Industry News
Sony's coin sized HD camera for security & industrial markets
A high definition, 8.3 megapixel camera module the size of a £1 coin has been developed by Sony Europe's Image Sensing Solutions Division (ISS), the latest addition to the range of MCB modules now available for industrial applications.
EnOcean Alliance Celebrates as Membership Hits 100
The EnOcean Alliance today entered its second year and signed up its 100th member company - a significant double milestone. The Alliance was established in April 2008 by Distech Controls, EnOcean, Masco, MK Electric, Omnio and Thermokon. Now, with membership totalling 100 companies in the building services market from 20 different countries, the EnOcean Alliance offers over 350 interoperable products and deployments have reached over 100,000 buildings globally. In the UK new major projects are rolling out for example with Distech Controls, MK Electric and Thermokon.
NXP Propels NFC with World’s First Industry Standard Chip
NXP has unveiled its Near Field Communication (NFC) controller, delivering a fully compliant platform for handset manufacturers and operators to introduce next generation NFC devices and services. The new NXP PN544 chip is based on the latest NFC specifications by the European Telecommunications Standard Institute (ETSI). It will enable mobile phone users to access a new range of contactless applications such as mobile payments, transport and event ticketing as well as data sharing directly from the mobile phone SIM (Subscriber Identity Module) for improved on-the-go experience.
Open source hardware solution for networked audio & video over Ethernet
XMOS has announced that it has been working with Harman International on joint technology development using the XMOS Ethernet Audio Video Bridging (AVB) Reference Design platform. The Ethernet AVB Reference Design, which is now commercially available, is ideal for the development of a broad range of professional and consumer networked audio and video applications, automotive entertainment systems and home networking systems.
Molex Honoured as a Supplier to winning product in the 2009 Medical Design Excellence Awards
Molex Incorporated is to be honoured as a supplier to a winning product, the NeuroStar TMS Therapy system by Neuronetics Incorporated, in the 2009 Medical Design Excellence Awards (MDEA) competition, the premier awards programme for the medical technology community. The MDEA will present the award on June 10 at the Medical Design & Manufacturing East 2009 Conference and Exposition in New York City.
NI Honours 15 Companies with 2009 Global Supplier Awards
National Instruments has announced the 15 recipients of the company's Global Supplier Awards for 2009. The annual awards were presented to suppliers who through their commitment to excellence, continuous improvement and innovative practices, delivered world-class performance within the global supply chain.
Hot Swap Controller Protects Dual Supplies
Linear Technology has introduced the LTC4222 dual Hot Swap controller for protecting boards with multiple load supply voltages ranging from 2.9V to 29V. When a board is plugged into a backplane, inrush currents can be large enough to create a glitch on the load supply, causing other boards on the bus to malfunction. The LTC4222 enables safe board insertion and removal from a live, two-supply backplane by controlling external N-channel MOSFETs to limit the inrush currents during power up.
Achronix taps Signali for 10/40/100 Gbps encryption IP in fast FPGAs
Achronix Semiconductor has announced the availability of new, high-performance Advanced Encryption Standard (AES) IP cores for its Speedster(tm) 1.5 GHz family. These high-performance 128-bit key size AES cores, from Portland, Oregon-based Signali Corp., are targeted at 10 Gbps, 40 Gbps, and 100 Gbps applications. They demonstrate the speed of the Speedster FGPA fabric, as well as the balance between throughput performance and resource minimisation achieved by the Signali cores.
MOSIS to offer multi-project wafer services for IBM’s 0.180um high voltage process
MOSIS has announced that it will commence multi-project wafer (MPW) runs using IBM's new 0.18um high voltage process. The technology meets the growing demand for ICs to provide a high voltage capability in low power hand-held products. Typical applications include power management ICs for portable devices such as PDAs and cellphones as well as low cost integrated controllers for automotive, medical and industrial designs.
XMOS launches Ethernet-based LED Tile Reference Design Kit
XMOS, the leader in event-driven processors, has launched an Ethernet-based LED Tile Reference Design Kit to enable digital designers to rapidly develop LED tile systems using daisy chains of Ethernet scan boards. All requirements are implemented entirely in software, which is available on an open source basis as a royalty free download.
