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Labeler integrated in SMD placerSMD assembly systems from Essemtec can now mark the printed circuit board with an identification label while placing components. The integrated labeler delivers on demand a label with bar code, matrix code, date or serial numbers. New Programmable Preheater: Lowers Soldering and Rework Temperatures, Improves Process EfficiencyThe new PCT-1000 Programmable Preheater, from OK International, equips users with the ability to deliver more heat to difficult boards while maintaining very high levels of thermal control and lower operating temperatures. Ideal for high thermal demand applications such as lead-free, multi-layer boards and large ground planes, the PCT-1000 improves process efficiency and control. Soldering, desoldering and SMD rework operations benefit with improved process speeds and greater control when incorporating the new PCT-1000 programmable preheater. This benchtop system delivers forced convection heat that can be controlled with four time & temperature zones and an additional cooling zone. 
OK International launches enhanced PV tabbing and bussing soldering systemsOK International has launched a new soldering system for PV tabbing and bussing applications proven to reduce micro cracking. The PS-900 with specially designed hoof tip geometry optimizes the power delivered to the solder joint while it's temperature sensitive heater ensures low temperature soldering thus minimizing thermally induced streess on cell surfaces. 
CoroThread 266 now even for threading stainless and super alloysFor threading operations, the recently introduced insert grade GC1125 is now complemented with the new grade GC1135 from Sandvik Coromant. Both grades offer good function in all ISO materials although each grade has its own speciality. If the majority of your threading operations are in steels, cast irons or aluminium, GC1125 should be your choice, whereas for stainless steels, super alloys or profiles requiring sharp cutting edges choose GC1135. 
Free dispensing guide available from IntertronicsThe "adhere" Intertronics range of dispensing equipment includes automatic, semi-automatic and robotic systems, hand held guns and all the consumables users are ever likely to need for their adhesives or other liquids like inks, coatings, greases or oils. So in order to help production engineers, they are offering a free download of "25 top dispensing tips" – considered an indispensible guide to the ins-and-outs of fluid dispensing, including equipment selection and techniques. Laird Technologies Launches New Online EMI, Thermal Management, and Wireless M2M Solutions Stock LocatorLaird Technologies today announced the launch of its new online stock locator system for EMI, Thermal Management, and Wireless M2M product lines. SchmartBoard Releases Family for SMT ConnectorsSchmartBoard, a company that makes prototyping electronic circuits easier, has announced a new family of boards for prototyping with SMT (Surface Mount Technology) connectors. 
Medical micro-shots from IntertronicsIntertronics have again brought forward an exciting development in fluid dispensing – this time the Fisnar DV509. Intended primarily for medical applications this is a lightweight diaphragm valve designed for precise flow control of low to medium viscosity liquids on a continuous 24/7 basis. The PTFE diaphragm separates the wetted parts from the air supply and therefore it is ideal for dispensing cyanoacrylates, reagents, UV adhesives, paints, inks, solvents, glues, electrolytes, alcohol and other volatile substances. Variants with stainless steel and UHMW bodies/diaphragm are also available. Jabil Jumps Ahead of the Curve with Advanced, New Seamless Touch Screen Integration for Smooth, Sleek 3D Mobile Phone Designs Collaboration with Touch Screen Leader Delivers OEM Benefits of Design Freedom, Supply Chain Optimization and System CostJabil Circuit, Inc. today announced a revolutionary new technology to seamlessly integrate touch screens into molded plastic cover lenses for greatly improved 3D mobile phone designs. This new integrated touch screen solution is the result of the close collaboration and co-development work between Jabil | Green Point, Jabil's Mobility sector group, and JTouch, one of the top five touch screen manufacturers in the world. Using proprietary ultraviolet (UV)-cured glue lamination to improve performance, the new technology gives OEMs greatly expanded design flexibility and higher yields than existing competitive materials. Jabil | Green Point announced the new integration offering here at Mobile World Congress and is demonstrating the high-end solution in stand H59, in hall 2. Jabil Provides Snapshot of the Future with Breakthrough Camera Modules at Mobile World Congress 2010Jabil Circuit, Inc. announced two important breakthroughs in system-on-chip (SOC) embedded camera technology at Mobile World Congress 2010. These new innovations meet a critical market need by enabling manufacturers to take full advantage of major opportunities at both ends of the mobile device spectrum. The MD6054A, a compact 5 megapixel (MP) SOC camera module with autofocus addresses growing consumer demand for high-end optics in an industry standard 8.5 x 8.5 x 6.0mm package, while the PW3625A, the first 2 megapixel SOC reflowable wafer-level camera module in the world, targets the huge, untapped market for low-cost mobile phones. Both were developed by Jabil's Mobility sector group, Jabil | Green Point, which leveraged the expertise of Jabil | Sypro Optics, created from a joint venture with Carl Zeiss. 
