Jabil Provides Snapshot of the Future with Breakthrough Camera Modules at Mobile World Congress 2010
News Release from:
23 February 2010
Jabil Circuit, Inc. announced two important breakthroughs in system-on-chip (SOC) embedded camera technology at Mobile World Congress 2010. These new innovations meet a critical market need by enabling manufacturers to take full advantage of major opportunities at both ends of the mobile device spectrum. The MD6054A, a compact 5 megapixel (MP) SOC camera module with autofocus addresses growing consumer demand for high-end optics in an industry standard 8.5 x 8.5 x 6.0mm package, while the PW3625A, the first 2 megapixel SOC reflowable wafer-level camera module in the world, targets the huge, untapped market for low-cost mobile phones. Both were developed by Jabil's Mobility sector group, Jabil | Green Point, which leveraged the expertise of Jabil | Sypro Optics, created from a joint venture with Carl Zeiss.
“Integrated mobile phone cameras are a must-have in today’s world, but their image quality has traditionally lagged behind that of digital still cameras,” said Stephen Taylor, business unit director Camera Modules, Jabil | Green Point. “Our new five megapixel autofocus camera module solves this problem by delivering next-generation optical quality and functionality, including autofocus in a compact 8.5 x 8.5 x 6.0mm package. At the same time, emerging mobile phone markets offer a tremendous opportunity for low-cost phones. Here our new wafer-level camera module will help OEMs capture increased market share with added functionality while keeping costs down and form factors small.” Provision of the cameras as SOCs adds significantly to their appeal.
System-on-Chip Cameras Offer Cost Efficiencies, Conserve Board Space
Device manufacturers benefit from SOC cameras in several ways, beginning with lower development costs. The modules are assembled, focused and tested in a fully automated process optimized for high volume and low-cost production. With image processing performed by the SOC, the modules are true ‘turnkey’ solutions for perfect images, and real estate on the motherboard can be made available for other functionality.
• 5 MP camera module offers auto focus in a compact 8.5 x 8.5 x 6.0 mm package
The MD6054A embedded autofocus camera features a high-power lens that delivers a high-quality image in a small package. The camera module contains a highly integrated 5 MP (2592 x 1944) camera chip with a CMOS image sensor and integrated image signal processor (ISP) combined with high performance optics and autofocus actuator. The on-board ISP uses 1.4µm CMOS active-pixel technology. It performs sophisticated image processing functions including color recovery and correction, edge enhancement, lens shading correction, defect correction, auto exposure, auto white balance and image scaling. The industry-standard 8.5 x 8.5 x 6.0mm size makes it suitable for a broad range of mobile phones, laptops and smartphones.
• Ultra-small wafer-level camera module is reflowable
The PW3625A embedded camera features advanced optical and assembly technologies that create an ultra-small optical module measuring just 5.6 x 5.7 x 3.5mm. This extremely compact size makes the module suitable for very small and thin form factors typical of low-cost mobile phones, as well as for the bezels of netbooks and other laptops. The highly integrated 2 MP (1600 x 1200) camera chip includes a CMOS image sensor and an ISP combined with high-performance wafer-level optics. On-board ISP functions include color recovery and correction, edge enhancement, lens shading correction, defect correction, auto exposure, auto white balance and image scaling. The module is reflowable with a 64pin BGA array. Applications for the wafer-level module include mobile phones, smartphones, laptops, wireless security cameras and biometric cameras.
As an extra benefit, both products provide bar code scanning, which is expected to gain importance as consumers begin using mobile devices for purchasing.
Both camera modules are available worldwide.
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