NXP and Giesecke & Devrient Launch Contactless Fast Pay Solution
NXP and Giesecke & Devrient (G&D), a leading supplier of payment cards, services, and smart card solutions, today announced the introduction of NXP's new Fast Pay contactless security chip and a new line of G&D contactless payment devices based on this IC. Fast Pay-based devices have been specifically designed to provide consumers in the USA and Canada with a convenient and swift contactless payment solution – replacing the need for cash and reducing transaction times.
Nextreme Partners with Nucletron Technologies
Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, and Nucletron Technologies GmbH, a leading source for high tech systems and components in Europe, have entered into a distribution agreement under which Nucletron will distribute Nextreme's thin-film thermoelectric products in Europe. The distribution agreement opens up Nextreme's first sales and marketing channel in Europe.
Sondrel wins Queen’s Award for Enterprise
Sondrel, the European physical implementation IC design house, has today been honoured with the Queen's Award for Enterprise in the Innovation category. The award is the result of the company's success – due in part to the flexible design methodology it has developed for managing costs and durations of projects, and a software environment that allows switching between third party tools for optimum results whilst incorporating debug and management facilities for efficient implementation. This commercially successful innovation is reducing the time to market of IC products and improving design success rate.
Schaffner's High Efficiency EMC Filters for Solar Energy Systems
Schaffner has announced a new range of EMC/EMI filters for use with photvoltaic solar energy inverters. The use of efficient EMC/EMI filters on the DC output side of PV inverters contributes significantly to compliance with the EMC directive and increases system reliability.
Sellafield substantiates first SMART annunciator in compliance with requirements of the UK NII
In accordance with the requirements of the UK Nuclear Installations Inspectorate, every nuclear site licensee in the UK must justify their safety case in order to operate in the UK. This involves substantiating the safety certification of each instrument involved.
Texas Instruments supports ZigBee Alliance plan to integrate Internet Protocol standards for smart energy applications
Texas Instruments has announced the company's strong endorsement of the ZigBee Alliance's recent announcement to integrate Internet Protocol (IP) and open standards. The plan to incorporate global IT standards from the Internet Engineering Task Force (IETF) will allow continued growth of smart grid applications beyond the smart meter with the proven ZigBee Smart Energy public application profile.
Toshiba support for GSA & IET International Semiconductor Forum includes keynote address and access to ASIC and Foundry specialists
Toshiba Electronics Europe has announced its active support for the GSA & IET International Semiconductor Forum on 2nd and 3rd June 2009. The TEE ASIC and Foundry business unit will be exhibiting at the forum as well as offering private meetings with its team of specialists. Mr Noguchi, Technology Executive with the System LSI Division of Toshiba Semiconductor Company, will present a keynote address during the Forum's conference sessions.
ADI creates automotive sales and marketing organisation
Analog Devices has announced the creation of a European automotive Sales and Marketing organisation led by Stefan Steyerl, European Automotive Sales Director, Analog Devices Inc. The automotive sector in Europe continues to evolve in response to regulatory and customer demand, with automotive manufactures increasingly designing cutting-edge electronics in their vehicles to give them a competitive advantage.
Analog Devices and Infineon to collaborate on airbags
Analog Devices and Infineon Technologies have announced they have agreed to collaborate on the advancement of next-generation automotive airbag systems. The ADI-Infineon collaboration will ensure alignment of the companies' respective product roadmaps and interoperability of their sensors and chipsets. The collaboration will accelerate the development of advanced airbag systems and provide automotive safety system suppliers and OEMs access to a complete design platform that will enable a reliable, cost-efficient and easy-to-use advanced airbag solution.
NEC Electronics and Renesas to Integrate Business Operations
NEC Electronics Corporation, Renesas Technology Corp. (Renesas), NEC Corporation, Hitachi, Ltd., and Mitsubishi Electric Corporation today agreed to enter into negotiations to integrate business operations at NEC Electronics and Renesas.
Maxwell's Hybrid Bus Ultracapacitor Order Valued At $13.5 Million
Maxwell Technologies has announced that it has received purchase orders with a total value of approximately $13.5 million from three of China's leading transit bus producers for BOOSTCAP ultracapacitor modules to support braking energy recuperation and torque assist functions in diesel-electric hybrid transit buses.