Easy in-house custom PCB fabricationVero Technologies, manufacturer of the iconic Veroboard family of prototyping boards, has introduced Fotoboard, a range of single and double sided blank Eurocard PCBs, covered with photosensitive resist. Fotoboard enables custom printed circuit boards to be made to your design in-house quickly and economically, saving time and money in sending files to an external PCB fabricator. The products have potential applications in R & D labs for design proving and realisation, in educational establishments for student projects and for hobbyists and modellers amongst others. 
Aerotech provides enabling positioning technology for nanometre precision direct-write laser applicationOne of the many varied and interesting research projects at the University of Southampton's ORC (Optoelectronics Research Centre) involves direct UV laser writing of integrated optical circuits on specialised glass substrates and on its own patented 'flat' optical cable. With application potential from telecom network components through to lab-on-a-chip (LOC) biological and chemical sensors, the photonic circuits are produced with the help of nanometre level precision positioning systems and motion controls from Aerotech. Rogers Corporation to Present Practical Materials Solutions at IMAPS Device Packaging 2010Rogers Corporation will showcase three of its advanced materials for microelectronics packaging at this year's International Microelectronics and Packaging Society (IMAPS) Device Packaging 2010 event (March 9-10, 2010, Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, AZ). Rogers Corporation to Present Practical Materials Solutions at IMAPS Device Packaging 2010 PA&E Announces New Ceramic Sealed Hermetic WindowsPA&E is now using its patented ceramic-to-metal sealing technology to manufacture hermetically sealed windows for optical, laser and infrared applications. The unique bonding properties and polycrystalline structure of PA&E's Kryoflex® material now allow the company to produce sight or wave-guide windows that maintain the highest levels of hermetic integrity under the extreme environmental conditions. This new product is particularly well suited for space or defense-related LADAR, laser designation/acquisition systems and medical endoscopes. DEK Solar continues to thrive in China; powers escalating market demandDEK Solar is reflecting on a positive Q4, having sold a record number of photovoltaic metallization lines in China. Most recently, the solar screen printing specialist completed a contract to supply a high-profile turnkey provider in the region with a large number of new metallization lines. Novec EGC-2702 surface modifier coating protects electronic components against moisture and corrosion - rapidly, economically and safely3M launched Novec EGC-2702, a surface modifier coating that provides economic and fast protection against moisture and corrosion in electronics manufacture and assembly. A cost-effective high performance alternative to traditional conformal coatings, Novec EGC-2702 can be applied and dried within seven minutes, which is less than a third of the time of leading existing competitive products. It is also non-flammable and is designed to help electronics companies adhere to environmental, health and safety requirements. Laird Technologies Publishes Thermoelectric HandbookLaird Technologies, Inc., a global leader in the design and manufacture of customized, performance-critical components for wireless systems and other advanced electronics applications, today announced the release of its revised "Thermoelectric Handbook". Task-Matched Cutters and Pliers from AvenSelecting an ideal hand tool for detailed jobs is determined by size, strength, shape and sharpness. Having varied models within reach enhances precision, safety and efficiency. DEK and Maxim SMT Technologies showcase latest innovations at Electronics Next 2010DEK is preparing to showcase a comprehensive range of advanced technologies and processes at this year's Electronics Next exhibition in conjunction with the company's agent Maxim SMT Technologies Pvt. Ltd. Being held in New Delhi over February 24th – 26th, Electronics Next will see the mass imaging specialist demonstrate its state-of-the-art Horizon screen printing platform along with award-winning Productivity Tools from Stand 501. Unisem Advanced Technologies Develops Stress Buffer to Protect Semiconductor Device FeaturesUnisem Advanced Technologies (UAT), a leading provider of wafer bumping technologies, today announced that it has developed a methodology for creating a stress buffer to protect delicate features of semiconductor devices. This customizable stress buffer structure includes a polymer layer formed by one or multiple coatings, and a metal stack overlaying the polymer. High tech consortium starts SUPREME project: ASSEMBLÉON DEVELOPS SUSTAINABLE PICK & PLACE SOLUTIONSRoyal Philips Electronics subsidiary Assembléon has started a research project to develop a new generation of sustainable pick& place solutions for the electronics assembly industry. The new generation will not only pick & place components sustainably; it will also minimize the environmental impact of the machine in its design phase. The project has been recognized by the Dutch government in the form of a substantial financial subsidy to stimulate the innovation. Essemtec introduces simultaneous through-hole LEDs and SMD placementEssemtec introduced the CLM979 Radial Component Feeder that enables the assembly of through-hole LEDs on a standard pick-and-place machine. The feeder releases LEDs from the tape, cuts the wire ends and prepares the component for pickup. 
