Xilinx FPGA Development Platform Enables Broadcast Equipment Makers to Meet Real-Time 3D TV Bandwidth and Processing Demands
Xilinx announced at the IBC2010 conference a new development platform for engineers working to meet the rapidly growing demand for 3D TV broadcast and other high definition video applications. The Xilinx(R) Spartan(R)-6 FPGA Broadcast Connectivity Kit and Broadcast Processing Engine IP core enable broadcast system designers to build full systems for driving the high-speed transmission and real-time processing of video in a full range of professional broadcast applications including cameras, switchers, routers, encoders, monitors and cinema projectors. The low-cost Field Programmable Gate Array (FPGA) implementation of Triple-rate SDI (SD, HD, 3G) and other interfaces along with real-time video processing gives designers the ability to stay focused on product differentiation throughout the design cycle and into production in the face of constantly evolving standards and demands on performance.
Xilinx Demonstrates Intel QuickPath Technology for FPGAs at Intel Developer Forum
Xilinx showcased at the Intel Developer Forum the Intel(R) QuickPath Interconnect (Intel(R) QPI) technology for enabling the integration of Field-Programmable Gate Arrays (FPGA) in high performance computing applications. The demonstration shows how high-performance Virtex FPGAs can support the low latency and memory coherency benefits of Intel(R) QPI when paired with Intel(R) Xeon(R) processors in HPC systems.
DEK and AGI Expand Stencil Franchise Relationship; Add Facility in Florida
Building on the success of the companies' initial, Alabama-based stencil franchise operation, DEK and AGI announce the expansion of the partnership with the addition of a stencil manufacturing facility in Tampa, Florida. This extension of the DEK network effectively enables greater accessibility to DEK's proven stencil technologies by providing more outlets from which to source these award-winning products and services. Under the terms of the agreement, AGI's Tampa facility will serve customers in Florida, North Carolina, South Carolina, Virginia and Puerto Rico.
Hemisphere GPS and Stara Introduce Customized eDriveX in Brazil
Today, Hemisphere GPS and Stara S.A. Industria de Implementos Agricolas launched eDriveX in Brazil under the Stara brand, SPEED DRIVEx. Stara, one of the world's largest agricultural equipment manufacturers, is offering SPEED DRIVEx as a part of their precision automated steering solution that also includes the Outback S3(TM) guidance terminal and BaseLineX(TM) GPS base station. The new system, SPEED DRIVEx, will be sold throughout Stara's distribution network that includes over 1100 resellers. Hemisphere GPS' eDriveX systems will ship in volume to Stara during the fourth quarter of 2010.
Prestigious Indian institute places multiple orders
Oxford Instruments Plasma Technology, leader in etch, deposition and growth systems, has recently received an order for three plasma etch and deposition tools from the Centre of Excellence in Nanoelectronics (CEN) at the Indian Institute of Science (IISc) in Bangalore, India. The three System100 tools will be situated in the CEN's state-of-the art nanofabrication facility's new clean room and consist of two PlasmaPro™ System100 ICP Cobra etch tools and one PlasmaPro System100 PECVD tool.
Siano Launches Advanced Receiver Chip for USA Mobile Digital TV
Siano Mobile Silicon (www.siano-ms.com), the world's leading supplier of digital mo-bile TV receiver chips, announced today the launch of a new product, targeting the emerging mobile TV market in the United States.
Brainboxes reduces shipping costs to UK & Europe through online store
Brainboxes, a leader in Serial Connectivity and Bluetooth, has now further improved its online store with our new low shipping costs to the UK and Europe. As our business is continues to grow throughout the world, we are constantly looking at ways to make our online store more cost effective.
PLX Technology Selects Paragon Software for High-Performance Cross-Platform Technology
Paragon Software Group and PLX Technology, Inc announced that Paragon's Universal File System Driver (UFSD) technology has been chosen to provide high-performance, cross-platform read/write access for the latest PLX® network attached storage (NAS) products.
