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National Instruments Experts Present “Advanced Technologies and Applications in Military & Aerospace” Webcast Series

Registration is now open for military and aerospace engineers to attend a series of webcasts that focus on the many demands facing engineers in the industry, including software, electronic, and mechanical design challenges; complex testing requirements; pressure on development and life cycle costs; and increasing requirements for safety, efficiency and innovation.

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NEC Electronics and Renesas Announce the New Organizational Structure and Personnel Changes Following Merger

NEC Electronics Corporation and Renesas Technology Corp. today announced the new organizational structure and personnel changes of Renesas Electronics Corporation (Renesas Electronics), the new integrated company that will be formed on April 1, 2010 when the business integration (the "Business Integration" or the "Merger") of the two entities is completed.

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Coolcentric™ Joins Data Center Alliance

Minicom Advanced Systems, a leading developer of IT & KVM remote access and management solutions, announced that Coolcentric, a division of Vette Corp which specializes in end-to-end thermal management solutions for data centers, has joined the Data Center Alliance (DCA). The Data Center Alliance, formed with Minicom, Wright Line, ServerTechnology, Uptime Devices, and Digi International fills the information gap in the marketplace by providing a centralized, comprehensive source for building successful IT infrastructures.

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Agilent Technologies Introduces BioHPLC Columns for Characterization of Bio-Molecules

Agilent Technologies announced the availability of new ion exchange and size exclusion columns specifically designed for the analysis of bio-molecules including monoclonal antibodies, recombinant proteins, peptides, vaccine products and DNA/RNA. The columns provide robust, reproducible and high-resolution solutions for biopharmaceutical manufacturers to effectively monitor the safety, efficacy and stability of their products.

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STMicroelectronics’ Embedded Microprocessor Powers Innovative IP Phones from snom technology

STMicroelectronics’ Embedded Microprocessor Powers Innovative IP Phones from snom technology

A state-of-the-art embedded microprocessor from STMicroelectronics, a world leader in System-on-Chip technology, has been selected for next-generation IP telephones from snom technology, a leading producer of VoIP equipment for enterprise communication.

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STMicroelectronics Arms Pay-TV Industry in Battle Against Piracy

STMicroelectronics is sampling the first STB System-on-Chip (SoC) devices featuring advanced CryptoFirewall security helping to prevent hacking of pay-TV broadcast signals and enable faster, lower-cost development of new set-top box products.

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Four new 8-bit MCUs with integrated LCD controller simplify smart electricity meter designs

Four new 8-bit MCUs with integrated LCD controller simplify smart electricity meter designs

Gleichmann Electronics broadens its product portfolio with four new 8-bit All Flash™ microcontrollers from NEC Electronics, which are specifically designed for single-phase and two-phase electricity meters. Depending on the version, microcontrollers of the 78K0/Lx3-M series come in a 64-pin or 100-pin low-profile quad flat package (LQFP) and offer many integrated analog and digital peripherals including a high-precision 24-bit ΔΣ A/D converter and special measurement and processing units for calculation of active and reactive power as well as apparent power. In addition, the device offers detection of SAG, power outages and peaks.

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Leading Healthcare Bedside Terminal Manufacturer  Opens US Headquarters

Leading Healthcare Bedside Terminal Manufacturer Opens US Headquarters

JAOtech Ltd. has announced the opening of its U.S. headquarters in Trumbull, Connecticut. The facility serves as JAOtech's sales, marketing and technical support centre for the United States and Canada. JAOtech Corporation, the company's wholly owned U.S. subsidiary, has an installed base of more than 13,000 terminals in North America.

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Satellite modem from Solid State Supplies provides unlimited global coverage for M2M

Satellite modem from Solid State Supplies provides unlimited global coverage for M2M

Solid State Supplies now offers Digi's m10 satellite modem, providing worldwide satellite data transmit and receive capabilities for a wide variety of asset-tracking and industrial remote communication applications. Operating on the ORBCOMM low-earth orbit (LEO) satellite network, it is designed to enable Machine-to-Machine (M2M) communication with virtually unlimited global coverage and no blockage.

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AirMagnet Enterprise Delivers Zero-day Protection Against Latest Wi-Fi Security Exploits and Vulnerabilities

AirMagnet Inc., a Fluke Networks company, today announced that AirMagnet Enterprise, the industry's premier application for managing and securing corporate WLAN deployments, delivers zero-day protection against the latest Wi-Fi security exploits and vulnerabilities, ensuring that AirMagnet customers are protected without having to upgrade their current systems.