DiBcom partners with Solaris Mobile for the launch of DVB-SH Mobile TV in Europe
DiBcom, a fabless semiconductor company and leader of Mobile TV solutions, is pleased to announce that it has entered into a cooperation agreement with the satellite-based service Solaris Mobile which recently sucessfully launched its W2A satellite payload. Solaris Mobile will provide mobile television and in-vehicle entertainment, information and communication services across Europe. DiBcom supplies DVB-SH broadcast receiver solutions to enable mobile devices to have access to the multimedia content transmitted by satellite and terrestrial repeater.
Arm And Mindspeed Extend Relationship With Cortex-A9 Processor Agreement
ARM and Mindspeed Technologies today announced that Mindspeed has licensed the ARM Cortex-A9 MPCore processor for use in their next generation, high-performance multiservice networking platforms, designed to support voice and data services across wireline and wireless networks.
Maxim's Fully Integrated VGA Multiplexer Offers Extended ESD Protection
Maxim has introduced the MAX4885E, a complete 1:2 VGA multiplexer. This device switches between two VGA ports while maintaining an ultra-low, 6pF (typ) on-capacitance and low, 5ohm (typ) on-resistance for higher-bandwidth applications (up to 1GHz). The only switch that offers a complete VGA solution for switching and translating R, G, B, DDC, and H/V signals, the MAX4885E delivers 2x more bandwidth than any existing solution and provides extended ±15kV (Human Body Model) and ±8kV (Contact Discharge) ESD protection. The device's advanced integration dramatically reduces design time, saves board space, and minimizes cost, making it the ideal choice for notebook PCs, servers, and consumer video applications.
Ubidyne chooses Toshiba for wireless infrastructure SoC development
Ubidyne, a leader in digital antenna embedded radio technology for wireless communications, has employed Toshiba's TC300 90nm technology in the development of its D2.0 SoC (system on chip) digital up/down converter. The programme used a hybrid design flow that combined ASIC and COT (customer-owned tooling) methodologies to enable Ubidyne to concentrate on system design and the development of its own custom designed, high-speed, digital IP blocks while relying on Toshiba's ASIC expertise elsewhere. Switching frequencies of up to 4GHz are supported in the digital portion of the device.
Scientists at the University of Glasgow develop the World’s smallest diamond transistor
At just 50 nanometres in length the 'gate' of the diamond transistor developed by Dr David Moran, of the Department of Electronics & Electrical Engineering, is more than 1000 times smaller than the thickness of a human hair, and is half the size of the previous smallest diamond transistor developed by Japanese firm NTT.
Ismosys evolves from Spectrum as new demand creation channel for high tech chip solutions
Ismosys has been announced as the new trading name of the international semiconductor rep organisation, the Spectrum Electronics group. The name change is designed to reflect a new approach to the sales channel, combining traditional representation services with other, significant value add services, including specialised inventory holding and shipment capability for partners with limited channel structure or those requiring a very focused approach. Above all, Ismosys works in partnership with all business sectors to deliver exactly what the customer requires at any stage of the product – or company – development cycle.
Foxconn Technology Group joins Qseven Consortium
The Qseven Consortium has announced that Foxconn Technology Group, the only true e-enabled Components, Modules, Moves and Services (eCMMS] provider in the world, has joined the consortium, increasing the number of members to 25. The Qseven Consortium was founded in 2007 by congatec AG, Seco s.r.l. and MSC Vertriebs GmbH and has seen a steady increase in membership ever since.
Plextek in double Queen’s Award win
Plextek, the Cambridge-based electronics and communications design consultancy, today announced that it has won two coveted Queen's Awards for Enterprise, in Innovation and International Trade. Plextek has shown superb growth in its international sales, nearly trebling exports over the last three years to an aggregate of £48m. The company has also been recognised for its continued innovation, particularly in the field of wireless technologies, as illustrated by the success of its Ultra Narrow Band (UNB) radio devices and its Blighter electronic scanning radar technology.
Altera Demonstrates 40-nm Based Broadcast Solutions at 2009 NAB
Altera Corporation today announced it will showcase its broadcast solutions and a number of industry firsts at the 2009 National Association of Broadcasters (NAB) Show in Las Vegas. The combination of Altera's 40-nm FPGAs and HardCopy ASICs and broadcast solutions offers customers integration options that were previously unachievable.
