Exhibitions and Conferences
The Paragon Electronics Group exhibits at Southern Manufacturing
The Paragon Electronics Group will be exhibiting at the 2013 Southern Manufacturing & Electronics Exhibition. Visitors to the stand will be able to find out about the company's three core activities – component management and supply solutions, PCB assembly and electro-mechanical services.
Mindspeed to Showcase the Industry's First ARM Cortex A9-based Communications Processor with Integrated DPI at 2013 CES
Mindspeed Technologies today announced that it has fully integrated DPI technology from Lionic Corporation in its latest Comcerto 2000 communication processor family. This DPI technology enables advanced and versatile capabilities including real-time anti-virus scanning, application-dependent QoS, advanced parental controls, keyword filtering and URL filtering.
ESSEMTEC to Exhibit its Scorpion in America for the First Time at the IPC APEX Expo
Essemtec announces that it will showcase flexible Swiss-made solutions in Booth #3233 at the upcoming IPC APEX Expo, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California.
ams to showcase sensor technology innovations at International Consumer Electronics Show 2013
ams will demonstrate product innovations and technology capabilities at the International Consumer Electronics Show 2013 that will illustrate how sensors are transforming today's consumer products. CES is taking place this week in Las Vegas, Nevada.
BTU International Touts Continuous Processing Advantages
BTU International will highlight solutions to enhance customer value in its Booth #727 at the upcoming IPC APEX Expo, scheduled to take place February 19-21, 2013, at the San Diego Convention Center in California.
Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West
Finetech will showcase the sub-micron placement accuracy FINEPLACER Lambda bonder in Booth #4626 at the upcoming SPIE Photonics West exhibition, scheduled for February 5-7, 2013 at the Moscone Center in San Francisco, CA.
Sercos Sets Record For Visitors And Exhibitors At SPS IPC Drives
Sercos announce that the SPS IPC Drives exhibition in Nuremberg was an outstanding success for the organization. More than 20 companies from a wide range of areas presented exhibits and product demonstrations at the user organization's joint booth, which attracted 40% more visitors than in the previous year. This growth also reflects the numbers in the IMS research study The world market for Industrial Ethernet components from April 2012, in which sercos III is forecasted to achieve the second largest growth rate for newly installed Ethernet nodes in industrial use by 2015.
InvenSense At CES! Motion Changes Everything
InvenSense is planning to present a host of Motion Interface briefings and solution demonstrations at CES 2013. Key demonstrations on the show floor will include:
NEXCOM Returns to ISE with In-demand Digital Signage Technologies
NEXCOM will present a wide range of digital signage players at 10th edition of ISE, the major European Exhibition for the professional AV industry which takes place from January 29 to 31 in Amsterdam RAI, Netherlands. Inspiring digital signage players making their debut on the NEXCOM booth include innovative OPS signage players such as NDiS M532 and NDiS M422, a new multi-display signage player called NDiS B862 and the PDSB 102 ARM-based signage appliance.
TI to demonstrate its innovative 3D time-of-flight image sensor chipset with SoftKinetic at CES 2013
Texas Instruments today announced it is collaborating with SoftKinetic to grow adoption of gesture control in televisions, personal computers, and a wide variety of other consumer and industrial devices. At the 2013 Consumer Electronics Show (CES), TI will demonstrate its new 3D time-of-flight (ToF) image sensor chipset, which integrates SoftKinetic's DepthSense pixel technology and runs SoftKinetic's iisu middleware for finger, hand and full-body tracking.
Amphenol Launch New Hermetic Connector at Southern Manufacturing 2013
Amphenol announce that, for the first time in the UK, their latest Heavy mate F Series, a modular-based system which is intermateable with all other brands of rectangular modular-format connectors, will be exhibited.
Meet tomorrow now! Innovative products for future technologies
Rutronik Elektronische Bauelemente is exhibiting at embedded world (stand 1-318) under the motto 'Meet tomorrow now!'. The focus is on the technological and logistical developments of tomorrow. Visitors to the trade fair can call up applications on touch-screens and view suitable components with their technical data.
Lian Li to Unveil New Product Line at CES 2013
Lian-Li Industrial Co. Ltd, will be at the world's largest consumer technology trade show – CES 2013 in Las Vegas, Nevada, USA from January 8 to January 11, 2013. Lian Li invites all interested parties to visit their booth in the Las Vegas Convention Center, South Hall 2 #25405 and get a first glimpse of the latest generation of brushed aluminium chassis.
ADATA to Reveal a Raft of New Products at CES
ADATA Technology, will be showcasing and providing live demonstrations of its new line of products at the 2013 International Consumer Electronic Show from January 8 to January 11 in the Piazza Suite at the Venetian Resort. ADATA invites all interested parties to get hands-on experience with its latest product offerings, including SSDs for consumer and enterprise solutions as well as the company's latest applications in DRAM, Flash storage, and wireless-enabled devices.