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CadSoft’s EAGLE wins ‘Product of the Year'

CadSoft’s EAGLE wins ‘Product of the Year'

Premier Farnell announce EAGLE software v5.6 has been voted winner of the 'Engineering Software Product of the Year' category at the 2010 Elektronik Magazine Awards. The award is even more significant because it is decided by votes from the design engineering readership of the German based magazine. This is the sixth time CadSoft has been honoured by Elektronik readers. The winning selection was made out of 11 entries in the Engineering Software category, in which EAGLE version 5.6 was entered for its new follow-me router.

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Additional Free Training Offered by Cypress for PSoC 3 and 5

Cypress Semiconductor announced several new online training modules and videos about its PSoC(r) 3 and PSoC 5 programmable system-on-chip architectures and PSoC Creator(tm) integrated development environment (IDE). The six new online training modules join the four existing modules available at www.cypress.com/psoctraining to provide engineers with in-depth training on the PSoC 3, PSoC 5 and PSoC Creator offerings. The modules teach engineers how to take advantage of the high-precision analog, programmable digital and high-performance cores and CPU subsystems through a combination of lecture and hands-on labs.

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Sensortechnics Distributes Miniature Liquid and Pneumatic Diaphragm Pumps from Hargraves Technology Corporation

Sensortechnics Distributes Miniature Liquid and Pneumatic Diaphragm Pumps from Hargraves Technology Corporation

Sensortechnics GmbH expands its product portfolio of fluidic control devices as Certified Distributor of miniature liquid and pneumatic diaphragm pumps from the Hargraves Technology Corporation. As a leading supplier of high quality sensors, actuators and custom sensor designs as well as integrated sensing and fluidic control systems these new products add to the existing range for OEM device manufacturers in the medical, analytical, laboratory and instrumentation market.

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NTUA To Trial Dragonwave’s New Horizon Quantum Radio For LTE Pilot On Navajo Nation

DragonWave Inc. a leading global supplier of packet microwave radio systems for mobile and access networks, today announced that the Navajo Tribal Utility Authority (NTUA) has agreed to a commercial field test using DragonWave's Horizon Quantum radio product.

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Altera's Stratix IV FPGAs Pass Interlaken Interoperability Test

Altera Corporation announced its Stratix IV FPGAs passed the Interlaken Alliance's device interoperability testing. Altera certified its high-performance FPGAs interface with third-party components using the Interlaken protocol. Stratix IV GT FPGAs passed interoperability testing at 6.25-Gbps line rates and are the industry's only Interlaken solution capable of supporting line rates of 10 Gbps. Device interoperability testing validates Stratix IV FPGAs for chip-to-chip Interlaken interface and ensures they can be quickly deployed as a turnkey solution for next-generation wireless and wireline infrastructure applications.

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Xilinx Lowers Cost and Power of High-Performance Video Processing for Industrial Imaging Applications

At Embedded World 2010, Xilinx, Inc. introduced the Xilinx Spartan-6 FPGA Industrial Imaging Targeted Design Platform to accelerate development of high-performance video processing applications for low-cost, low-power industrial imaging systems. Industrial equipment OEMs can now rapidly build and evaluate reprogrammable imaging solutions with high-definition image resolutions, specialized image sensor interfaces, and intelligent video and advanced image processing algorithms.

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National Instruments Awards $1 Million to Advance Medical Device Development Since 2008

National Instruments today announced that it has awarded $1 million USD in software, support and training to medical device manufacturers through its medical device grant program. Since the program began in 2008, 59 grant recipients from around the world have used technology such as the NI LabVIEW graphical system design platform to reduce the cost and complexity of medical device development and quickly create functional prototypes that help prove their inventions. National Instruments also announced that it is continuing the grant program in 2010 and accepting applications until June 30.

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Package Innovation from STMicroelectronics Unlocks Performance Boost for High-Frequency Power Devices

Package Innovation from STMicroelectronics Unlocks Performance Boost for High-Frequency Power Devices

STMicroelectronics has announced innovative plastic air-cavity packages that enable high-power transistors for Radio-Frequency (RF) applications such as transceivers, broadcast equipment and MRI scanners to deliver performance and cost advantages over alternative devices in ceramic packages.

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Baolab creates nanoscale MEMS inside the CMOS wafer

Baolab Microsystems has announced a new technology to construct nanoscale MEMS (Micro Electro Mechanical Systems) within the structure of the actual CMOS wafer itself using standard, high volume CMOS lines, which is much easier and quicker with fewer process steps than existing MEMS fabrication techniques that build the MEMS on the surface of the wafer. This significantly reduces the costs of a MEMS by up to two thirds and even more if several different MEMS are created together on the same chip.

