Industry News

National Instruments Awards $1 Million to Advance Medical Device Development Since 2008

National Instruments today announced that it has awarded $1 million USD in software, support and training to medical device manufacturers through its medical device grant program. Since the program began in 2008, 59 grant recipients from around the world have used technology such as the NI LabVIEW graphical system design platform to reduce the cost and complexity of medical device development and quickly create functional prototypes that help prove their inventions. National Instruments also announced that it is continuing the grant program in 2010 and accepting applications until June 30.

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Package Innovation from STMicroelectronics Unlocks Performance Boost for High-Frequency Power Devices

Package Innovation from STMicroelectronics Unlocks Performance Boost for High-Frequency Power Devices

STMicroelectronics has announced innovative plastic air-cavity packages that enable high-power transistors for Radio-Frequency (RF) applications such as transceivers, broadcast equipment and MRI scanners to deliver performance and cost advantages over alternative devices in ceramic packages.

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Baolab creates nanoscale MEMS inside the CMOS wafer

Baolab Microsystems has announced a new technology to construct nanoscale MEMS (Micro Electro Mechanical Systems) within the structure of the actual CMOS wafer itself using standard, high volume CMOS lines, which is much easier and quicker with fewer process steps than existing MEMS fabrication techniques that build the MEMS on the surface of the wafer. This significantly reduces the costs of a MEMS by up to two thirds and even more if several different MEMS are created together on the same chip.

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Analog Devices' Data Conversion Technology Enables MRI Systems To Provide Exceptional Image Quality

Analog Devices' Data Conversion Technology Enables MRI Systems To Provide Exceptional Image Quality

MRI (magnetic resonance imaging) scans provide extraordinarily clear images of the human body and are commonly used to diagnose a wide range of illnesses and injuries, such as Alzheimer's disease, cancerous tumors, and torn ligaments. Analog Devices, Inc. (NYSE: ADI), the leading provider of data conversion technology and longtime collaborator with the medical imaging industry, today introduced a breakthrough in data conversion that gives clinicians and radiologists the superior image clarity they need to see smaller anatomical structures and abnormalities, such as breast cancer cells, than ever before.

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Beihang University of Beijing, China Successfully Integrates Minicom’s Remote Management Solution

Minicom Advanced Systems, a leading developer of remote access and KVM solutions for the data center, announced today that Beihang University (BUAA), a university of engineering science and technology in Beijing, China, has successfully integrated Minicom's remote management solution, to their tremendous satisfaction.

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Ismosys appointed to deliver SAM voice processing message in EMEA

Ismosys, a Spectrum Electronics Group operation, has signed a pan-European deal with Fortemedia Inc, the world leader in small array microphone (SAM ) voice processing technology: The combination of Fortemedia's 3rd generation SAM technology and the company's DSP-based voice processor ICs is delivering industry-leading echo cancellation and noise suppression solutions that enable natural flowing, full-duplex hands-free communication to global manufactures of advanced technology mobile communication devices.

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PREMO highlight at CeBIT 2010 its latest innovations for the ICT sector

PREMO highlight at CeBIT 2010 its latest innovations for the ICT sector

PREMO has successfully participated at the CeBIT 2010, the largest technology exhibition in the field of innovation on information technology and telecommunications, which took place in Hannover (Germany) on 2-6 March and has received Spain as Guest Country.

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Aston Martin and Rolls Royce Address Challenges in Auto and Aero Industries for Nano-enhanced Materials

The Nanotechnology Knowledge Transfer Network (NanoKTN), one of the UK's primary knowledge-based networks for Micro and Nanotechnologies, has announced the date of its next HiPerNano Conference, in partnership with Cranfield University, dedicated to raising awareness and promoting developments in nano-materials for the high performance engineering industry. The conference, exhibition, and poster presentations will showcase new scientific and commercial developments alongside far-sighting by industry professionals on challenges yet to be addressed.

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National Instruments UK & Ireland Launches Grant Programme for Small-to-Medium Enterprises

National Instruments UK & Ireland (Nasdaq: NATI) today announced a grant programme to support micro, small and medium-sized enterprises in embedded development. Starting in 2009, National Instruments UK and Ireland began offering very low cost training and certification to unemployed scientists and engineers to help them develop skills to aid in finding employment.

