Production
New Form-in-place EMI gasket material simplifies assembly and reduces total cost of ownership
Chomerics Europe - a division of Parker Hannifin has introduced a new one component, form-in-place (FIP) EMI gasketing material. CHO-FORM 5547 is designed for use in applications such as portable equipment, telecoms, and military and marine products.
ESSEMTEC to Highlight Flexible Swiss Made Solutions at IPC/APEX 2011
Essemtec announces that it will feature a range of new equipment in Booth #773 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Designed for Best Production Flow: Multitest’sMT2168 Shows Best Jam Performance in the Field
Multitest is pleased to announce that its MT2168 has proven its high production performance in the field. Best jam rate statistics are evidence of the successful new design concept.
Chemically Resistant Epoxy Withstands a Year in Sulfuric & Hydrochloric Acid!
For applications demanding exceptional chemical resistance, especially to acids, fuels, and oils, Master Bond has developed EP21AR. Whether coating, lining, bonding or sealing, this two-component epoxy can withstand harsh, acidic environments, including prolonged immersion in 96-98% sulfuric acid and 36% hydrochloric acid for over a year.
Essemtec’s Tower Increases Variosystems Flexibility of Production
Essemtec AG announces that its Tower Automatic Storage System simplifies logistics and increases the flexibility of production for Variosystems, an international electronics manufacturing subcontractor. Variosystems manages thousands of components for its customers' assembly jobs. Until recently, the component storage has required significant effort. Now, with Essemtec's Tucano, component reels and trays can be stored locally in production.
Intertronics at Medtech adhesives and equipment for medical device manufacturers
Intertronics will display their expertise in adhesives for disposable medical device manufacturers at Medtech in April (6-7th) at the NEC. Along with UV, cyanoacrylate and epoxy adhesives, Intertronics will show UV curing equipment, dispensing, application and mixing equipment.
Essemtec’s Tower Increases Variosystems’ Flexibility of Production
Essemtec AG announces that its Tower Automatic Storage System simplifies logistics and increases the flexibility of production for Variosystems, an international electronics manufacturing subcontractor. Variosystems manages thousands of components for its customers' assembly jobs. Until recently, the component storage has required significant effort. Now, with Essemtec's Tucano, component reels and trays can be stored locally in production.
Kyzen to Present Products for Every Process during VIRTUAL PCB
Kyzen will showcase products for every process at the upcoming VIRTUAL PCB virtual tradeshow and conference, scheduled to take place March 8-9, 2011.
Imec installs ASML’s pre-production EUV scanner NXE 3100
At today's SPIE advanced lithography conference, Luc Van den hove, President and CEO of imec, announces during his keynote speech that imec has started the installation of ASML's pre-production Extreme UltraViolet Lithography scanner, the NXE:3100, in its Leuven facility. The installation of the NXE:3100, featuring a considerably higher source power and optimized optics, underscores imec's ambition to bring EUVL to production level.
Essemtec Builds Printer For 180x50 cm
Essemtec will build a production line for LED tubular lamps that will replace the common fluorescent lamps. Essemtec's innovation, a 180x50 cm printing system will enable the full automatic, inline production of such lamps.
JUKI Announces C3 Teknoloji Becomes Arta Teknoloji
JUKI, a world-leading provider of automated assembly products and systems, announces that Halil Erdogan and Necdet Ozyonum from C3 Teknoloji, JUKI's Turkish distributor, decided to dissolve their partnership.
Juki Debuts JX-200LED High Speed Placement System for LED Applications
Juki Corporation, a world-leading provider of automated assembly products and systems, introduces the JX-200LED for the LED assembly market. Targeted specifically for LED manufacturing, the JX-200LED features new algorithms created for the placement of side- and top-view LEDs, rectangular ferrite chip-type and PLCC-type LEDs, making it the ideal low-cost placement solution for LED chips in fast growing markets, such as laptop computers, LCD backlights and various lighting equipment.
Essemtec Builds 180x50 cm Printer for LED Lamps
Essemtec will build a production line for LED tubular lamps that will replace the common fluorescent lamps. Essemtec's innovation, a 180x50 cm printing system, will enable the fully automatic, inline production of such lamps.
In Scotland and Essex, companies expand with MYDATA
New generation MYDATA pick-and-place machines have been chosen by companies at both ends of the United Kingdom – Scotland and Essex – to provide major enhancements to their SMD capabilities. The companies have selected MYDATA machines as offering the most efficient and cost-effective way of handling their growing order inputs and, in both cases, the new equipment will be used alongside existing MYDATA SMD lines.
Blakell Europlacer to Exhibit at SIEL 2011
Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry is to exhibit its XPii-II at SIEL 2011. This exhibition is scheduled to take place 2-5 March, 2011 at La Chargia, Tunis, Tunisia.