Assembléon Shows Its New Smart Solutions At Apex 2010Royal Philips Electronics subsidiary Assembléon is showing more 'Smart Solutions' at Apex 2010 (April 6th to 8th, Booth 325) held in Las Vegas, U.S.A. Several initiatives are aimed at helping customers to improve business perfomance and reduce SMT production costs. Assembléon is for example introducing the cost-effective MC-24X – a versatile extension to the company's end of line solutions for high-volume and high-mix production lines. 
PCB Protection with Master Bond’s Conformal CoatingAs conformal coatings are becoming more essential to electronic assemblies, Master Bond broadens their protective conformal coatings line with the addition of UV10LV. A clear, highly non-conductive, UV curing conformal coating, it is designed to restrain the impact of moisture, dust, chemicals, and temperature extremes on electronic circuitry and components. I ts high resilience bonds will not deteriorate even when exposed to adverse environmental conditions including severe heat and moisture . Master Bond UV10LV is a low viscosity UV cure adhesive compound offering an exceptionally fast cure upon exposure to UV light at room temperature. Excellent adhesion properties are obtained with metals, ceramics, glass, paper, many plastic and elastomers. The PCB protection coating achieves bond strength equal or exceeded to those obtained from conventional epoxy resins. 
New Hydrophilic PTFE Filters from Gore for High-Purity Chemical ProcessingW. L. Gore & Associates (Gore) has added hydrophilic PTFE filters to its expanding line of cartridge filters for bulk high-purity chemicals used in microelectronics manufacturing, including LCD, semiconductor, hard disk drive and photovoltaic. GORE® Filters for High-Purity Chemical Processors can be used as drop-in replacements for existing filters to achieve significant flow improvements while maintaining or increasing particle retention. This dramatically increased performance can provide a retention upgrade while maintaining system flow, reducing processing time, or decreasing the number of filters required for a lower total cost of ownership. Wilson Process Systems exhibits full SMT and through hole PCBA capabilities at Southern Manufacturing 2010Wilson Process Systems (WPS), the leading contract manufacturer, is exhibiting its full surface mount and through hole PCB assembly capabilities, plus a range of other outsource manufacturing services at the upcoming Southern Manufacturing exhibition, on February 10 and 11 at FIVE, Farnborough, Hants. 
Ophir-Spiricon Introduces BeamGage Pro, Next Generation Laser Beam Analysis SystemOphir-Spiricon, a leader in precision laser measurement, today at Photonics West 2010 announced BeamGage Professional, the latest addition to the company's family of next generation laser beam analysis systems. BeamGage Professional builds on the features included in BeamGage Standard: BeamMaker beam simulator, automatic camera control for ease of use, and comprehensive set of beam analysis algorithms. Optimal stencil design? DEK shows that it’s elementary…DEK recently encouraged its customers to become 'de-DEK-tives' in order to triumph in a prize draw held on its stand at Munich's Productronica exhibition. Having now revealed the competition winner as Siemens AG's Mr. Stanek, DEK has successfully drawn attention to the critical nature of stencil design in relation to ongoing product reliability. 