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NMI membership hits 200 with Areva T&D

NMI membership hits 200 with Areva T&D

The membership of the National Microelectronics Institute (NMI), the trade association representing the semiconductor industry in the UK and Ireland, has reached 200. The Institute, which has seen its membership increase by 100% over the last 3 years, has welcomed global energy transmission and distribution company AREVA T&D as its 200th member.

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TRaC achieves IECEx qualification

Manufacturers of equipment designed for operation in hazardous areas and explosive atmospheres can simplify the process of marketing their products internationally, using the services of test house TRaC, which is now qualified under the IECEx System.

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Peregrine Semiconductor Expands European Operations

Peregrine Semiconductor Expands European Operations

Peregrine Semiconductor announced the expansion of its European design and manufacturing operations and the opening of a new facility located in Aix-en-Provence, France. Peregrine Semiconductor Europe (PSE) operations include RF integrated circuit (RFIC) design and engineering at its design center in Aix-en-Provence, France; IC wafer manufacturing from wafer foundry Sapphicon in Australia and UMC in Taiwan; assembly and packaging from Hybritech Composants Microelectroniques (HCM) France; and back-end testing at partner Rood Microtec in Germany. PSE activities will focus on developing new RFIC products of European content to better support specific European design requirements, as well as providing design services for Peregrine's next-generation UltraCMOS™ RFIC portfolio sold worldwide.

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Maxwell Technologies Delivers One-Millionth Large Cell Ultracapacitor

Maxwell Technologies announced today that it reached a significant milestone in December with the delivery of its one-millionth large cell BOOSTCAP ultracapacitor.

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Voith Turbo Selects Maxwell Technologies' Ultracapacitor Modules for Low-Emission, Fuel-Efficient, Hybrid Transit Bus Drive Systems

Maxwell Technologies announced today that Voith Turbo, a leading producer of heavy vehicle drive systems, has selected Maxwell's 125-volt BOOSTCAP ultracapacitor modules for braking energy recuperation and torque assist in low-emission, fuel-efficient, hybrid-electric transit bus drive systems.

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ZF is Entering the Market for Telematics Solutions in a Strategic Alliance with Intel

ZF uses its expertise in the networking of components in the driveline to embark on a new business model: Under a strategic alliance with Intel, ZF will create a hardware and software platform which is available for telematics applications. The platform called openmatics can be used for example in citybusses from all manufacturers.

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ZF enters joint venture with Hero Motors Ltd. of India

ZF and Hero Motors Ltd. today signed a contract establishing the joint-venture enterprise ZF Hero Chassis Systems, securing access for ZF to India's booming market for small cars. The automotive industry supplier is acquiring fifty percent of Hero Chassis Systems including two assembly plants in Halol, around 300 miles north of Mumbai, and in Talegaon, near Pune. Initially, some 100 employees will be engaged in the assembly of car axles for General Motors.

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Lanner’s Fanless Digital Signage Platform with Dual Display Support and S-Video Connection

Lanner’s Fanless Digital Signage Platform with Dual Display Support and S-Video Connection

Lanner has released the LEC-7030, an interactive platform aimed at the narrowcasting segment of the digital signage market. New features of the LEC-7030 include both S-Video and RCA Audio inputs. Additional features include an onboard 1.6GHz Intel Atom with VGA and DVI-D video outs.

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Soitec announces volume production of new generation of high-resistivity SOI substrates for cellular phone and Wi-Fi markets

The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today volume production of its new generation of state-of-the-art high-resistivity (HR) silicon-on-insulator (SOI) substrates to serve the growing cellular phone and Wi-Fi markets. Soitec recently completed qualification at major customers for volume production in response to their rapidly growing demand. Soitec fined-tuned its HR-SOI process to stabilize the base wafer resistivity in order to meet all cellular electrical specifications.

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Concentrix Solar enters the US market with megawatt CPV deployment at a Chevron facility

Concentrix Solar, a leading supplier of Concentrator Photovoltaic (CPV) systems and a new division of the Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates, announced today that it has signed a contract with Chevron Technology Ventures for the deployment of a one megawatt (MW) CPV power plant to be installed at a Chevron Mining facility in Questa, New Mexico, USA. With this announcement, Concentrix Solar confirms full commercial readiness for worldwide deployment, and is paving the way to utility-scale CPV projects.

