Exhibitions and Conferences
Micron VP Will Discuss Flash as the Key to the Connected World at Flash Memory Summit 2012
Micron announces that Glen Hawk, vice president of NAND solutions, will keynote at Flash Memory Summit on Tuesday, August 21, at the Santa Clara Convention Center in Santa Clara, California. With 28 years of semiconductor industry experience, all focused on nonvolatile memory, Hawk will explain how flash-based architectures are enabling the connected world, providing ubiquitous, fast access to information.
Assembléon will showcase quality and flexibility at NEPCON
Assembléon has today announced that its booth at NEPCON South China (Shenzhen, booth 1G50, August 28 – 30) will be dedicated to the perfect combination of quality and flexibility, showing the iFlex and AX-501 Hybrid.
$1,000 Attendance Awards for Students Assisting at APEC 2013
The joint sponsors of the Applied Power Electronics Conference have announced the continuation of the popular $1,000 Student Attendance Awards to cover part of the travel and conference expenses for up to 30 students to attend APEC 2013 in Long Beach, California, March 17-21, 2013.
Technology Analyst at IDTechEx will discuss Printed Thin Film Transistors at Printed Electronics Asia 2012
IDTechEx have today announced that Technology Analyst, Khasha Ghaffarzadeh will discuss Printed Thin Film Transistors at a session dedicated to Printed Logic in their Printed Electronics Asia event, www.PrintedElectronicsAsia.com, which takes place October 2-3, 2012 in Tokyo.
Synopsys to Host Seventh Annual International Microelectronics Olympiad of Armenia with IEEE TTTC
Synopsys has today revealed that the Seventh Annual International Microelectronics Olympiad of Armenia will be held on October 4, 2012 in Yerevan, Armenia. For the first time, the event will be held in cooperation with the Institute of Electrical and Electronics Engineers Test Technology Technical Council. IEEE's participation highlights the contest's growing international reputation.
AWR concludes successful ADF Asian tour
AWR has today announced that it has concluded a successful Asian tour of the AWR Design Forum with record registrations and hundreds in attendance. Kicking off on July 6 in Tokyo, the tour moved to Korea on July 10 and wrapped up in Taiwan on July 12. Excellent papers were presented by AWR customers, partners, and academics.
Binder UK to showcase Sensor Connectors at Sensing Technology 2012
Binder UK has today announced that it will be showing a wide range of circular connectors on Stand D11 at Sensing Technology 2012 to be held at the NEC, Birmingham on 25th and 26th September. Products will include the extensive range of M5, M8 and M12 sensor connectors used widely in the sensor, instrumentation, automation, medical and industrial equipment markets, along with new product developments such as high current versions of M12 connectors that are rated at 12A.
Full-Band Capture Remote Diagnostic Tools Reduce Operator Costs with New Levels of Customer Service for Cable Operators
Broadcom has revealed a full suite of remote monitoring and diagnostic capabilities based on its Full-Band Capture digital tuning technology. By capturing the entire 1GHz cable spectrum, Broadcom's remote diagnostics provide access to real-time data and visibility into a user's home coax network for quick problem diagnosis and better overall customer service.
AIM to address Lead-Free Alloy Development at SMTA China South Conference
AIM has today revealed that Luke Chen will present at the upcoming SMTA China South Conference scheduled to take place August 28-29, 2012 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.
Math-Powered Leak Test Optimization Demo's for the Electronics Industry announced by USON
Manufacturers of outdoor electronic control panels and other electronics industry components or products that need to be leak tested who are seeking continuous quality improvements and/or faster leak test cycle times while maintaining Gage R&R can now schedule customized video conference demonstrations of the of mathematical functions built into USON's recently unveiled Optima vT Leak and Flow Tester.
HARTING to Showcase Connectivity Solutions for AV Multimedia Applications at PLASA 2012
HARTING have today announced some of the products and solutions that they will exhibit at PLASA 2012,in London 9-12 September 2012. A key element of the HARTING product family is the Han-Modular building-block concept, which allows connector inserts for audio, video, data and power signals to be combined in three different housing variants - Han B, Han-Eco and Han-Yellock - offering a choice of characteristics in terms of weight, resistance to damage, potential for cable trunking drag-through and cost.
Wind River will Exhibit Secure Android Solution at AUVSI’s Unmanned Systems North America
Wind Riverhas today announced that it will exhibit at AUVSI's Unmanned Systems North America 2012, August 7–9 in Las Vegas, NV. Wind River will showcase the latest embedded software capabilities supporting unmanned systems.
CS Europe goes international
Since its launch in 2010 CS Europe has grown and become a truly international event for the compound semiconductor industry with delegates coming from all 4 corners of the world to gain a comprehensive overview of the entire compound semiconductor industry.
LabVIEW Developer Days 2012 on Tour in 75 European Cities
National Instruments has opened registration for engineers and scientists to join the European Tour of LabVIEW Developer Days, taking place in 75 cities around the continent. The 6 month tour begins in September 2012, with 10 locations in the UK & Ireland.
