STI’s Engineering. multichip, module
STI Electronics to Feature Key Engineering Services at Space and Missile Defense Conference and Exhibition
News Release from:
STI Electronics Inc
18 July 2011
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, will feature its key engineering services at the upcoming Space and Missile Defense Conference and Exhibition, scheduled to take place August 15-18, 2011 at the Von Braun Center in Huntsville, AL.
STI’s Engineering Services division will feature its custom manufacturing for the defense sector, as well as counterfeit detection. Additionally, the microelectronics lab specializes in state-of-the-art engineering design and assembly including current technologies such as chip-on-board (COB) and multichip module (MCM) as well as emerging technologies such as STI’s patented packaging technology coined Imbedded Component/Die Technology (IC/DT®).