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MindTree Unveils Bluetooth Low Energy Stack on TI’s WiLink 7.0 Solution

MindTree Ltd., a global IT solutions company and a leading provider of Bluetooth Intellectual Property (IP) solutions, today announced the launch of its EtherMind Bluetooth low energy stack on the quad-radio, single-chip WiLink? 7.0 solution from Texas Instruments Incorporated (TI).

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MindTree Steps up Efforts to Leverage Middle East IT Services Market

MindTree Ltd., a global IT solutions company, has announced that it is stepping up its efforts to leverage the growth of the Middle East IT services market, which is expected to hit USD 3.5 billion by 2011, according to recent reports from the Economist Intelligence Unit (EIU). Identified by the Company as one of its fastest growing regions, the Middle East forms part of MindTree's 'Rest of the World' (ROW) market along with Japan, Australia and Singapore, which collectively contributed 10.8 per cent to its total earnings in Q3 FY '09-'10. MindTree sees the Middle East region to play a key role in its plan to become a USD 1 billion organization.

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NanoKTN and Institute of Nanotechnology Launch International NanoMicroClub to Encourage Global Investment in UK SMEs

The Nanotechnology Knowledge Transfer Network (NanoKTN), one of the UK's primary knowledge-based networks for Micro and Nanotechnologies, and the Institute of Nanotechnology (IoN), a professional membership organisation for the nanotechnology industry, has announced its collaboration that with the support of Technology Strategy Board funding, will encourage and support global business development for UK SMEs.

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TPACK Partners with Cypress on Reference Design For Ethernet Switches and Traffic Managers

Cypress Semiconductor and TPACK, an industry-leading provider of ICs that provide core data transport and switching functions, today announced a reference design for ultrafast Ethernet switches and queue management applications. The new Springbank reference design combines TPACK's TPX4004 high-capacity integrated packet processor and traffic manager with Cypress's CY7C15632KV18 72-Mbit Quad Data Rate™II+ (QDR™II+) SRAMs, offering the fastest available speeds with roadmaps for simple upgrades. The TPACK reference design also provides an easy interface to various FPGAs and is backed by robust application support.

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Intel and RealVNC collaborate to provide innovative, built-in remote control

Intel and RealVNC have collaborated to embed VNC remote control technology in the all new 2010 Intel® Core™ vPro™ processor familyto provide IT professionals with a built-in, fully graphical remote control capability to facilitate problem diagnosis and resolution.

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Imagination Announces Quarter of a Billion POWERVR Devices Shipped

Imagination Technologies, the leading multimedia chip technologies company, reports that POWERVR, its hardware graphics acceleration technology, has become the standard for mobile and embedded gaming. POWERVR now has an installed base of over 250 million devices across the mobile phone, media player and embedded markets.

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PDI Joins Data Center Alliance

Minicom Advanced Systems, a leading developer of IT & KVM remote access and management solutions, welcomes PDI, a manufacturer of electrical equipment for computer data centers, industrial and commercial buildings, and alternative energy applications to the Data Center Alliance (DCA.).

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Dialog Semiconductor ICs power Sharp's latest 3G Phones

Dialog Semiconductor has announced its power management ICs have been designed into a series of Sharp 3G cellphones. The first of which, the Sharp AQUOS SHOT 940SH, is available now from the Japanese network operator, Softbank.

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Murata Elektronik joins Association for Automatic Identification and Mobility

Murata Elektronik GmbH has become a Manufacturer-member of the German chapter of AIM, the worldwide industry association for Automatic Identification and Mobility. Representing automatic identification and mobility technology solution providers, AIM has led the way in industry standards, education and outreach since 1972.

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COMPRION launches new 3FF products

COMPRION's product range supporting the Third Form Factor (3FF) has been extended by a new Mini- UICC Adaptor and new Flex Adaptors. Since 2006 COMPRION offers Test (U)SIMs in the smallest available card format following ETSI TS 102 221. The 3FF SIM card, also known as Mini-UICC or MicroSIM, is half the size of SIM cards today.

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Imec and Synopsys collaborate on 3D stacked IC development

Synopsys and the Belgian nanoelectronics research center, imec, today announced they have entered into a collaboration to use Synopsys TCAD (Technology Computer-Aided Design) finite-element method tools for characterising and optimising the reliability and electrical performance of through-silicon vias (TSVs). The collaboration will accelerate the development of 3D stacked IC technologies.