Soitec announces global alliance with Johnson Controls to capture utility scale solar energy projects
Soitec (Euronext Paris), the world's leading supplier of silicon-on-insulator (SOI) and advanced solutions for the electronics and energy industries, announced today that its Concentrix Solar division focusing on concentrator photovoltaic (CPV) systems, has concluded a global alliance with Johnson Controls (NYSE: JCI), the global leader in delivering products, services and solutions that increase energy efficiency in buildings.
Soitec announces Concentrix Solar joining the Transgreen Initiative
Soitec (Euronext Paris), the world's leading supplier of silicon-on-insulator (SOI) and advanced solutions for the electronics and energy industries, announced today that its Concentrix Solar division focusing on concentrator photovoltaic (CPV) systems, has joined the Transgreen Initiative. Transgreen was recently created within the context of the Mediterranean Solar Plan to stimulate the development of a Trans-Mediterranean electric power transmission network to respond to the significant expected needs for electricity exchange between the two sides of the Mediterranean. Concentrix Solar's CPV technology is designed for use by large-scale solar power plants in hot and arid regions. The systems are extremely efficient, modular, flexible and very well-suited to the needs and challenges of the Mediterranean region to produce low cost electricity.
Sunplus Reduces Design Cycle on High-Speed Multi-Million-Gate SoC Using Cadence Encounter Digital Implementation System
Cadence Design Systems today announced that Sunplus Technology Co., Ltd. (TAIEX: 2401, LSE: SUPD), a leading multimedia IC design company, adopted the Cadence Encounter® Digital Implementation (EDI) System for its multimedia system-on-chip (SoC) designs.
Global Unichip Boosts Design Productivity with Cadence Encounter Timing System
Cadence Design Systems today announced that Global Unichip Corporation (GUC) has adopted the Cadence® Encounter® Timing System to reduce time to final design closure efficiently in its Encounter Digital Implementation (EDI) System-based design flows. By adopting the integrated signoff solution, GUC is able to shorten lead time and reduce tapeout schedule risk for Silicon Realization.
Underwriters Laboratories Expands Its Global Photovotaic Footprint To Japan
Underwriters Laboratories (UL), a global leader in safety testing and certification, announced today the opening of a testing and certification facility for photovoltaic (PV) equipment in Ise City, Mie Prefecture, Japan. In addition to offering performance and safety testing services for PV equipment in Japan, the facility will provide technical support to Japanese PV equipment manufacturers as they develop their businesses and enter overseas markets.
Anritsu appoints Trescal as the sole Anritsu Certified Service Partner in (ACSP) in France.
Anritsu are delighted to announce the appointment of Trescal as its sole certified service partner in France. This certification means that Trescal will be providing OEM backed calibration and repair services on Anritsu products via their network of labs through-out the country. Anritsu will be directly supporting Trescal, as an integral part of this relationship, to ensure the continuing high quality service support of Anritsu products for their French customers.
Huawei Selects Spirent to Test HSPA+ User Devices
Huawei, a leader in providing next-generation telecommunications network solutions, selected Spirent Communications to help validate the performance of its HSPA+ data cards. With Spirent, the leader in testing solutions for wireless networks, devices and services, Huawei is able ensure its customers' high-speed HSPA+ data networks offer a superior subscriber quality of experience (QoE) and seamless mobility.
Spirent Recognized for Technology Innovation at NetEvents EMEA Press Summit
Spirent Communications continues to gain industry recognition for its market-leading approach to advancing cloud computing testing. At the recent 2010 NetEvents EMEA Press Summit in Istanbul, Turkey, Spirent was named the 'Most Innovative Technology Company of the Year' and also received the 'Most Innovative Test & Measurement Product of the Year' award for its Spirent Avalanche Virtual solution.
Spirent Puts Cloud Security to the Test
Independent test lab, Broadband Testing, and test and measurement leader, Spirent Communications, achieved a significant breakthrough in securing virtual environments and allaying user fears about cloud based applications. A new report Secure Virtual Data Center Testing provides a detailed account of how HP TippingPoint's Secure Virtualization Framework (SVF) solution is able to create a secure virtual data center environment, resisting all recognized attacks. Even more significant is the way security can be rigorously tested under "real world" operating and attack conditions using Spirent's pioneering cloud computing testing solutions with performance, availability, security and scalability (PASS) methodology.
