Production
TSMC Certifies Cadence Tempus Timing Signoff Solution for 20nm Designs
Cadence Design Systems announced today that TSMC has certified the new Cadence Tempus Timing Signoff Solution at 20 nanometers. The certification means the Cadence Tempus Timing Signoff Solution passes TSMC's rigorous EDA tool certification to enable customers to achieve accuracy required for advanced technologies.
New Software Feature from BPM Microsystems Improves Tape Loader Teaching Process
BPM Microsystems announces that with the release of BPWin version 5.32.0, tape loader users now have the option to advance their tape reel by millimeters, mils or pocket count at the end of a job for an improved teaching process.
Count On Tools Launches MYDATA ezTOOL for Midas Tool Tip Replacement
Count On Tools announces the availability of its new MYDATA ezTOOL, an assembly/disassembly fixture for MYDATA Midas Tool Tips. With the new ezTOOL, customers can replace tool tips quickly with precision alignment for critical pick-and-place tooling.
Suntron Offers EMS Services for Extreme Industrial Environments
Suntron announces that it offers manufacturing services for high-reliability industrial products that operate under extreme conditions. Industrial equipment companies that require ruggedized, durable, and customized products for extreme temperatures and vibrations value Suntron as an EMS partner.
BPM Microsystems Improves Traceability with New Laser Marker Software Feature
BPM Microsystems announces that with the release of BPWin version 5.32.0, automated system users now have the option to laser mark their devices with the programming socket location for improved traceability and quality assurance.
Sencio’s nCapsulate cuts system assembly costs
Sencio is bringing an extra dimension to sensor and MEMS encapsulation with the launch of its nCapsulate freeform packaging technology. nCapsulate offers complete freedom of shape when encapsulating semiconductor sensors or MEMS.
FCT Assembly Installs New Micrometers to Improve Stencil Accuracy
FCT Assembly today announced that it has installed new Mitutoyo Deep Throat Micrometers to accurately measure the step etch depth over the entire surface of the stencil. This is another example of the improvements FCT Assembly is putting in place since the purchase of Global Stencil.
Lista Offers Workstation Solutions for Electronic Assembly
Lista International announces the availability of its efficient and modular workstations for electronic assembly. Ergonomically designed, these workstations offer unlimited flexibility to accommodate the changing workplace.
Microsemi Selects Intel Corporation Foundry Services for the Development of Digital Integrated Circuits
Microsemi today announced it is leveraging Intel's industry-leading, onshore foundry technology for the development of advanced high-performance digital integrated circuits and system-on-chip solutions using Intel's revolutionary 22 nanometer 3-D Tri-Gate transistor technology.
Axcelis Extends Purion Platform With The Launch Of The Purion XE High Energy Implanter
Axcelis Technologies today announced the introduction of the Purion XE next generation single wafer high energy implanter, the second tool in its expanding family of Purion ion implanters. The Purion XE is an evolution of the industry leading Optima XEx, combining the process and productivity advantages of the Optima XEx linear accelerator and beamline technology with the reliability, precision, process flexibility, and performance options that define the Purion platform.
Cadence and GLOBALFOUNDRIES Collaborate to Improve DFM Signoff for 20- and 14-Nanometer Nodes
Cadence Design Systems announced today that GLOBALFOUNDRIES has collaborated with Cadence to provide pattern classification data for manufacturing processes of 20 and 14 nanometers. GLOBALFOUNDRIES is using the Cadence Pattern Classification and Pattern Matching Solutions because they enable up to four times faster design for manufacturing, which is key to improving customers' silicon yield and predictability.
Infineon And GLOBALFOUNDRIES Collaborate On 40nm eFlash Process Technology
Infineon Technologies and Globalfoundries announce a joint technology development and production agreement for 40 nanometre embedded flash process technology. The cooperation will focus on technology development based on Infineon's eFlash cell design and manufacturing of automotive and security microcontrollers with 40nm process structures.
Saelig Introduces Affordable Ready-To-Run 3D Printer
Saelig has introduced the award-winning Afinia H479 Rapid-Prototyping 3D Printer - a self-contained unit that provides an immediate availability 3D prototyping experience. The H479 3D Printer comes fully assembled, with easy to install software for both the PC and Mac, and can prototype a part up to 5 inches in each dimension, accurate to within .2mm (.008). A heated build platform prevents model warping during printing.
Manncorp announces the new MC-400 SMT pick and place machine
Built upon the same architecture as Manncorp's popular MC Series of SMT pick and place machines, the new MC-400 is specially designed for startups, product development labs, and contract manufacturers that need to build prototypes or short runs in-house, with high-precision and quick turn-around times.