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Analog Devices' Data Conversion Technology Enables MRI Systems To Provide Exceptional Image Quality

Analog Devices' Data Conversion Technology Enables MRI Systems To Provide Exceptional Image Quality

MRI (magnetic resonance imaging) scans provide extraordinarily clear images of the human body and are commonly used to diagnose a wide range of illnesses and injuries, such as Alzheimer's disease, cancerous tumors, and torn ligaments. Analog Devices, Inc. (NYSE: ADI), the leading provider of data conversion technology and longtime collaborator with the medical imaging industry, today introduced a breakthrough in data conversion that gives clinicians and radiologists the superior image clarity they need to see smaller anatomical structures and abnormalities, such as breast cancer cells, than ever before.

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Beihang University of Beijing, China Successfully Integrates Minicom’s Remote Management Solution

Minicom Advanced Systems, a leading developer of remote access and KVM solutions for the data center, announced today that Beihang University (BUAA), a university of engineering science and technology in Beijing, China, has successfully integrated Minicom's remote management solution, to their tremendous satisfaction.

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Ismosys appointed to deliver SAM voice processing message in EMEA

Ismosys, a Spectrum Electronics Group operation, has signed a pan-European deal with Fortemedia Inc, the world leader in small array microphone (SAM ) voice processing technology: The combination of Fortemedia's 3rd generation SAM technology and the company's DSP-based voice processor ICs is delivering industry-leading echo cancellation and noise suppression solutions that enable natural flowing, full-duplex hands-free communication to global manufactures of advanced technology mobile communication devices.

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PREMO highlight at CeBIT 2010 its latest innovations for the ICT sector

PREMO highlight at CeBIT 2010 its latest innovations for the ICT sector

PREMO has successfully participated at the CeBIT 2010, the largest technology exhibition in the field of innovation on information technology and telecommunications, which took place in Hannover (Germany) on 2-6 March and has received Spain as Guest Country.

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Aston Martin and Rolls Royce Address Challenges in Auto and Aero Industries for Nano-enhanced Materials

The Nanotechnology Knowledge Transfer Network (NanoKTN), one of the UK's primary knowledge-based networks for Micro and Nanotechnologies, has announced the date of its next HiPerNano Conference, in partnership with Cranfield University, dedicated to raising awareness and promoting developments in nano-materials for the high performance engineering industry. The conference, exhibition, and poster presentations will showcase new scientific and commercial developments alongside far-sighting by industry professionals on challenges yet to be addressed.

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National Instruments UK & Ireland Launches Grant Programme for Small-to-Medium Enterprises

National Instruments UK & Ireland (Nasdaq: NATI) today announced a grant programme to support micro, small and medium-sized enterprises in embedded development. Starting in 2009, National Instruments UK and Ireland began offering very low cost training and certification to unemployed scientists and engineers to help them develop skills to aid in finding employment.

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NMI membership hits 200 with Areva T&D

NMI membership hits 200 with Areva T&D

The membership of the National Microelectronics Institute (NMI), the trade association representing the semiconductor industry in the UK and Ireland, has reached 200. The Institute, which has seen its membership increase by 100% over the last 3 years, has welcomed global energy transmission and distribution company AREVA T&D as its 200th member.

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TRaC achieves IECEx qualification

Manufacturers of equipment designed for operation in hazardous areas and explosive atmospheres can simplify the process of marketing their products internationally, using the services of test house TRaC, which is now qualified under the IECEx System.

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Peregrine Semiconductor Expands European Operations

Peregrine Semiconductor Expands European Operations

Peregrine Semiconductor announced the expansion of its European design and manufacturing operations and the opening of a new facility located in Aix-en-Provence, France. Peregrine Semiconductor Europe (PSE) operations include RF integrated circuit (RFIC) design and engineering at its design center in Aix-en-Provence, France; IC wafer manufacturing from wafer foundry Sapphicon in Australia and UMC in Taiwan; assembly and packaging from Hybritech Composants Microelectroniques (HCM) France; and back-end testing at partner Rood Microtec in Germany. PSE activities will focus on developing new RFIC products of European content to better support specific European design requirements, as well as providing design services for Peregrine's next-generation UltraCMOS™ RFIC portfolio sold worldwide.

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Maxwell Technologies Delivers One-Millionth Large Cell Ultracapacitor

Maxwell Technologies announced today that it reached a significant milestone in December with the delivery of its one-millionth large cell BOOSTCAP ultracapacitor.

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Voith Turbo Selects Maxwell Technologies' Ultracapacitor Modules for Low-Emission, Fuel-Efficient, Hybrid Transit Bus Drive Systems

Maxwell Technologies announced today that Voith Turbo, a leading producer of heavy vehicle drive systems, has selected Maxwell's 125-volt BOOSTCAP ultracapacitor modules for braking energy recuperation and torque assist in low-emission, fuel-efficient, hybrid-electric transit bus drive systems.