'Advances in Cloud Computing' Conference Series Launched by CSI
CSI kicked off its first edition of Advances in Cloud Computing Conference today in Bangalore at Lalit Ashok. The launch of ACC series not only brought together professionals from around the world but also provided an international platform for various researchers and practitioners to share knowledge on Cloud Computing.
Who Solved Your Last Fastening And Assembly Problem? ask FAST & IASE
Who solved your last fastening and assembly problem? It's a valid question – and the chances are the answer is one of the top companies exhibiting at the FAST & IASE Exhibition on October 18th. To be amongst the first to see, discuss and evaluate everything new (methods, products, practices and suppliers!) in engineering and industrial fastening, adhesives and assembly, simply go to the exhibition websites and pre-register now!
Kyzen’s CTO to discuss “Cleaning Challenges in an HDI World – Phase 3” at IPC Midwest
Kyzen has today revealed that Dr. Mike Bixenman will present a paper titled "Cleaning Challenges in an HDI World – Phase 3" at the upcoming IPC Midwest Exhibition & Conference in Schaumburg, IL. Co-authored with Mark Northrup of IEC Electronics and Joe Russeau of Precision Analytical Laboratory, the presentation will take place during Session S01, titled "Reliability Challenges for Bottom Termination Components" on Wednesday, August 22, 2012 from 9-11:45 a.m.
Advanced Packaging Cleaning Chemistry at IPC Midwest
Kyzen has announced that it will be showcasing its AQUANOX A4638 Advanced Packaging Cleaning Chemistry in Booth #108 at the upcoming IPC Midwest Exhibition & Conference, scheduled to take place August 22-23, 2012 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL.
IPC Midwest Soldering Competition sponsored by Colbar
Balver Zinn has today announced that Cobar Solder will be sponsoring and participating in the second annual IPC Midwest Soldering competition held in conjunction with the IPC Midwest Exhibition & Conference in Schaumburg, IL. The company will exhibit its lead-free SN100C-XF3+ solder paste and wire as well as high-performance fluxes and other related soldering materials in Booth #809.
“Reflow Soldering Equals Wave Soldering Plus One” from Cobar expert at IPC Midwest
Balver Zinn have today declared that Cobar's Gerjan Diepstraten will present a paper titled "Reflow Soldering Equals Wave Soldering Plus One" at the upcoming IPC Midwest Exhibition & Conference in Schaumburg, IL. The presentation will be held during Session S05 titled "Assembly Process Soldering Materials," which will take place Thursday, August 23, 2012 from 10:15 - 11:45 a.m.
Kyzen's CTO to present “Application Processing for Solder Related Materials” at IPC Midwest
Kyzen has revealed that Dr. Mike Bixenman will present a paper titled "Dual Solvent Electronic Assembly Cleaning" at the upcoming IPC Midwest Exhibition & Conferencel in Schaumburg, IL. Co-authored with Joe McChesney of CSD Automation, the presentation will take place during Session S04, titled "Application Processing for Solder Related Materials" on Thursday, August 23, 2012.
Broadcom will be Presenting at these Upcoming Conferences
Broadcom have today announced that they will be presenting at the following third quarter 2012 conferences. The company's presentations, which may include information regarding current and future products and technologies, end market trends and the company's current financial prospects, will be available to the public via audio webcast.
Asiamold expects an Exhibitor Participation Increase of 25% for 2012
Asiamold, the Guangzhou International Mould & Die Exhibition, is expected to open this year with an even higher turnout than last year's show. The 2012 fair, to be held from 19 – 21 September at the Poly World Trade Centre Expo, Guangzhou, China, is expecting 400 exhibitors, a 25% increase from the 2011 show.
Agilent to Demonstrate Test Solutions at International Symposium on Electromagnetic Compatibility
Agilent will demonstrate its test solutions at the IEEE International Symposium on Electromagnetic Compatibility (Booth 917/919) in Pittsburgh, Aug. 5-10. Electromagnetic compatibility has become a critical requirement for new electrical and electronic products. Government regulations around the world require full compliance testing and in-field monitoring. Agilent's extensive electromagnetic interference test offering includes test capabilities in design, prototyping, manufacturing and deployment.
Laird Technologies to Attend 2012 IEEE International Symposium on Electromagnetic Capability
Laird Technologies today announced it will be attending the 2012 IEEE International Symposium on Electromagnetic Capability. The event will take place at the David L. Lawrence Convention Center in Pittsburgh, Pennsylvania, August 5-10, 2012. Laird Technologies will be located at booth #822.
New Material Breakthroughs to be presented at Asia event IDTechEx, Cambridge, UK
We are witnessing a rapid multiplication of available conductive materials for printed and large area electronics on the market. The different materials distinguish themselves by their conductivity, particle size, curing conditions, availability and cost. New material breakthroughs for the printed and large area electronics industry will be one of the main topics at IDTechEx's Printed Electronics Asia event, which will take place on October 2-3 in Tokyo, Japan.
