Production
OIPT launches Nanofab800 Agile System
Leader in processes and systems for etching, deposition and growth, Oxford Instruments Plasma Technology (OIPT), has just launched the Nanofab800Agile System. This new tool extends the Nanofab range of highly flexible tools and proven processes which deliver catalyst treatment and controllable growth of nanotubes and nanowires, in addition to delivering standard & high temperature PECVD.
Rogers Corp - Laminates for Lightweight, Low-Cost Antenna Designs
The Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced its RO3730 laminates, tailored for the special needs of high-frequency antenna designers requiring cost-effective PTFE laminates. These ceramic-filled laminate materials are reinforced by woven fiber glass with optimized glass and filler loading for excellent structural stability and outstanding electrical performance.
SMD printing technology day
Perfect solder paste printing is neither coincidence nor witchcraft, but a question of the correct materials and technologies. Essemtec, Koki and Koenen are organizing a printing technology day that will highlight the interaction of paste, stencil, machine and design. The event takes place in Maarssen, Netherlands, on September 30th, 2009 and is free of charge.
Agilent Technologies' IO Libraries Suite Now Supports Windows Vista 64-Bit and Windows 7
Agilent Technologies Inc. today announced the release of its IO Libraries Suite 15.5 software for using instruments from a test and measurement program. Enhancements include support for Microsoft Windows Vista 64-bit and Microsoft Windows 7 (32-bit and 64-bit). The 15.5 update delivers cutting-edge OS flexibility for users of IO Libraries Suite in the environment of their choice. The Suite 15.5 release demonstrates Agilent's commitment to deliver a reliable connectivity experience for users of electronic test equipment.
PCB Conformal Coating Features Fast Tack Free Cure
Moisture-curing silicone conformal coatings are ideally suited as protective coatings for sensitive board components in demanding environments. However, electronic manufacturers avoided the use of silicone coatings in electronic packaging due to their long cure schedule that did not allow rapid assembly. Master Bond has developed a rapid tack free, ready-to-use silicone conformal coating called Master Sil 773, formulated to provide excellent protection to electronic circuitry in high humidity environments as well as upon exposure to shock and vibration. It cures quickly at ambient temperatures to a highly flexible, transparent, low hardness silicone coating. Adhesion to critical board components is outstanding.
Form-in-place (FIP) gaskets
Form-in-place (FIP) gaskets have been part of the mainstream enclosure industry for many years but the cost and physical size of robotic application has been a major constraint for SMEs – until now. Those clever people at Intertronics have focused on bench-top robotics and matched compliant gasket materials to provide low cost equipment to suit boxes or housings from 200mm x 150mm, e.g. junction boxes, terminal boxes, control boxes, electronic housings, small mechanical gearboxes or other. They have dramatically cut entry cost to around £4,000 on the smallest – with larger equipment running right up to 800mm x 600mm machines.
Consolidation at AWS as it creates Centre of Excellence for Aerospace & Defence
AWS Group has recently consolidated its two Staffordshire operations at its Newcastle under Lyme site, and in the process, has created a new facility designed for growth incorporating a Centre of Excellence for the production of electronic assemblies for a range of sectors including military and aerospace.
Rogers Introduces Laminates with reverse-treated copper foil
Rogers Advanced Circuit Materials (ACM) Division announced its new reverse-treated copper foil option on RO4000® series laminates. The RO4000 LoPro™ laminates are enabled by special interface technology to be made with very low profile reverse-treat copper foil while maintaining copper peel strength equal to or better than standard RO4000 materials. RO4000 LoPro laminates combine the best in class electrical and thermo-mechanical reliability of RO4000 laminates with improved insertion loss and outstanding passive intermodulation (PIM) characteristics.
Essemtec’s FLX2011-MK Places Smaller Components on Flexible Circuits
The FLX2011-MK, Essemtec's production center for flexible circuits and membrane keyboards, is now equipped with a jet valve dispensing system, allowing it to place smaller SMD components and LEDs on flexible circuits. The jet valve dispenses small glue dots more accurately and faster than others, and is contactless.
Moisture-Resistant Gasketing Resin From Intertronics
Intertronics has announced a moisture-resistant gasketing resin from DYMAX for sealing electrical conduit boxes, appliance housings, and critical electronic assemblies and devices. Ultra Light-Weld GA-111 is a UV/Visible light-curable form-in-place (FIP) gasket developed for applications requiring low compression set, tack-free surface, and durable, reliable sealing. It is a soft gasket material with high adhesion to metals while providing a barrier to prevent absorption or penetration of air, dust, moisture, liquids and gaseous substances.
