadence Virtuoso Advanced Node.
Cadence and GLOBALFOUNDRIES Collaborate to Enable Custom/Analog and Digital Design of 20nm Manufacturing Process
Cadence Design Systems announced today that GLOBALFOUNDRIES has certified essential Cadence technologies for custom/analog, digital and mixed-signal design, implementation, and verification for its 20-nanometer LPM technology. The certification covers the Virtuoso and Encounter platforms, including the industry-standard SKILL process design kit (PDK).
Intertronics And Liquidyn Enhance High Performance Dispensing Applications
As technologies develop in industries such as electronics, energy, packaging, medical devices, cosmetics and pharmaceuticals and automotive, Intertronics have understood the need for ever more precise, reliable dispensing of micro quantities of adhesives and similar materials.
Kilopass NVM IP Achieves JEDEC Qualification on High-Demand SMIC 65/55/40nm Processes
Kilopass Technology and Semiconductor Manufacturing International Corporation today announced that Kilopass IP has successfully completed the JEDEC 3-lot qualification for the SMIC 65nm, 55nm and 40nm low-leakage (LL) CMOS process technologies. Kilopass provides designers tamper-resistant, highly reliable NVM IP based on SMIC's processes.
Decrease failure rates and increase yields with advanced Sherlock-300F benchtop AOI system
Manncorp introduces the new Sherlock-300F, a benchtop automated optical inspection (AOI) system that has a radical new design with advanced features to provide comprehensive defect coverage even on densely populated boards with components as small as 01005s.
FleX Silicon-on-Polymer Available With TowerJazz Foundry CMOS
American Semiconductor announces TowerJazz is the first foundry with a CMOS process, CS18, available for physically flexible wafers and ICs utilizing FleX Silicon-on-Polymer. This announcement was made at the 12th annual Flexible & Printed Electronics Conference presented by the FlexTech Alliance held in Phoenix, Arizona on January 29 - February 1, 2013.
Inovar Chooses Juki Again
Juki Automation Systems has announced that Inovar recently purchased three KE-1080EN High-Speed Flexible Mounters. "Inovar has enjoyed an excellent partnership with Juki for many years. In this partnership, Inovar has found that the Juki pick-and-place equipment is tuned very well to the mix of business that we do. The purchase of our new Juki machines helps us to continually drive to exceed our customer expectations of quality and on-time delivery," said Craig Rupp, President of Inovar.
Rehm Thermal Systems Announces Three Next-generation Soldering Solutions
Rehm Thermal Systems announces its next-generation advanced packaging and semiconductor solutions with no atmosphere – the Vacuum Soldering process. Rehm offers three VS Series Vacuum Soldering system models. They're all small, all powerful, and all low cost. The VS320, the VS160UG, and the VS160S benchtop each feature fast heating and cooling rates with easy profile setup and editing plus data logging.
Intertronics Discuss Microcapsules In Adhesive Dispensing Technology
These days, we can find microcapsules in almost every industrial sector, where they take numerous roles. However, dispensing these fragile materials can be a problem since clearly it is important that the microcapsules be undamaged by the dispensing process. In adhesive technology, microcapsules can fulfil several functions. For example, microcapsules may be an integral part of the control of reaction and curing processes. Some anaerobic "threadlocking" adhesives contain microcapsules.
Suntron Increases Placement and Inspection Capabilities for Miniaturized Medical Devices
With medical device OEMs requiring smaller, lighter, and longer lasting devices, Suntron Corporation announces that it has the capability to place and inspect the tiny packages needed for miniaturized medical device electronics. Suntron builds highly complex boards with 01005 components requiring the control of many variables during assembly process.
Super Dry features Oxidation Free Alternative To Component And PCB Baking At IPC APEX
Super Dry will feature their award winning oxidation free component and PCB drying technology at booth #504 during February's IPC APEX Exhibition in San Diego. The process will be highlighted there in the Super Dry XSD 701 desiccant dry cabinet. Designed to exceed the formidable challenges associated with IPC J-STD-033C and 1601 for handling Moisture Sensitive Devices, XSD desiccant cabinets deliver a process combining ultra low humidity (<0.5%) and mild temperatures (40-60C) proven to replace traditional oven baking of components and boards at a fraction of the cost.
Etek Europe Installs an SCS Precisioncoat Spray and Dispense System in Its New Technology Center
Etek Europe has installed an SCS Precisioncoat Spray and Dispense System in its new custom-built Technology Center. The SCS Precisioncoat spray and dispense system precisely applies 100 percent solids, solvent- and water-based coatings, such as photoresists, acrylics, adhesives, solder mask and anti-microbial coatings, to virtually any surface or substrate, with maximum accuracy.