Toshiba to Showcase Latest Embedded Motor Control Devices and Tools Alongside Micros for Smart Metering
At Embedded World 2013 Toshiba Electronics Europe will launch new devices and development tools designed to simplify and speed embedded motor control implementations in industrial control and home appliance applications. Visitors will also be able to see microcontrollers dedicated to reducing the component count of domestic, commercial and industrial smart metering applications.
IQD launches new ultra high stability OCXO at Embedded World 2013
IQD's new IQOV-70 series OCXO which is launching at Embedded World 2013 is designed for use in next generation multimode base station platforms. Operating at a frequency of 10MHz, the new model achieves a frequency stability of ±3ppb (parts per billion) over the operating temperature range of -10 to +70 degrees C.
Lattice Semiconductor will Feature Real-Time 3D Video Converter at CES 2013
Lattice Semiconductor Corporation today announced it will demonstrate 3D Impact Media's RealityBox, a low density LatticeECP3 FPGA-based real-time 3D video converter, in its private "Mobile Innovation" meeting suite at the Consumer Electronics Show January 8-11 in Las Vegas. Lattice suite 2980 will be located in the East Tower, Las Vegas Hotel.
HARTING to showcase new interconnection solutions at Southern Electronics 2013
At Southern Electronics 2013, the HARTING Technology Group will be featuring its broad range of electrical and electronics interconnection solutions, including a number of innovative new products. The HARTING Technology Group's electronics assembly operation – HARTING Integrated Solutions (HIS) - will also be demonstrating its backplane and sub-assembly capabilities.
Cadence Showcase Prototyping Innovation and Early Software Development at embedded world 2013
Cadence Design Systems have today announced its participation at embedded world 2013 to demonstrate the company's latest innovations of its Cadence System Development Suite. Visitors to Cadence's booth will have the opportunity to learn about the latest enhancements to the Cadence System Development Suite presented at this year's annual Cadence user conference CDNLive EMEA in Munich, Germany.
Swissbit present Storage solutions for all Industrial Applications at embedded world 2013
Swissbit AG will be presenting its industrial DRAM and flash storage solutions in all common technologies and formats at the embedded world fair (hall 1, stand 524). Highlight at the stand will be its brand new X-500 Series Industrial SATA II SSD with up to 512 GB. The 2.5"-storage solution combines a data rate of up to 260MB/sec on SATA II and an impressive 15.000 IOPS with 4k random accesses and special features such as TRIM, the ATA security protocol, a temperature sensor and the in-field update.
Imec presents an ultra-thin hybrid floating gate cell at IEDM2012
Imec announces that it has developed an ultra-thin hybrid floating gate cell with demonstrated functionality. The results, which are presented at this week's 2012 IEEE International Electron Devices Meeting in San Francisco, USA, December 10-12, 2012, are an important step for further scaling of NAND Flash technology towards the 10nm half pitch node and beyond.
SMART Group to Host “100 Years of X-ray Advancement” Webinar
SMART Group hjas today revealed that it will present the webinar "100 Years of X-ray Advancement" on Tuesday, 29 January, 2013, at 2:30 p.m. (GMT). This SMART e-webinar will be presented by Dr. David Bernard and Keith Bryant of the SMART Technical Committee. The webinar will discuss numerous advances in terms of X-ray tube, software and X-ray detector technology that have been increasingly applied into helping with the manufacturing of electronic components and assemblies, as well as in their failure analysis.
VOICE 2013 User’s Conference for SoC & Memory Semiconductor Devices & Handler Test Technologies
VOICE 2013 is an international conference focusing on innovative test solutions for system-on-chip and memory semiconductor devices and handler solutions. The 2013 conference will include technical presentations, new product kiosks, interactive discussion sessions for users of the T2000, V93000 and memory test platforms and test cell solutions, offering extensive networking and learning opportunities for all attendees. A new addition to the program will be focused on Advantest's handler solutions.
Supermicro Hyper-Speed Servers Accelerate Low-Latency Applications with up to 30% Performance Gains
Super Micro Computer debuts a new line of ultra high performance "Hyper-Speed" servers this week at High Frequency Trading World, New York. These new 2U and 4U/Tower platforms deliver unparalleled performance for HFT applications by maximizing processing power and precisely tuning hardware and firmware to attain up to 30% lower latency over competitive solutions while still maintaining high reliability as a primary design focus.
PSoC World Virtual Conference Keynote Speakers Include Cypress President and CEO
Cypress Semiconductor have today announced the keynote speeches that will be presented at the upcoming PSoC World international virtual embedded design conference on December 12 and 13. The speakers at the event include:
Embedded Virtualization and Security for Automation
At the SPS IPC Drives 2012 show from November 27 to 29 in Nuremberg, Innominate Security Technologies and TenAsys Corporation are presenting their joint new HyperSecured IPC solution to OEMs for the first time.