Agilent Technologies Introduces NanoSuite 5.0 Software for More Powerful Nanomechanical Testing
Agilent Technologies has announced the availability of a new, more powerful version of its popular NanoSuite software package (formerly known as TestWorks). Designed for use with the company's line of nanoindentation and tensile-testing instruments, Agilent NanoSuite 5.0 software offers advanced features such as enhanced imaging capabilities, survey scanning and a new test method development environment. All NanoSuite 5.0 functions have been optimized to help researchers run tests and manage data with unprecedented speed and ease.
Wilson Process Systems invests in new equipment
Wilson Process Systems (WPS) has recently concluded a new round of investment which has seen the company expand its manufacturing capabilities and add a second manufacturing location. The moves are aimed at continuing the Hastings-based company's impressive growth, which has seen WPS more than double its turnover to £10M in the last eight years.
Medical Devices Adhesives Guide Released By Intertronics
Leading adhesives specialist company Intertronics has released an enhanced version of the comprehensive DYMAX Selector Guide on MD Adhesives for Medical Device Assembly. This valuable tool contains a number of charts intended to help R&D engineers and product designers choose the appropriate adhesive for their application. All DYMAX MD Adhesives are biocompatibility tested in accordance with ISO 10993 and/or USP Class VI.
Threebond's High Peel And Impact Resistant “Instant” Adhesives
The ThreeBond 7700 Gold Label series of premium cyanoacrylate instant adhesives has recently been joined by the TB7737 and TB7738 offering ultra high peel and impact resistance by virtue of their added elastomer toughening. This strength enables the TB7737 and TB7738 to be used in areas where conventional "instants" would not survive, e.g. hotter/harsher environments.
AWS Group expands Fast Track AWS Group capability
AWS Group has announced that following the success of its 'Fast Track' operation at AWS Cemgraft in Newbury, a similar service and facility has been set up at AWS Ltd on its Newcastle-Under-Lyme site, providing a turnaround of prototyping or urgent low volume production orders within five to ten days.
National Instruments New Embedded Vision System for Automated Visual Inspection
National Instruments has announced the release of a new embedded vision system that gives manufacturing engineers and system integrators the ability to build high-speed real-time machine vision systems for applications such as sorting products, verifying assembly and inspecting packaging. The NI EVS-1464RT Embedded Vision System is a high-performance, multicore controller capable of processing images from multiple IEEE 1394 and GigE Vision cameras. Additionally, the EVS-1464RT features an extended temperature range, a real-time operating system, a solid-state hard drive and a fanless design, making it ideal for use in harsh industrial environments.
LED Light Cure Saves Time, Extends Life
The Bluewave LED system from Intertronics has no bulbs to degrade or need changing, cures without adding heat and offers constant light intensity for thousands of hours without re-calibration. This makes it ideal for visible light spot curing of coatings as well as adhesive bonding of polycarbonate, PVC, PET, metal, glass and many other substrates.
Conformal coating from Intertronics is Tack Free In 3 Minutes
Conformal coating of electronic assemblies is an often vital protection measure in industries such as automotive, aviation, consumer electronics, domestic appliances and industrial meters and controls – and it is one much under consideration at the present time. Peter Swanson, M.D. at Intertronics explained "there is always great pressure on cycle time for pcb assembly and the cure time of traditional conformal coatings is frequently seen as a bottleneck. Turbo-Coat dries tack-free in 3 minutes and we are delighted therefore that Techspray have again managed to be one step ahead of the pack. Their Turbo-Coat quick dry product is just what is needed to significantly improve efficiency in this area."
Enzmann launches new website as part of company makeover
Christian Enzmann GmbH, the independent supplier of printed circuit board prototypes, quick turns and volume series for the automotive, industrial, medical and aerospace markets has its redesigned web site. Following the recent introduction of a new system for maximum accuracy and precision in registration and drilling of multilayers, Enzmann's new site continues the project of gearing up for a future of next-generation RF designs.