Preview for the press for Pickering Interfaces, The PXI-Show- New Event
The PXI Show is a brand new one-day event focusing exclusively on the world's most popular modular Test & Measurement platform, and offers test managers and engineers a unique opportunity to experience the huge range of PXI products currently available from the industry's leading vendors.
PLX to Present, Exhibit Advanced PCI Express Technologies at PCI-SIG Developers Conference
PLX has declared today that the company will deliver a visionary presentation and host a live demonstration of its unique ExpressLane PCI Express Gen3 products at the upcoming 20th Anniversary PCI-SIG Developers Conference, held July 11-12, 2012, at the Santa Clara Convention Center, in Santa Clara, California.
Pickering Electronics at Semicon West USA, San Francisco, July 10th to 12th, 2012, Booth # 6080, North Hall
Pickering Electronics have today announced their product highlights for the Semicon West Exhibition in San Francisco, USA, July 10th to 12th 2012, in Booth # 6080, North Hall. Pickering Electronics will highlight the following products amongst others at Semicon West:
Introducing the NI UK & Ireland 2012 Summer of LabVIEW Webcast Series
Join NI throughout the month of August to explore the world of NI LabVIEW and the graphical system design approach, through the Summer of LabVIEW webcasts. Beginning with a Keynote presentation from the "Father of LabVIEW" Jeff Kodosky, the series of 16 interactive webcasts will highlight how LabVIEW speeds the development of any measurement or control system.
Preview for Semicon West, July 10th -12th, North Hall, Booth 6080 for Pickering Interfaces
Pickering Interfaces has continued to regularly release new products in both the LXI and the PXI platforms tackling the problems faced by our users in the Semiconductor industry. For the Semicon West in San Francisco this year we are exhibiting amongst others the following solutions/products on booth 6080 North Hall.
Future of Wireless International Conference 2012 highlights need for change
Over 350 senior mobile industry executives, academics and advisors from 25 countries converged on Cambridge last week to focus on the 'Reshaping of the Mobile Industry', driven by the increasing influence of new 'Over The Top' web and digital media brands such as Facebook, Google, Skype and Twitter.
Multitest VP Bernhard Lorenz to Present at Test Vision 2020 Conference
VP Bernhard Lorenz will present at the upcoming Test Vision 2020 Conference, scheduled to take place July 11-12, 2012 at the San Francisco Marriott Marquis during SEMICON West 2012. The presentation titled "Enabling Highly Parallel Test of SOCs, Sensors and 3D Packages," will be held on Thursday, July 12, 2012 from 1:30-2 p.m.
FAST & IASE Exhibition focus on driving the cost out of fasteners and assembly
After a very successful event in April at the Harrogate Pavilions, the next FAST & IASE Exhibitions take place at the hugely popular and centrally located National Motorcycle Museum on 18th October this year. Entry to FAST & IASE exhibitions is free. One registration provides a badge valid for both events and pre-registration can be done at www.fastenerexhibition.com.
First sponsors announced for embedded platforms conference
Farnell, Infineon, Toshiba, TQ Systems and Texas Instruments are the first companies to sponsor the new embedded platforms conference, which is being held in conjunction with electronica for the first time on November 14 and 15. The International Trade Fair for Electronic Components, Systems and Applications takes place in Munich from November 13 – 16.
AWR Design Forum (ADF) 2012 Agendas Announced and Registration Opens
AWR Corporation announces that agendas for the AWR Design Forums(ADF) 2012 for Japan, Korea and Taiwan have been finalized and posted online, and registration will be open through the day preceding each event.
Gore To Demonstrate How Its Cartridge Filters Improve Process Performance While Reducing Cost Of Filtration At SEMICON West 2012
W. L. Gore & Associates, Inc. will be featuring a live demonstration of its polytetrafluoroethylene membrane filter technology at SEMICON West 2012, July 10-12, Moscone Center, San Francisco. Visitors to Booth 1331 will clearly see how GORE Filters for liquid filtration applications in microelectronics processing – including filters for ultrapure water and for high purity chemical processors – achieve higher flow in comparison to other microfiltration technologies.
Electronics Manufacturing Giants to Converge on Shenzhen: NEPCON South China 2012 Successfully Attracts Key Exhibitors
NEPCON South China 2012 will take place between August 28 and August 30 at the Shenzhen Convention & Exhibition Center. As the largest and longest-running SMT exchange platform in South China, the annual event is a popular industry highlight. To date, several electronics manufacturers have accepted invitations to exhibit at the event, many of them giants of global electronics manufacturing.
Rehm hails successful SNEC 2012 PV Power Expo
Rehm Thermal Systems reports that last month's SNEC 2012 in Shanghai was highly successful in spite of recent softness in the PV market. Rehm's ongoing initiatives reflect a strong determination to expand upon their past successes and achieve leadership recognition for their PV technology achievements.
CEA-Leti Workshop on Innovative Memory Technologies to Include Presentations by Samsung, Infineon, Micron, Macronix, STMicroelectronics
CEA-Leti organize its fourth workshop on innovative memory technologies at MINATEC on Thursday, June 21th, 2012.