Manncorp’s Split-vision Rework Station Has Auto Removal/Placement Head, For Bgas And Qfps
BGAs, QFPs and other fine-pitch devices can now be desoldered, removed and replaced with the BR720 lead-free rework station from Manncorp. Utilizing split-vision zoom optics with 22x magnification, real-time images of components superimposed on solder pads are continuously displayed on the system monitor. Perfect alignment is achieved when operator makes final X and Y micrometer adjustments with LED lighting providing high image contrast.
Manncorp Adds LED Board Assembly Equipment Section To Website
Answering growing demand for equipment dedicated to LED assembly, manncorp.com now includes LED-capable pick-and-place systems -- one of which can also serve as a mid-range placer for today's surface mount components.
SchmartBoard Releases SOIC to DIP Adapter with “ez” Soldering
SchmartBoard, a company that makes prototyping electronic circuits easier, has announced the first offering in a new product family to support the use of Surface Mount Technology (SMT) components with breadboards.
tbp electronics introduces DEK Horizon 03iX screen printers
DEK has confirmed that tbp (the business of perfection) electronics has purchased three of its Horizon 03iX screen printing platforms to drive progressive manufacturing processes for high-end customers. As a leading supplier of electronics manufacturing services in the Benelux region, tbp electronics has adopted DEK mass imaging technologies to help deliver EMS solutions for key industries including medical, petrochemical, safety and test.
Essemtec’s PANTERA-XV Is Ideal for SMEs
Essemtec AG, a leading manufacturer of SMT production equipment, announces that its new PANTERA-XV SMD Placement Machine features an ideal price/performance ratio for SME (Small and Medium Enterprises). The PANTERA-XV is designed for prototype and mid-size series manufacturing. The machine offers ideal combinations of speed, accuracy and wide application range. Additionally, the placement system meets the standards of a high-mix/low-volume production. The application range is large, and placement is both fast and reliable.
Intertronics - LED lamp to complement adhesives for medical devices
New from Intertronics is the DYMAX 1020-M Ultra Light-Weld®, an ultra-fast, tack-free, LED-curable adhesive. Explained Intertronics M.D. Peter Swanson: "It's designed for rapid bonding of a wide variety of plastics typically used in the manufacture of medical devices such as reservoirs, tube sets, port fittings, drug delivery systems and heat-sensitive applications. Visible/UV light-curable 1020-M is formulated for less-than-two-second, on-demand cure with the DYMAX BlueWave® LED Prime UVA spot-curing system."
Europlacer Launches Dual Head iineo-II VLB for Growing LED Assembly Market
Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, debuts the iineo-II VLB. The dual-head iineo-II VLB is the latest enhancement to the Europlacer product portfolio, designed for the growing LED assembly segment.
FINETECH to Showcase Sub-Micron Bonder at IMAPS Device Packaging 2011
FINETECH will showcase the FINEPLACER Lambda in Booth #58 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort in Scottsdale, AZ.
Samsung Electronics approve ALPHA TetraBond frameless stencil technology
Samsung Electronics Hungarian Private Co. LTD. today announced that they will switch their entire stencil requirement at their site in Jászfényszaru, Hungary to ALPHA TetraBond, the new frameless, stencil technology recently launched to the market by Alpha, a Cookson Electronics company.
Assembleon Highlights Electricity Cost Savings In Pick & Place At This Year’s Ipc Apex
Assembléon is stressing the value of energy efficient pick & place at this year's IPC APEX Expo (Las Vegas April 12-14, Booth 508). While saving up to $10.000 in operating costs alone per pick & place machine per year, the low energy consumption of all A-Series solutions in the market today help to drastically reduce the SMT industry's carbon footprint. The company is also using APEX to announce the extension of its compact, modular and economic MC-5 platform. The new MC-5X combines the best features of an MC-5 chip shooter and MC-5 odd form placer, with also well below the industry's average electricity costs.
Essemtec Launches Product Video for Tucano
Essemtec AG, a leading manufacturer of surface mount technology production equipment, announced that the new product video on its Tucano is now available for viewing at www.essemtec.com. The video sequence provides a close-up preview of the small footprint stencil printer in action. Additionally, the video demonstrates the systems' automatic rail width adjustment and easy-to-use software with one-click fiducial training.
JUKI to Highlight Range of Modular SMT Assembly Systems at Southern Manufacturing 2011
JUKI, a world-leading provider of automated assembly products and systems, announces that it is to highlight its range of SMT placement equipment at Southern Manufacturing 2011. This exhibition is scheduled to take place 16-17 February, 2011 at FIVE, Farnborough, Hants.
Oxford Advanced Surfaces delivers high-performance single-layer Anti-Reflective Coating
Oxford Advanced Surfaces Group Plc (OAS) announced that it has successfully developed a nano-particle based anti-reflective coating offering <0.5% reflection on glass and <1.0% on polycarbonate. The anti-reflective coating is applied using an industry-friendly wet application process (spin or dip) offering performance that is directly comparable with PVD-generated multi-layer technologies today. The technology can be applied to different substrates making it suitable for multiple applications, for example in displays, ophthalmic and solar. VISARC coatings will pass standard ASTM testing for steel wool abrasion, tape peel testing and humidity cycling.