Low Temperature Cure Surface Mount Adhesive Bonds Micro-Chips In Place at 80°C
The TB2217H low temperature cure chip bonder from ThreeBond offers curing at 80°C and addresses an array of chip bonding issues for manufacturers and rework facilities. This single component epoxy offers ease of handling by syringe and full compatibility with automated dispensing systems to enable chip retention on pcb's going through multi-station lines and wave soldering equipment.
AWS increases capability of SMT line to process larger boards
AWS Cemgraft - part of the AWS Group, has recently invested to upgrade its surface mount production line to handle large boards. In response to an enquiry from a leading industrial computer manufacturer, Cemgraft worked with key suppliers including surface mount assembly equipment maker, Juki Automation Systems and reflow oven manufacturer, Heller Industries supplier by ZEN Production Equipment to develop its automated line be able to handle boards measuring 663x145mm. Previously, the longest board that could be handled was 510mm.
Nextreme Breaks Temperature Barrier With Latest Optocooler
Nextreme Thermal Solutions claims its OptoCooler HV14 is the industry's first high voltage, low current thin-film thermoelectric cooler (TEC) targeted at laser diode cooling for the telecommunications market to achieve a 60°C temperature difference between its cold and hot sides. This temperature difference, known as the ΔT, reflects the ability of the device to pump heat efficiently. For customers in the optoelectronics and telecommunications industries, this translates to improved cooling performance, lower input power requirements and greater efficiencies for solving thermal management issues in electronic packages.
Six new products to be launched by Teknek at IPC/APEX
Teknek, a leader in contact cleaning technology, is to launch six new products at the IPC/Apex show in Las Vegas. Teknek's Surface Mount Clean Machine (SMT09), designed for the electronics assembly market, has not only undergone a redesign but it now incorporates full static monitoring to ensure that static levels on outgoing boards are below levels pre-set by the customer. This machine is combined with Nanocleen, the world's first silicone free contact cleaning system which not only offers unprecedented cleaning performance but also dissipates static.
Contact Cleaning System From Teknek
Teknek has launched Nanocleen, said to be a new generation of contact cleaning technology with advanced contamination and static control features. At the core of the Nanocleen system is a specially formulated roller and adhesive roll.
SIPLACE 3x8 mm shutterless S-feeder improves component supply
S-series tape feeders have been important components of Siplace placement machines for many years. With its new 3x8 mm shutterless S-feeder, Siemens Electronics Assembly Systems (SEAS) has introduced another improved version in the series. Fewer movable parts mean longer life and more reliability. The new feeder also handles a broader spectrum of components and makes the user's job easier. As a special benefit, owners of classic 3x8 mm feeders can have them upgraded to the shutterless version.
New website from ThreeBond
Under the heading "Creating our future from a single drop" www.threebond.co.uk is quick and easy to use while covering new products and recent application news presently including motorcycle and electronics assembly, with a standard drill down menu which leads to 14 product areas covering industrial adhesives, locking agents, sealants, electronic adhesives and potting, automotive gaskets, sealants, gaskets and the new Ultra Glass car paint protection system, also cyanoacrylate "instant" adhesives and motor sport products.
Metal-Core PCB circuits with pre-applied thermal interface material accelerates assembly process
Bergquist has introduced its T-CLAD Metal-Core PCB circuits pre-applied with Bond-Ply 450 adhesive tape. The reflow-resistant thermal interface tape saves product manufacturers from manually applying thermal interface material after assembly. This streamlines production, allowing to quickly bond the MetalCore PCB to a heatsink avoiding laborious attachment of individual screws or clips.
Harwin launches high quality subcontract manufacturing services
Harwin announced the formal launch of its subcontract manufacturing capabilities at the Southern Manufacturing & Electronics Exhibition. In fact, Harwin has always undertaken contract manufacturing work utilising the capacity that it has in its manufacturing facility. Harwin has a policy of replacing all its production equipment - stamping, turning, moulding and plating – every five years, so the company always has a state-of-the-art facility which is required to support the manufacture of its high reliability interconnect components.
New Vision Makroptic Delivers Digital Inspection
Vision Makroptic is a new digital inspection system from Vision Engineering, designed to view, inspect and capture high resolution images. With a 36x optical zoom, Vision Makroptic can capture samples up to 205mm wide; then simply zoom in for further feature analysis.
AWS Group investment in new ERP system leads to increased efficiency and reduced costs
AWS Group has recently completed the installation of a common, Group-wide Enterprise Resource Planning system which coordinates all the resources, information and activities needed to complete business processes.