Higher Profitability Due to Essemtec 16 - 24 mm hyQ Feeder
Variable width feeders increase the flexibility and reduce the total number of required feeders in production. Essemtec now introduces the PC-TF16-24 hyQ feeder for Paraquda and Cobra pick-and-place machines. The new feeder can be used for both 16 and 24 mm tape widths.
New and Improved Technical Specification for the Nordson DAGE XD7800 Ruby XL X-ray Inspection System
Nordson DAGE has today announced the new and upgraded technical specification for its class leading X-ray inspection system dedicated for large area printed circuit boards. Now known as the XD7800 Ruby XL, in keeping with the rest of Nordson DAGE's jewel range of X-ray inspection systems, it is focused and optimized for completely satisfying the needs of the electronics industry.
NRI Electronics Strengthens Capabilities with a Juki Mounter and Tray Changer
Juki Automation Systems announces that NRI Electronics has acquired a KE-2080EN High-Speed Flexible Mounter and TR-6DER Matrix Tray Changer. The new placement machine and tray changer better enable NRI to provide world-class electronics manufacturing services to the defence, aviation, medical, industrial and communications markets from its Anoka, MN plant.
GOEPEL’s RPS3000 Inline Programming System combined with Embedded Test
GOEPEL electronic recently introduced additional RAPIDO series inline production systems for high-speed programming as well as board test based on the newest Embedded System Access technologies. The new models named RPS3000-(x) support double-sided probing for up to 3000 nails. Non-volatile memories such as Flash, Microcontrollers and Programmable Logic Devices can be on-board programmed even faster and more reliably.
Count On Tools Debuts New Accessories for StripFeeder Modular System
Count On Tools introduces additional accessories for its revolutionary StripFeeder System for loading tape-and-reel components onto compact modules for prototype and high-mix/low-volume applications. The StripFeeder .mod (Modular) System features removable rails that can be mounted to accommodate a wide array of tape sizes in the same feeder.
The Endless Piston Pump Technology For Precision Dispensing
Intertronics have today announced the release of a new whitepaper on the technology of high precision, high repeatability in the dispensing of fluids, pastes and 2 part mixes – even with abrasive fillers. The paper describes the concept and execution of such a system with notes on its use and application.
G-TAP – versatile Contacting Solution for Assembly Test
The G-TAP is not a single product but an overall concept, because the module can be utilized in stand-alone operations as well as an integrated solution in existing electronic and optical test systems such as Flying Probers, In-Circuit Test or AOI systems.
EKRA ezLOAD Board Support System from Count On Tools
Count On Tools has today announced the launch of the new ezLOAD PCB Support System for EKRA Screen Printers. Count On Tools recognizes the need for more affordable board support options in the electronics manufacturing industry and has delivered an innovative design that is not only easy to setup and install, but also offers industry-leading benefits to electronics manufacturing service providers and contract manufacturers worldwide.
Innokas Medical Purchases 2 More Mek iSpector AOI systems
Mek Europe BV and its distributor, Eltraco, have recently announced the installation of yet another Mek AOI system within Innokas Medical Oy. Innokas Medical recently commissioned an iSpector HDA 650 in its Kempele HQ site and an iSpector HDL 650 in its Estonia site, complementing systems in operation at other locations throughout Northern Europe.
Advantest Develops EB Lithography System for 1Xnm Node
Advantest has announced that it has developed a new EB (electron beam) lithography system, the F7000, with superior resolution performance meeting the requirements for 1Xnm technology nodes. The F7000 supports substrates of diverse materials, sizes, and shapes, including nanoimprint templates as well as wafers, and is optimized for diverse applications such as advanced LSIs, photonics, MEMS, and other nano-processes.
Techcon Systems Introduces New Non-Contact Jetting Technology
Techcon System introduces the new TS9000 Series Jet Tech valve. The Piezoelectric driven, non-contact Jet Tech valve is capable of handling fluid viscosities to 2 million Cps. Jet Tech offers a fast jetting action that produces hundreds of accurate deposits in less than one second.
Clean Room Facility for Medical and Disposable Single-Use Cable Assemblies
Contour Electronics has today officially announced the recent addition of a 200m2 ISO Class 7 clean room for the manufacture of medical and disposal single-use cable assemblies in their far eastern manufacturing facility. The clean room represents a significant investment with the facility equipped to cover the entire production chain from cable manufacturing through to injection moulding, assembly, test and packaging.