Spirent and AGI Partner for Enhanced GNSS Testing
Spirent Communications plc (LSE: SPT) today announced it has teamed with Analytical Graphics, Inc. (AGI) to provide an integration between AGI's STK analysis and visualization software and Spirent's test manager software suite, SimGEN.
Penny + Giles Launches New German-Language Website
Penny + Giles, a business group of Curtiss-Wright Controls and a designer and manufacturer of position sensors, solenoids, and joystick controllers has announced the launch of its new website, www.penny-giles.de, designed to support key German language speaking markets, including Germany, Austria and Switzerland. The new website is supported by Penny + Giles GmbH, located in Ingolstadt, Germany.
Full-featured Value Boundary-scan Developers Suite / ProVision Designer Station offers complete JTAG development package
JTAG Technologies announced a new economically-priced software and hardware system for board-level and system designers looking to benefit from a boundary-scan test and programming strategy.
CHH CoNeX sets flightplan for success following aerospace accreditation
Birmingham-based cable assemblies, integrated products and logistics services provider, CHH CoNeX, has accelerated its drive into the aerospace and defence markets after securing the coveted AS9100 international aerospace industry certification.
SABIC Innovative Plastics’ Expanded Geloy PC/ASA Portfolio Opens New Possibilities; Specialty Grades Build on World-Class Weatherability, Impact
SABIC Innovative Plastics' leadership in developing materials that reduce system costs and respond to its customers' sustainability needs has resulted in another landmark achievement: an expanded portfolio of Geloy* polycarbonate/acrylonitrile-styrene-acrylate (PC/ASA) resin blends that open new opportunities for key market sectors. Originally developed for the automotive industry to deliver improved mechanical performance and extreme weatherability,
TT electronics to help represent UK at prestigious AUSA 2010
TT electronics announces it will be showcasing the Group's expertise in the Defence & Aerospace industry at this year's AUSA (25th to 27th October, Washington D.C, Convention Centre); the world's largest land warfare exposition. This year marks the 60th anniversary of AUSA, held by the Association of the United States Army, and will include over 500 industry and military exhibits.
Agilent Technologies and Strand Team Up to Advance Integrated Biology Software Systems
Agilent Technologies Inc. (NYSE: A) and Strand Scientific Intelligence Inc. today announced an agreement to expand the scope of the Agilent GeneSpring bioinformatics system across multiple life-science disciplines; drive future innovation; and deliver new channels for accessing the software and customer support.
LA Metro selects NXP's MIFARE Ultralight technology for paper ticketing
NXP Semiconductors N.V. (Nasdaq: NXPI) today announced that Los Angeles County Metropolitan Transport Authority (LA Metro) will begin circulating single and limited-use paper tickets that will use NXP MIFARE Ultralight™ contactless chip technology within its existing automatic fare collection infrastructure.
NXP Scores Gold for its Innovative Website and Marketing Campaigns
NXP announced that it has won two leading industry awards for its website and online marketing activity – the 2010 WebAward for outstanding achievement in web development and MediaPost's Online Media, Marketing & Advertising (OMMA) Member's Choice Award for the best integrated online campaign.
STMicroelectronics Wins Award from Nokia for Outstanding Achievement in Sustainability
STMicroelectronics today announced it had been recognized for its achievements in 'Sustainability' by Nokia, the world leader in mobile communications. Nokia presented its award for 'Outstanding Achievement in the Category of Sustainability' to ST at Nokia World 2010 in London, during the Nokia 'Collaboration Day.'
intoPIX delivers its high performance 4K JPEG 2000 decoder to Sony Corporation
intoPIX, the leading JPEG 2000 solutions provider, today announced that Sony Corporation has licensed and integrated the intoPIX 4K JPEG2000 decoder into the 4K SXRD digital cinema system. With its smart single chip FPGA implementation, impressive performance and quality, the 4K decoder offers a unique solution, making it the technology of choice for the digital cinema industry.