Altera's Stratix III FPGAs Chosen for Harmonic's Next-Generation Universal Broadcast Video Encoder
Altera has announced that Harmonic has chosen its Stratix III FPGAs for its next-generation high-definition (HD) H.264 1080p video broadcast encoder. Delivering the right combination of performance, programmability, flexibility and low power consumption, the Stratix III devices help Harmonic to improve video quality while consuming significantly less bandwidth.
RF Engines wins Queen’s Award for Innovation
RF Engines Limited (RFEL) has announced that it has won the 2009 Queen's Award for Enterprise in the Innovation category, for its unique range of digital signal processing technologies. RFEL's award winning* designs enable fast moving events occurring in the radio spectrum (even rapidly moving signals or fleeting, hopping signals) to be identified, acquired and then extracted for analysis.
Chapel Hill Joins Cree LED City® Program
Chapel Hill, N.C., home to the 2009 NCAA Men's Basketball Champion UNC Tar Heels, has joined the Cree LED City® initiative, an international program to promote and deploy energy-efficient LED lighting. Chapel Hill has installed LED streetlights along the high-profile 100 block of Franklin Street, one of the town's most recognizable landmarks.
Nat Semi Introduces Industry’s Lowest Jitter 3-Gbps SDI Equalizer
A new PowerWise 3-Gbps serial digital interface cable equalizer from National Semiconductor simplifies the design of broadcast video routers, production switchers, distribution amplifiers, editing and conversion equipment. The energy-saving LMH0384 offers the industry's lowest output alignment jitter across cable lengths allowing hardware designers more headroom for designing within system jitter budgets. Tighter jitter budgets translate to cleaner system design, fewer bit errors and crisper images.
NXP to Integrate Adobe Flash Platform for the Digital Home into its STB Platforms
NXP Semiconductors has announced support for the Adobe Flash Platform for the Digital Home. The optimized implementation of Flash technology for Internet connected televisions, set-top boxes (STB), Blu-ray players and other devices in the digital living room is expected to be supported on NXP's IP STB platforms, the STB225 and STB222. Adobe Flash Platform for the Digital Home allows consumers to enjoy rich Flash technology based web content, applications and user interfaces on their televisions, and will change how Internet video content is viewed.
Marshall Electronics Turns to Tektronix for 3Gb/s Monitor Design Validation and Test
Tektronix Inc announced that Marshall Electronics, a leading manufacturer of LCD camera-top and rack mountable monitors, has turned to a Tektronix WFM7120 Waveform Monitor and a TG700 Video Signal Generator with an HD3G7 module for design validation and characterization in the development of the industry's first 3Gb/s serial digital interface (SDI) LCD monitors.
VI Technology’s Multimedia Test System wins prestigious Best in Test Award from Test and Measurement World
Readers of Test and Measurement World have selected VI Technology's Multimedia Test System (MMTS™) as the winner of the prestigious Best in Test Award for the "Audio/Video and Multimedia" category.
Agilent and Symwave Collaboration Enables First-in-Class, High-Quality USB 3.0 Devices
Agilent and Symwave have announced Symwave's use of the Agilent DSA91304A real-time oscilloscope and J-BERT N4903A high-performance serial BERT as part of its comprehensive USB 3.0 device testing and validation. Symwave is a leading silicon supplier of system solutions for SuperSpeed USB storage devices.
Altera Arria GX FPGAs Enable Panasonic P2 Drive to Transfer Video Faster
Providing the underlying technology to accelerate the video transfer process, Altera Corporation today announced Panasonic has selected Altera's Arria GX FPGAs, PCI Express (PCIe) MegaCore IP and Nios® II processor solution for its new AJ-PCD35, five-slot P2 (tapeless format) memory-card drive.
ON Semiconductor Expands Application Specific IC Offering
ON Semiconductor has announced the further expansion of its application specific integrated circuit (ASIC) offering through an agreement with LSI Corporation (NYSE: LSI). The agreement gives ON Semiconductor customers access to an established and cost-effective 110 nanometer (nm) process technology and associated silicon-proven intellectual property (IP) via ON Semiconductor's wafer fabrication facility in Gresham, Oregon.
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