Moisture resistant gasketing resin from Intertronics
Intertronics has introduced a tack-free, soft gasket material from sales partner, DYMAX, for sealing fuel cells, appliance housings, and critical electronic assemblies and devices. Light Weld GA-140 is a UV/Visible light-curable form-in-place (FIP) and cure-in-place (CIP) gasket developed for applications requiring low compression set, tack-free surface, and durable, reliable sealing. It is a soft gasket material with high adhesion to plastics which provides a barrier to prevent absorption or penetration of air, dust, moisture, liquids and gaseous substances.
Silicon sealants from ThreeBond are ideal for electronics
ThreeBond TB1220 series are silicon sealants which show major advances in terms of curing speed and storage. Improvements have been achieved, making the TB1220 adhesive sealants especially suitable for bonding, fixing, sealing, coating or potting of electrical and electronics parts, also in sealing connectors, dielectric sealing and in moisture proof coating.
AWS Group delivers Whole Life Support services
Through strategic acquisition and a planned business approach, AWS Group, one of the UK's leading independent Electronic Manufacturing Solutions (EMS) providers, is now is an excellent position to offer Whole Life Support services to the electronics manufacturing sector. The group comprises AWS Cemgraft, AWS Electronics, AWS Slovakia and AWS Jantec, with each company specialising in a different manufacturing function, from initial design and prototyping, through volume manufacture to maintenance and repair.
Fabs that benchmark perform better says NMI
Benchmarking is a vital activity for the UK and Ireland's semiconductor manufacturers according to a recent survey by the National Microelectronics Institute (NMI), the trade association representing the semiconductor industry in the UK and Ireland. The survey entitled 'How do you measure up?' analysed data from the 15 wafer fabrication plants in the NMI's membership, representing the majority of the manufacturing capability in the UK and Ireland. It addressed topics including yield, cycle time, technical capability, productivity, operational efficiency, industry suppliers and human resources.
EMI gasket from Chomerics delivers 70dB shielding effectiveness
Chomerics Europe, a division of Parker Hannifin, has introduced a new ultra-soft moulded elastomer EMI shielding gasket. CHO-SEAL 1270 is ideal for use in designs where superior mechanical performance, excellent electrical conductivity, and long term stability are required. Typical applications can be found in handheld electronics, infotainment systems, test equipment, military electronics, navigation devices, ruggedised computers and routers
Low closure force EMI shielding gasket from Chromerics now available in strip form
SOFT-SHIELD 4850 from Chomerics Europe – a division of Parker Hannifin, is now available in convenient strip form as well as sheet material. SOFT-SHIELD 4850 is an EMI shielding gasket that utilises multi-planar, Z-axis conductive foam technology to help it deliver shielding effectiveness in the range of 70 to 80dB. The material has a lower closure force, lower compression set, and is up to 20% lower cost than fabric-over-foam gaskets.
134.2KHz LF RFID Ear Tag is suited for cattle or pigs lifecycle tracking
DAILY RFID CO.,LIMITED has announced the launch of new LF(125KHz and 134.2KHz) RFID Ear Tags for animal tracking and management.The RFID ear tag is constructed from polyurethane,which is used in healthcare,specially for better control of livestock disease .
RFID Metal Tag-08, the smallest RFID tag for metal surfaces
The leading RFID products producer in China-- DAILY RFID（www.rfid-in-china.com）,has developed HF Metal Tag-08 RFID tag for use in metallic enviornments.This passive RFID tag is designed in a very small size only diameter 13mm round and suitable for on metal tagging,with a reading range of up to 3cm.The price is even lower than 1.0 USD.
Altatech Introduces Advanced Materials CVD and ALD Tool
Altatech Semiconductor has announced the AltaCVD, an advanced materials chemical vapor deposition (CVD) and atomic layer deposition (ALD) tool. Based on Altatech's vaporizing technology enabling the deposition from new, viscous and non-volatiles precursors, AltaCVD offers new capabilities to R&D facilities and pilot productions lines.
Altatech Adds Features to its High Throughput Wafer Macro Inspection System
Altatech Semiconductor has made major enhancements to AltaSight, its full field high throughput wafer macro inspection system. The novel concept of wafer positioning allows the system to simultaneously inspect the front side and the back side of the wafer (200/300 mm), while the throughput remains at a high 100 wph.