Make It Fast – Make It Easy with Multitest’s MT9510 Access+ Contacting Unit Holder
Multitest announces that the new Access+ contact unit holder for the MT9510 significantly shortens the downtime of the test cell. The Access+ CUH has been developed for quick and easy access to the contactors, centering plate and adapter board.
Mek Unveils New AOI Technology Line-up
Mek has announced the release of an entirely new generation of AOI technology to be deployed across a line-up of 4 new Desktop and 3 new In-line inspection machines. Mek's PowerSpector Series features an entirely new generation of mechanical, camera, sensor, and software technologies that measurably propel the performance of Mek AOI beyond the norm and create new standards for speed, accuracy and inspection strategy.
Essemtec Announces FLEXUS-Pick-And-Place Platform
Essemtec expands its range of machines with the new pick-and-place machine FLEXUS. The machine is tied to the established FLX system, but offers a greater flexibility in the high-mix/mid-volume sector. For years, Essemtec's FLX was the world's most popular pick-and-place machine for flexible SMD production. Many specific customer applications were solved using the FLX and a wide range of options and accessories have been designed for the platform.
Viscom X8011 PCB Is Now Available with Automatic X-ray Inspection and Quality Uplink
Many soldered connections can only be reliably checked with X-ray inspection. Viscom's X8011 PCB high-resolution manual X-ray inspection system was developed especially for these tasks. Now electronics manufacturers can draw on Viscom's first-class automatic analysis routines of the X7056 family of automatic X-ray inspection systems with this offline solution as well.
Steca Elektronik Invests In Mek Automatic Optical Inspection
Steca Elektronik has recently announced investment in Automatic Optical Inspection technology from AOI specialist, Mek Europe and distributor, SmartRep. Steca Elektronik is an electronics service provider and manufacturer based in Memmingen, Germany. The company manufactures up to 18,000 printed circuit boards per day and offers electronic services for residential, automotive, agricultural, environmental, traffic and building technology as well as for the industrial and medical sectors.
ACE Shielding Cans Help Us Get More From Mobile Devices
As voltages used within personal mobile devices are reduced to reduce power dissipation, relax cooling requirements and extend battery life, lower level signals become increasingly susceptible to surrounding noise and interference. It is equally important that these devices be shielded from inbound interference as it is to comply with EMR and RFI regulations.
Picosun’s high performance 300-mm ALD cluster tool enters new generation memory market
Picosun reports that its PICOPLATFORM 300 ALD cluster tool has been selected by a key customer in Asia for new memory applications. The 300 mm cluster design is based on the company's long-term top product, the fully automated, multifunctional PICOPLATFORM ALD deposition unit for parallel, simultaneous execution of several different processes for high-k and metal/metal nitride films.
Easy Stencil Printer Adjustment Due To New Features
Fino from Essemtec, will be presented at SMT Nuremberg 2013 with a larger touch screen for easier operation, as well as with two larger video monitors for a simple adjustment of stencils and substrates. Additionally the high-resolution cameras can accommodate a larger zoom.
Mek to Unveil New AOI Technology Line-up at SMT Nuremberg, booth # 7-419
Mek is pleased to announce the release of an entirely new generation of AOI technology to be deployed across a line of new Desktop and In-line inspection machines. The new generation of AOI technology will be on show at SMT Nuremberg.
Petronics Takes SMD Production In-House With MYDATA
Petronics Electronica Assemblage, a fast-growing Dutch electronics assembly subcontractor, has added in-house SMT capabilities to its range of services by purchasing a pre-owned MY12 component placement machine from MYDATA.
ARM and Cadence Partner to Implement Industry’s First Cortex-A57 64-bit Processor on TSMC 16nm FinFET Process
Fulfilling the promise of performance and power scaling at 16 nanometers, ARM and Cadence today announced details behind their collaboration to implement the first ARM Cortex-A57 processor on TSMC's 16-nanometer FinFET manufacturing process.
Essemtec’s Scorpion Is Now Operating With eez-Technology
Essemtec is pleased to announce that it implemented eez-technology for its dispensing system Scorpion. eez-technology is already successfully used on the pick-and-place machines Paraquda and Cobra.
Teknek's Ultimate SMT Solution Increases Yields By 3 - 6 %
Some 74 per cent of all defects in the PCB manufacturing process are related to solder paste problems according to the SMTA. Blocked stencils can be caused by a number of things including laser marking ablation dust, smaller apertures in the stencil and even hair and clothing fibres from operators. So what is the solution? Teknek believes the answer is to ensure the bare boards are thoroughly cleaned before printing using the latest contact cleaning technology.