Essemtec Relaunches Download Platform
Essemtec, the Swiss manufacturer of production systems, has relaunched its download portal MyEssemtec.com. Essemtec requests all customers and partners to re-register on the new platform. MyEssemtec.com is a part of the Flex-2-services provided by Essemtec. Customers and distribution partners can download all available documents and information about their products and machines, including specifications, operation and service manuals, spare parts lists, and more.
Multitest Experts to Present PCB Pad Wear Analysis Findings at BiTS 2011
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Valts Treibergs, R&D Engineering Manager, and Chris Cuda, US Product Manager, will present "PCB Pad Wear Analysis at 0.4 mm Pitch ― the Story Continues…" at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ. The presentation will be held during Session 5, which will take place Tuesday, March 8, 2011 at 1:30 p.m.
Conductive coatings offer cost-effective, easy-to-apply method for shielding plastic medical equipment enclosures
Chomerics Europe - a division of Parker Hannifin offers a wide range of conductive coatings and paints to address shielding requirements in the growing number of medical equipment applications that utilise plastic rather than metal enclosures. The choice of epoxy, acrylic and urethane coatings are well suited to use in the challenging operating environments often experienced by medical electronics equipment; coating selection depends on the target application material.
Essemtec to Demonstrate PANTERA-XV at Electronics For You 2011
Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will highlight its PANTERA-XV in Hall 4, Booth #O-09 at the upcoming Electronics For You Expo, scheduled to take place February 17-19, 2011 at the Pragati Maidan in New Delhi, India.
ITW Chemtronics Introduces New Line of CircuitWorks Tacky Flux
ITW Chemtronics introduces a new line of convenient and easy to use tacky fluxes to its line of circuit board repair and rework products. These innovative products offer three different formulations for specific rework needs; CircuitWorks No-Clean Tacky Flux, CircuitWorks® Water Soluble Tacky Flux, and CircuitWorks Lead Free Tacky Flux. This line of flux is designed for BGA rework requiring high-reliability, stability and cleanliness. Whether your requirements are for a water-soluble and water removable tacky flux, a high temperature lead-free tacky flux, or a no-clean tacky flux for your BGA rework, these products will work with your processes. CircuitWorks Tacky Flux gels hold the BGA component in position even with board movement. They are halide and halogen free, and contain no ionic material. All CircuitWorks Tacky Flux meet IPC requirements and have a two year shelf life.
productronica and ZVEI extend cooperation in the area of innovative electronics production
The Central Association of the German Electrical and Electronics Industries (ZVEI) is predicting continuous growth for suppliers of electronic modules, equipment and systems in the next few years. Companies involved in the electronic manufacturing services (EMS) industry, for example, are also benefiting from this strong demand. productronica will take this trend into consideration and is organizing the EMS Highlight Day in cooperation with the ZVEI PCB and Electronic Systems Association.
Prototype Shop Open for Business
The new department enables quick turnaround on prototype machined parts and means that product samples will get to the customer quicker. Mike Fellowes, who is heading up the new department, said: "The new workshop means that our production machines will no longer be interrupted to manufacture prototypes.
New fast-cure, low-shrink adhesive from Intertronics
New from Intertronics is a fast-cure, low-shrink adhesive for optic assembly which eliminates parts movement – DYMAX OP-67-LS opto-mechanical adhesive cures in seconds for bonding of optical components, whilst its low-shrink nature virtually eliminates movement during curing and subsequent thermal cycling.
New Reflow Oven Introduced by APS Novastar
APS Novastar (http://www.apsgold.com) announces the introduction of the ERO-500 Reflow Soldering System. The addition of the ERO-500 reflow oven fills out the mid-range of APS Novastar's reflow product line, providing its customer base with a cost-effective conveyor reflow oven with five (5) vertical heating zones and one (1) cooling zone. The ERO-500 has been developed for small to medium volume reflow soldering of SMT boards, hybrid boards, and curing of glue or thick film pastes.
Aqueous Technologies and Zestron to Hold Workshop on Cleaning Electronic Assemblies
Aqueous Technologies Corp. and Zestron announce that registration is now open for the one-day technical workshop titled "Why Clean Electronic Assemblies" that will take place Wednesday, March 2 and Thursday, March 3, 2011 at ACI Technologies, Inc.'s facility in Philadelphia. The same workshop will be held on two consecutive days from 8:30 a.m.-4:30 p.m.
First PECVD films on 450mm wafers
In collaboration with ISMI, the technology and applications teams at Oxford Instruments Plasma Technology have coated 450mm silicon wafers with PECVD SiO2 – a world first. The wafers were processed using the recently launched Oxford Instruments PlasmaPro® NGP®1000 PECVD system, which is capable of coating single wafer substrates up to 450mm diameter or larger batches of smaller diameter wafers.
High Temperature Resistant, Toughened Structural Adhesive Cures at Room Temperature
Formulated for structural applications in extreme environments with temperatures from -80°F to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond strength to a wide variety of substrates including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. Supreme 33 also resists chemicals including water, oil and many organic solvents.
