A4975

Full-bridge PWM microstepping motor driver IC features synchronous rectification for lower power dissipation

News Release from: Allegro MicroSystems Europe Ltd
20 March 2012

Internal pulse-width-modulated (PWM) current control combined with an internal three-bit nonlinear digital-to-analogue converter allows the motor current to be controlled in full-, half-, quarter- or eighth-step (microstepping) modes, while nonlinear increments minimise the number of control lines necessary for microstepping. The benefits of microstepping include increased step resolution and reduced torque variations and resonance problems at low speed.

Full-bridge PWM microstepping motor driver IC features synchronous rectification for lower power dissipationThe outputs of the A4975 are rated for continuous output currents up to ±1.5 A and operating voltages up to 50 V. The device includes synchronous rectification control circuitry which lowers IC power dissipation during PWM operation and reduces the need for external Schottky diodes.

Internal circuitry determines whether the PWM current-control circuitry operates in a slow (recirculating) current-decay mode, fast (regenerative) current-decay mode, or mixed current-decay mode in which the “off” time is divided into a period of fast and slow current decay.

The combination of user-selectable current-sensing resistor and reference voltage, digitally selected output current ratio; and slow, fast, or mixed current-decay modes provides users with a broad, variable range of motor current control.

Internal circuit protection includes thermal shutdown with hysteresis, an undervoltage monitor, and crossover-current protection. Special power-up sequencing is not required.

This new device is targeted at the office automation and industrial markets – in particular, applications including printers, scanners and copiers.

The A4975 is supplied in a choice of two power packages; a 16-pin dual-in-line plastic package with copper heat-sink tabs (suffix B), and a 16-lead plastic SOIC with internally fused pins (suffix LB). For both package styles, the thermally enhanced pins are at ground potential and need no electrical isolation. Both packages are lead (Pb) free, with 100% matt tin lead-frame plating.

Email a Friend

Please enter your e-mail address and the e-mail address of the person you would like to send a link to this article to.

Your e-mail
Their e-mail
Powered by Rochester Electronics

Search for factory authorized mature and end-of-life semiconductors

Part Search:

© Copyright ElectronicSpecifier - Electronics News
Web Design Surrey, hosting & Technology: Strategies Group Plc