RFMD Announces Additional Expansion Of Foundry Services To Include Molecular Beam Epitaxial (MBE) Products And Services
RF Micro Devices, Inc. (Nasdaq GS: RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced the Company has further expanded its Foundry Services to deliver multiple molecular beam epitaxial (MBE) platforms, epitaxial characterization and epitaxial development structures, including specialty and high-volume, arsenic- and phosphorus-based processes.
Laird Technologies Named to the 2010 CW 100 by Connected World Magazine
Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced that it has been named to the 2010 CW 100 by Connected World magazine.
Laird Technologies to Attend 4G World 2010 Trade Show
Laird Technologies today announced it will be attending the 4G World™ 2010 Chicago trade show. The trade show is being held at the McCormick Place, West Building – 3rd Floor in Chicago, Illinois, October 18-21, 2010. Laird Technologies can be found at booth #916.
Contour launches world’s first hands-free GPS video camera using u-blox technology
Contour, a market leader in hands-free video cameras, has selected u-blox' GPS technology to usher in a new era of location-based video. The addition of u-blox GPS to the ContourGPS video camera adds a new layer of excitement to adventure videos enabling consumers to show their friends where they went, track their journey, and discover new places to go.
AWR Announces “High-Frequency Design Success” Tour in Europe
AWR Corporation announces it has scheduled its High-Frequency Design Success seminar tour in Europe, covering engineering centers in 13 cities. Along with AWR partners like Rohde & Schwarz, Aktif Neser Elektronik, Medeos and RDT Equipment & Systems, the one-day seminars focus on tools and methodologies for improving user-productivity and streamlining the workflow for today's RF/microwave designs.
EnSilica and Pebble Bay collaborate to target automotive electronics design
EnSilica, a leading independent provider of front-end IC design services, and Pebble Bay, a leading embedded systems development consultancy, are collaborating to target the automotive electronics design market by porting ERIKA Enterprise, the free-of-charge, open source RTOS for automotive systems, to EnSilica's family of highly configurable and low-power eSi-RISC soft processor cores. The port provides proof of the suitability of EnSilica's eSi-RISC processors to embedded automotive systems applications and effectively demonstrates Pebble Bay's embedded software development and consulting services credentials to potential customers in the automotive electronics market.
austriamicrosystems introduces “More Than Silicon” initiative
austriamicrosystems Full Service Foundry business unit today introduced its "More Than Silicon" initiative, a comprehensive service and technology package that goes beyond industry standard foundry services. Foundry customers instantly benefit from access to leading edge technology add-ons, advanced packaging services and dedicated support engineers to enable first-time-right designs.
Laird Technologies to Attend P&T / EXPO COMM CHINA 2010 Trade Show
Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will be attending the P&T / EXPO COMM CHINA 2010 trade show for Asia. The trade show is being held at the China International Exhibition Center in Beijing, China, October 11-15, 2010. Laird Technologies can be found at booth #A060g.
Renesas Strengthens its Compound Semiconductor Business
Renesas today announced new objectives to strengthen the company's compound semiconductor business, which includes opto devices formed by compound semiconductor such as gallium arsenite (GaAs), and microwave devices. Renesas Electronics plans to: (1) Acquire and retain the global top market shares (Note 1) with photocouplers, RF (radio frequency) switch ICs and other focused products. (2) Launch new gallium nitride (GaN)-based semiconductor products by March 2011.
RFMD Expands Foundry Services Offerings To Include Gallium Arsenide (GaAs) Technologies Manufactured In Europe
RF Micro Devices, a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced the Company has added its world-class Gallium Arsenide (GaAs) technology to RFMD's foundry services portfolio and will begin providing a full suite of GaAs Pseudomorphic High Electron Mobility Transistor (pHEMT) technologies to customers of its Foundry Services business unit.
Belden demonstrates signal transmission solutions for mission critical applications
At Matelec 2010, to be held from 26 until 29 October 2010 in Madrid, Belden will showcase a range of effective signal transmission solutions for mission critical applications in a range of industries, including alternative energy, railway transportation systems and data centers.
Lattice Diamond Design Software Named Finalist In Elektra Awards Competition
Lattice Semiconductor Corporation today announced that an independent panel of judges has named the Lattice Diamond design software environment a finalist in Elektra 2010, the European Electronics Industry Awards competition.
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