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SiTel and Target Partnership Yields Powerful VoIP DSP

SiTel and Target Partnership Yields Powerful VoIP DSP

SiTel Semiconductor today announced how its successful collaboration with Target Compiler Technologies led to the creation of customized audio DSPs for its SC14452 Green VoIP processor. The DSPs combine extreme energy efficiency with high processing performance, enabling industry-leading audio quality and power consumption. Key components of the SC14452 that won a 2009 Frost and Sullivan Green Excellence Award, the DSPs were developed using Target's IP Designer retargetable tool suite.

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Arm AMBA 4 Specification Maximizes Performance And Power Efficiency

ARM announced availability of phase one of the new AMBA 4 specification, providing increased functionality and efficiency for complex, media-rich on-chip communication.

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Lattice Ships Over  200 Million ispMACH 4000 CPLD Devices

Lattice Ships Over 200 Million ispMACH 4000 CPLD Devices

Lattice Semiconductor announced that it has shipped over 200 million ispMACH 4000 complex programmable logic devices (CPLD). The Lattice ispMACH 4000 CPLD family provides a variety of design solutions, from glue logic and general purpose I/O expansion to voltage level translation and LED drivers. Engineers around the globe have widely adopted the ispMACH 4000 CPLD as a standard due to its balance of price, power and packaging options.

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Geensoft launches Reqtify 2010

Geensoft launches Reqtify 2010

Geensoft, the specialist independent provider of software design tools and associated professional services for embedded systems development, has launched Reqtify 2010, a major new version of its award-winning tool suite for the automated management of embedded hardware and software requirements capture, traceability and impact analysis throughout the entire development lifecycle. Reqtify 2010 delivers improved productivity through an extensive range of new and enhanced plug-in tools, features and interfaces.

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UK SMEs urge simplification of regulations and directives

A recent survey of Small and Medium Enterprises (SMEs) in the UK electronics sector has revealed significant findings that will play a key role in shaping the future of these enterprises. Conducted by Premier Farnell in conjunction with The Electronics Leadership Council (ELC) and the UK Electronics Alliance (UKEA), The British SME Technology Survey gathered information to help understand the current state of mind, challenges and needs of SMEs and support them to push forward out of the recession to a profitable future.

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Schneider Electric Selects Coverity for Software Integrity

Coverity, Inc., the software integrity leader, today announced that Schneider Electric (http://www.schneider-electric.com), one of the world's largest energy management providers, has selected Coverity Static Analysis to automatically find software defects across its Automation and Control software product portfolio.

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EPLAN PLC & Bus Extension module

EPLAN PLC & Bus Extension module

Total consistency from project planning with PLC programming to operation is mandatory for the engineering of flexible machine and system configurations. The PLC & Bus Extension module, an add-on from electrical design software developer EPLAN, ensures consistent data in hardware and software planning.

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Silentium Selects Blackfin for Active Noise Cancellation Products

Analog Devices announced that Silentium Ltd., developers of spatial & broadband active noise control (ANC) technologies, has selected Analog Devices' Blackfin processors to power their ANC products. Utilizing low cost, powerful Blackfin processors for their core ANC technology, the S-Cube™ Controller, Silentium is able to deliver more than 10dB (A) broadband noise reduction covering the entire audible range and, in addition, deliver from 100Hz up to 2KHz point to zone spatial noise reduction.

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Silentium Uses Blackfin Processors To Bring Active Noise Cancellation To A Multitude Of Applications

Analog Devices announced that Silentium Ltd., developers of spatial & broadband active noise control (ANC) technologies, has selected Analog Devices' Blackfin processors to power their ANC products. Utilising low cost, powerful Blackfin processors for their core ANC technology, the S-Cube™ Controller, Silentium is able to deliver more than 10dB (A) broadband noise reduction covering the entire audible range and, in addition, deliver from 100Hz up to 2KHz point to zone spatial noise reduction.

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Agilent Technologies Lends Support to USA Science & Engineering Festival

Agilent Technologies Inc. (NYSE:A) today announced its support of the USA Science & Engineering Festival, the country's first national science festival. The event will take place in Washington, D.C., in October 2010. The festival, expected to be a multi-cultural and multi-disciplinary celebration of science in the United States, will offer science and engineering organizations throughout the country the opportunity to present hands-on science activities to inspire the next generation of scientists and engineers. Festival organizers already have engaged more than 350 participants from the nation's leading science and engineering organizations.

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