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ZF is Entering the Market for Telematics Solutions in a Strategic Alliance with Intel

ZF uses its expertise in the networking of components in the driveline to embark on a new business model: Under a strategic alliance with Intel, ZF will create a hardware and software platform which is available for telematics applications. The platform called openmatics can be used for example in citybusses from all manufacturers.

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ZF enters joint venture with Hero Motors Ltd. of India

ZF and Hero Motors Ltd. today signed a contract establishing the joint-venture enterprise ZF Hero Chassis Systems, securing access for ZF to India's booming market for small cars. The automotive industry supplier is acquiring fifty percent of Hero Chassis Systems including two assembly plants in Halol, around 300 miles north of Mumbai, and in Talegaon, near Pune. Initially, some 100 employees will be engaged in the assembly of car axles for General Motors.

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Lanner’s Fanless Digital Signage Platform with Dual Display Support and S-Video Connection

Lanner’s Fanless Digital Signage Platform with Dual Display Support and S-Video Connection

Lanner has released the LEC-7030, an interactive platform aimed at the narrowcasting segment of the digital signage market. New features of the LEC-7030 include both S-Video and RCA Audio inputs. Additional features include an onboard 1.6GHz Intel Atom with VGA and DVI-D video outs.

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Soitec announces volume production of new generation of high-resistivity SOI substrates for cellular phone and Wi-Fi markets

The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today volume production of its new generation of state-of-the-art high-resistivity (HR) silicon-on-insulator (SOI) substrates to serve the growing cellular phone and Wi-Fi markets. Soitec recently completed qualification at major customers for volume production in response to their rapidly growing demand. Soitec fined-tuned its HR-SOI process to stabilize the base wafer resistivity in order to meet all cellular electrical specifications.

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Concentrix Solar enters the US market with megawatt CPV deployment at a Chevron facility

Concentrix Solar, a leading supplier of Concentrator Photovoltaic (CPV) systems and a new division of the Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates, announced today that it has signed a contract with Chevron Technology Ventures for the deployment of a one megawatt (MW) CPV power plant to be installed at a Chevron Mining facility in Questa, New Mexico, USA. With this announcement, Concentrix Solar confirms full commercial readiness for worldwide deployment, and is paving the way to utility-scale CPV projects.

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MindTree Unveils Bluetooth Low Energy Stack on TI’s WiLink 7.0 Solution

MindTree Ltd., a global IT solutions company and a leading provider of Bluetooth Intellectual Property (IP) solutions, today announced the launch of its EtherMind Bluetooth low energy stack on the quad-radio, single-chip WiLink? 7.0 solution from Texas Instruments Incorporated (TI).

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MindTree Steps up Efforts to Leverage Middle East IT Services Market

MindTree Ltd., a global IT solutions company, has announced that it is stepping up its efforts to leverage the growth of the Middle East IT services market, which is expected to hit USD 3.5 billion by 2011, according to recent reports from the Economist Intelligence Unit (EIU). Identified by the Company as one of its fastest growing regions, the Middle East forms part of MindTree's 'Rest of the World' (ROW) market along with Japan, Australia and Singapore, which collectively contributed 10.8 per cent to its total earnings in Q3 FY '09-'10. MindTree sees the Middle East region to play a key role in its plan to become a USD 1 billion organization.

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NanoKTN and Institute of Nanotechnology Launch International NanoMicroClub to Encourage Global Investment in UK SMEs

The Nanotechnology Knowledge Transfer Network (NanoKTN), one of the UK's primary knowledge-based networks for Micro and Nanotechnologies, and the Institute of Nanotechnology (IoN), a professional membership organisation for the nanotechnology industry, has announced its collaboration that with the support of Technology Strategy Board funding, will encourage and support global business development for UK SMEs.

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TPACK Partners with Cypress on Reference Design For Ethernet Switches and Traffic Managers

Cypress Semiconductor and TPACK, an industry-leading provider of ICs that provide core data transport and switching functions, today announced a reference design for ultrafast Ethernet switches and queue management applications. The new Springbank reference design combines TPACK's TPX4004 high-capacity integrated packet processor and traffic manager with Cypress's CY7C15632KV18 72-Mbit Quad Data Rate™II+ (QDR™II+) SRAMs, offering the fastest available speeds with roadmaps for simple upgrades. The TPACK reference design also provides an easy interface to various FPGAs and is backed by robust application support.

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Intel and RealVNC collaborate to provide innovative, built-in remote control

Intel and RealVNC have collaborated to embed VNC remote control technology in the all new 2010 Intel® Core™ vPro™ processor familyto provide IT professionals with a built-in, fully graphical remote control capability to facilitate problem diagnosis and resolution.

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