APLEX to showcase IPC solutions at SPS IPC Drives 2012
APLEX have announced that it will demonstrate its complete portfolio of system & embedded solutions for IPCs users at SPS IPC Drives in Nuremberg from 27th to 29th, November - 2012, including the latest stainless steel product APC 38125, with cable-hidden design, APC-38137 panel PC with ATEX(EN-60079:11) and a new box PC ACS-2861 for railway application(EN50155).
PLX Details ExpressFabric at Server Summit Event
PLX Technology today announced Larry Chisvin, PLX vice president of strategic initiatives, will deliver a presentation on the role of a PCI Express (PCIe)-based ExpressFabric in uniting all hardware within the racks of data centers.
“By 2017, the ratio of thin wafers vs. total number of wafers will be 74% in 12’’eq.”
Yole Développement announces its webcast Thin Wafer Applications & Related Technologies. This online event takes place on Nov. 14 at 8.00 AM PST. The webcast is sponsored by EV Group and powered by I-Micronews.com. With more than 330 registrations today, this webcast is a promising event, where attendees and speakers will exchange about the latest market trends and technologies innovation.
Imec and Holst Centre to Present Research Breakthroughs at ISSCC
Imec and Holst Centre announced today that they will present nine papers at the 60th International Solid-State Circuits Conference, February 20-24, 2013 in San Francisco. ISSCC is the foremost global forum on advancements in solid-state circuits and systems on a chip.
Supermicro FatTwin Delivers 16% Net Power Savings to Transform the HPC Landscape
Super Micro Computer will showcase its expansive lineup of SuperServer, SuperStorage and networking solutions geared for high performance computing at Supercomputing 2012 in Salt Lake City, Utah, November 12-15.
Automation Innovations at SPS/IPC Drives from TE Connectivity
With 60 years of knowledge and industry experience, TE Connectivity is pleased to participate at the upcoming SPS/IPC Drives 2012 tradeshow in Nuremberg, Germany. At its booth # 332 in hall 10, TE will showcase the new Deutsch heavy-duty connector portfolio. With the acquisition of Deutsch earlier this year, TE has expanded its long-standing range of rectangular connectors to include circular connectors and industry-standard connector systems.
Texas Instruments showcases new industrial technologies at SPS
Texas Instruments is unveiling several new technology innovations for the industrial market on its booth in Hall 6, stand # 136 at SPS, 27-29 November, Nuremberg - the largest industrial show in the world. These will be featured in working demonstrations including:
Xilinx Demonstrates Zynq-7000 All Programmable SoCs for Industrial Automation Applications at SPS/IPC/DRIVES 2012
Xilinx today announced it will demonstrate advanced industrial automation applications and technology based on its Zynq-7000 All Programmable SoCs at SPS/IPC/DRIVES 2012 being held in Nuremberg, Germany, November 27-29, 2012.
SMART Group Continues smart-e-webinar Series with Environmental Regulation Webinar
SMART Group announces that it will present the webinar "Environmental Regulation Update – 2013 Very Busy Year of Change!" on Friday, November 30 at 2:30 p.m. (GMT). This smart-e-webinar will be presented by SMART Group's Technical Committee Vice-Chair Nigel Burtt and will bring attendees up to speed on the upcoming changes by focusing on the following topics:
STI Electronics Engineering Services Division to Exhibit at the Defense Manufacturing Conference
STI Electronics will exhibit in Booth #601 at the upcoming Defense Manufacturing Conference (DMC), scheduled to take place November 26-29, 2012 at the Marriott Orlando World Center in Orlando, FL. STI's Engineering Services division will feature its custom manufacturing for the defense sector, as well as counterfeit detection.
Kyzen Technology Experts to Present at SMTA Penang 2012
Kyzen announces that its Technical Sales Manager Mr. TC Loy and Senior Account Manager Ms. Lily d/o Sanarajoo will present papers at SMTA Penang Tabletop Exhibition, scheduled to take place November 16, 2012 at the Eastin Hotel Penang, Malaysia.
Essemtec’s Technology Day to Highlight Future Dispensing and MID Technologies
Dispensing and MID technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec's technology day focused on new developments and future challenges. The event was free of charge for all participants.
Lattice to Showcase FPGA-based Security & Surveillance Solutions at China Security Expo
Lattice Semiconductor today announced it will demonstrate several new FPGA-based camera designs at the China Security Expo in Beijing‚ China from December 3 through December 6. Several of the camera solutions that will be featured were developed with Lattice partner organizations.
IDT to Exhibit at Embedded Technology 2012
Integrated Device Technology have revealed today that it will be exhibiting industry-leading products from its growing product portfolio at Embedded Technology 2012, which will be held November 14-16 at the Pacifico Yokohama Convention Center in Yokohama, Japan. IDT will be located in booth E-11.