Epoxy Manufacturer Releases a Strong Fiber Reinforced Epoxy ResinComprised of an aramid fiber reinforced epoxy adhesive for high performance structural bonding, Master Bond's EP30R features outstanding dimensional stability and enhanced impact resistance. This two part epoxy is formulated to cure at room temperature or more rapidly at elevated temperatures. DEK customers can now extend their Horizon even furtherMass imaging specialist DEK has unveiled further enhancements to its popular Horizon screen printing platform. Now equipped with state-of-the-art new cover packages, Horizon features substantially improved usability and operator access for an additional level of manufacturing flexibility. DEK launches VectorGuard Double Layer Platinum stencilDEK has extended its popular VectorGuard® stencil portfolio with the addition of the double layer Platinum stencil, a unique stencil technology offering manufacturers a series of performance benefits over conventional screens. Launched at the Productronica exhibition in Munich, VectorGuard Double Layer Platinum stencils are an ideal solution for semiconductor applications and component manufacture, meeting the needs of production challenges requiring fine line or mixed feature sizes. 
Reinforced Epoxy Adhesive Improves Structural BondingComprised of an aramid fiber reinforced epoxy adhesive for high performance structural bonding, Master Bond's EP30R features outstanding dimensional stability and enhanced impact resistance. This two part epoxy is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond EP30R produces high strength bonds to metals, glass, ceramics, vulcanized rubbers and many plastics. 
Rogers Corporation to Showcase Advanced Materials Solutions at DesignCon 2010Rogers Corporation will feature a variety of its advanced materials solutions for the electronic design and semiconductor industries at DesignCon 2010 in Santa Clara, CA (February 2-3, 2010, Santa Clara Convention Center). Members of Rogers Advanced Circuit Materials (ACM) Division will be available at booth 811 to discuss a number of innovative electronic materials, including Theta printed circuit materials, ULTRALAM 3000 laminates, RO2808 laminates, and RO4000 LoPro circuit board materials. 
Official sales start of Essemtec TowerWith the beginning of 2010, Essemtec is the official world wide distributor of the Tower. 
Undetected Pressure Variations in Flip Chip Assembly Reduce Yields and Raise CostsUndetected bonding pressure variations can result in poor or open flip chip connections, reducing yield and long-term reliability while raising costs. Maintaining a uniform distribution of bonding pressure across a flip chip die assures chip to substrate coplanarity, optimal bump compression, and a controlled, reproducible die to substrate gap. Pressurex pressure indicating sensor film is a valuable assist to today's flip chip bonders which lack the capability to measure pressure variations across the bonding tool but instead rely on average pressure with the assumption that it is uniformly distributed. Now a proven control measure in wafer-to-wafer bonding, Pressurex could extend similar low-cost coplanarity and uniformity control to flip chip bonding. 
Lantronix and Spectrum CNC team up to wirelessly network 250 Computer Numerically Controlled (CNC) machinesLantronix today announced that its MatchPort b/g wireless device server has been chosen by Spectrum CNC, the developer of the most reliable direct numerically controlled (DNC) software to deliver a highly-dependable wireless industrial automation solution. Spectrum CNC has selected Lantronix' MatchPort b/g wireless device server to enable the company to network 250 Computer Numerically Controlled (CNC) machines while eliminating the need for wiring throughout the production floor. 
CIL to demonstrate electronics design and manufacturing capability at Southern Manufacturing 2010Custom Interconnect (CIL) will demonstrate examples of its world-class electronics design and manufacturing capability and show a number of new LED based products on Stand D25 at Southern Manufacturing & Electronics Exhibition to be held at FIVE, Farnborough, Hampshire on February 10th and 11th 2010. IMAPS-UK Prototyping To Production Event Hailed A SuccessUK-Prototyping to Production was the theme for a recent IMAPS-UK event held at Unisem Europe's Advanced Semiconductor and Test facility in Crumlin, South Wales. 
Pentek Introduces Specialized Beamforming Module for PC PlatformsPentek is introducing two beamformer PCIe modules to its expansive product line. Each is a high-speed software radio board for processing baseband RF or IF signals and incorporates unique and powerful beamforming functions. Created to accelerate system level design and lower system cost, the boards bring high-performance built-in features and connectivity to PC platforms. 
Nextreme Announces High Temperature Gold-Tin Thermoelectric Module For Optoelectronic CoolingNextreme Thermal Solutions is now offering an updated version of the OptoCooler HV14 that enables assembly temperatures as high as 320°C. These assembly temperatures make the HV14 compatible with eutectic gold-tin (AuSn) solder — the industry standard process for packaging optoelectronic devices that require tight tolerances. Specific applications include laser diodes, semiconductor optical amplifiers and sensors. |
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