VJ Electronix Show Vertex II X-ray Inspection System At NEPCON China
VJ Electronix has today announced that the company will display its new Vertex II next-generation X-ray technology and the high-performance SRT Micra rework platform in the Kasion Booth (1G56) at the NEPCON China 2013 exhibition and conference, scheduled to take place April 23-25, 2013 at the Shanghai World Expo Exhibition and Conference Center in Shanghai China.
RFMD Announce Flexible Gallium Arsenide Sourcing Strategy
RF Micro Devices have today announced a new Gallium Arsenide sourcing strategy intended to increase manufacturing flexibility, expand gross margin, and support aggressive growth. RFMD will phase out manufacturing in its Newton Aycliffe, UK-based GaAs pHEMT facility and transition most GaAs manufacturing to its GaAs HBT manufacturing facility in Greensboro, NC.
DEK Horizon 01iX Platform a Key Component of Krypton Solutions Expansion
DEK announces Krypton Solutions, has selected its Horizon 01iX print platform to enable expansion of the company's electronics design and manufacturing business. The Plano, Texas-based firm, which specializes in full-service design, layout and rapid prototyping, is adding a fourth SMT production line to accommodate its growing customer base.
STMicroelectronics Makes Leading-Edge MEMS Technology Available for Prototyping through CMP
STMicroelectronics and CMP today announced that ST's THELMA MEMS manufacturing process, the process ST uses for its industry-leading accelerometers and gyroscopes, which have shipped in billions of units 1, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.
HGST Reaches 10-Nanometer Patterned-Bit Milestone
HGST is leading the disk drive industry to the forefront in nanolithography, long the exclusive purview of semiconductor manufacturers, by creating and replicating minute features that will allow the doubling of hard disk drive (HDD) density in future disk drives.
Multitest’s MT9510 Test Handler Selected By Melexis For Gesture Recognition IC
Multitest has today announced that Melexis has chosen Multitest's Standard MT9510 Pick and Place Test Handler for an infrared, light sensing application. Multitest cooperated closely with Melexis to successfully develop a dedicated conversion kit to support this sensor application by integrating a 3rd party stimulus provided by Melexis.
Intertronics Pots the Green For Variohim
In setting up a new production project for in-house potting of temperature probes the engineers at Variohm considered a number of well-known industry standard potting compounds – and they called in the materials specialists at Intertronics.
Elite Electronic Systems Grows with Europlacer
Elite Electronic Systems has been a long-term user of Europlacer placement systems, having bought its first Progress 6 back in 1997 and following a very successful period of steady growth over the ensuing years increased to three lines of high-technology assembly equipment, including Europlacer iineo machines purchased in 2010 and 2011.
MagnaChip Selects Synopsys' Proteus LRC for Lithography Verification
Synopsys today announced the adoption of Synopsys' Proteus LRC by MagnaChip Semiconductor Corporation. MagnaChip uses Proteus LRC in their production mask synthesis flow to identify hotspot locations in designs that are sensitive to variations in the manufacturing process.
Viscom presents new XM camera module for extreme cycle times and highest inspection depth
Viscom AG has developed a totally new camera module. The new XM camera module was introduced for the first time at the IPC APEX EXPO that took place February 19-21, 2013 at the San Diego Convention Center in California.
BPM Microsystems to debut improved configuration of its model 3800 automated programming system at the IPC APEX Expo
BPM Microsystems announces that its model 3800 automated programming system is now available with a side-mount option for the V-TEK TM-50 tape output media. This reconfiguration offers additional flexibility by allowing the machine to utilize options for tape, tray, tube and marking simultaneously.
Infineon Completes 300-Millimeter Thin-Wafer Production Qualification
Infineon Technologies has achieved a major breakthrough in the manufacturing of power semiconductors on 300-millimeter thin wafers. In February, the company received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at the Villach (Austria) site. The production process based on the new technology has completed qualification from start to finish and customers have given the go-ahead.
Key Electronics Chooses Cogiscan for Factory Wide Traceability
Cogiscan announces that it was selected by Key Electronics to expand its existing traceability structure into a complete Track, Trace and Control system that spans the entire factory. In early 2012, Key Electronics purchased two new Juki pick-and-place lines equipped with Juki's IFS-X2 (Intelligent Feeder System) and Traceability options, which utilize Cogiscan technology.
