Vicor, Through-Hole Packaging

Vicor Announces V•I Chip™ Through-Hole Packaging Option

News Release from: Vicor UK
02/06/2007

Vicor announces the immediate availability of a through-hole packaging option for all V•I Chips including MIL-COTS. This is in addition to existing surface mount (SMT) compatible packaging, doubling the available range.

Through-hole products are electrically and thermally identical to the SMT versions and are compatible with both hand soldering and wave solder techniques so they are perfect for fast prototyping or large production runs. Through-hole assembly facilitates multi-chip cold-plate or heatsink mounting and makes system assembly simpler, faster, and cheaper.

The new through-hole packaging option is compatible with both leaded and lead-free solder. For the MIL-COTS market, this option aligns with the Vicor MIL-STD MFIAM filters for a complete solution. Power designers in a broader range of applications can take advantage of the benefits of V•I Chips.

Information on board layout and 3D models is available. To access this information as well as data sheets for V•I Chip products, application notes and demo board user guides, please visit www.vicorpower.com.