Exhibitions and Conferences
Real Intent Presents Power-related Paper And Tutorial At ISQED 2013 Symposium
Real Intent participating with Intel and University of Texas Austin, presents a paper and a tutorial at this year's International Symposium on Quality Electronic Design. ISQED is the premier interdisciplinary and multidisciplinary Electronic Design conference that bridges the gap among electronic/semiconductor ecosystem members providing electronic design tools, integrated circuit technologies, and semiconductor technology, packaging, assembly & test to achieve design quality.
Cadence Rolls Out 2013 CDNLive User Conferences
Cadence Design Systems kicks off its worldwide series of user conferences, starting with CDNLive Silicon Valley, March 12 and 13 in Santa Clara. CDNLive conferences provide an excellent opportunity for Cadence customers to collaborate and dig deeper into the latest technologies and methodologies with Cadence experts.
PLX Technology to Present at Wedbush 2013 Transformational Technology Conference
PLX Technology today announced that David Raun, PLX president and CEO, and Arthur Whipple, PLX chief financial officer, will present at the Wedbush 2013 Transformational Technology Conference on March 6, 2013 at 9:00 AM (EST).
PLX Expert to Present on Simplifying PCI Express Debugging at PCI-SIG Developers Conference in Israel
PLX Technology today announced the company will deliver a technical presentation on simplifying PCIe debugging at the upcoming PCI-SIG Developers Conference (DevCon), in Tel Aviv, Israel. Derek Percival, PLX senior field applications engineer, will present "Debugging PCIe Links without an Analyzer" at the conference, March 12, 8:30-9:30 a.m. (UTC).
Teknosip Brings BPM Microsystems’ 3800 Programmer to Brazil for FIEE 2013
BPM Microsystems announces that Teknosip will display the 3800 automated production programmer in Booth # I78 at the 27th International Electrical, Energy and Automation Industry Fair (FIEE) scheduled to take place April 1-5, 2013 at the Anhembi Exhibition Hall in Brazil.
Join OK International at Enova Grand Ouest in France for a Demonstration of Metcal’s New MX-5200
OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth E22 at the Enova Grand Ouest exhibition, scheduled to take place March 27-28, 2013 in Rennes, France. The system offers the same increased productivity and process control as the MX-5000 Series, now with dual-simultaneous ports.
Acculogic to Exhibit Award-Winning Test Solutions at BiTS Workshop
Acculogic will exhibit in Booth K6 at the Burn-in & Test Strategies Workshop, scheduled to take place March 3-6, 2013 in Mesa, AZ. The company recently was awarded a 2013 NPI Award in the category of Test & Inspection – ICT for its Ultimate Accuracy Package for the Flying Scorpion.
sercos international presents innovations at the 2013 Hanover Fair
sercos international will show new safety concepts, products, and innovative technologies of exhibiting member companies during the Hanover Fair, April 8 - 12, 2013, in hall 9, booth D80. A conceptual approach that simplifies the integration of machinery in manufacturing will also be presented.
Lian Li To Unveil New Product Line At CeBIT 2013
Lian-Li have today announced that they will be at the world's largest consumer technology trade show – CeBIT 2013 in Hannover, Germany from March 5 to March 9, 2013. Lian Li invites all interested parties to visit their booth in the Exhibition Grounds, Hall 17, Stand M11 and get a first glimpse of the latest generation of brushed aluminium chassis.
Multitest to Exhibit Integrated Test Solutions at BiTS 2013
Multitest will exhibit in Booth #K4 at the Burn-in & Test Strategies Workshop (BiTS), scheduled to take place March 3-6, 2013 in Mesa, AZ. Multitest combines long-term experience in semiconductor test with the expertise of its specialists and state-of-the-art tools to apply industry-leading methods for optimizing test equipment and interfaces.
Computrol to Discuss High Mix, Low- to Mid-Volume Manufacturing Services at the Del Mar Show
Computrol is pleased to announce that it will exhibit in Booth #730-732 at the Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA.
Inovaxe to Exhibit Ultra Lean Total Material Handling and Storage Solutions
Inovaxe will be presenting its latest storage and handling systems in Booth #647 at Design & Manufacturing South, held in conjunction with the Medical Design & Manufacturing (MD&M) Florida exposition, scheduled to take place March 6-7, 2013 at the Orange County Convention Center in Orlando, FL.
AWR Sponsors and Exhibits a Wide Array of Technical Papers and Workshops at EDICON 2013
AWR is a gold sponsor at the Electronic Design Innovations Conference 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment, inclusive of Microwave Office/Analog Office circuit design software, Visual System Simulator system design software, as well as AXIEM 3D planar electromagnetic software and Analyst 3D finite element method EM software.
VPG Announces Micro-Measurements' UK Training Session Schedule for 2013
Vishay Precision Group today announced its Micro-Measurements brand's UK training session schedule for 2013. Held at VPG's Micro-Measurements facility in Basingstoke, Hampshire, these practical courses are designed to train customers in the proper use of strain measurement techniques.
NanoKTN Announce Current Developments In Nanotechnology Standards & Regulations Seminar
The Nanotechnology Knowledge Transfer Network is pleased to announce details of a joint event it is holding together with the Nanotechnology Industries Association. The event will focus, elaborate and debate recent developments and their subsequent implications on standards and regulations within the nanotechnology field whilst recognising that UK industry needs greater transparency. This event will also provide a unique opportunity for attendees to influence what standards and legislation will affect future business.
RoboCup world champion relies on the COMSys PC solutions of TQ
The LUHbots team of the Leibniz University of Hannover, together with TQ-Systems, will put the performance of their mobile robots - with COMSys embedded PC components from TQ - to the test at embedded world exhibition. Last year the LUHbots team won the RoboCup@Work World Championship in Mexico with their mobile robots. Now that the software optimisations had reached their limit, the team has decided to equip the mobile robots with the COMSys hardware kits of TQ.
DQ80251 at the CeBIT 2013 opening ceremony
The World's fastest 8051 CPU is about to grace the opening ceremony of CeBIT 2013 in Hannover, Germany. Polish IP Core, mastered by Digital Core Design, will be one of the four products chosen to be introduced personally to the German Chancellor Angela Merkel and Polish Prime Minister Donald Tusk, who will officially open CeBIT 2013 on March 5th.
ADATA To Present New Products At CEBIT 2013
ADATA Technology has today revealed that it will be displaying its latest innovations at CEBIT 2013, in conjunction with Littlebit Technology in Hall 14 Booth H52. Staged in Hannover, Germany, CEBIT is the world's largest IT trade fair, running this year from March 5th to the 9th.
Cross River Fiber's EVP and Chief Strategy Officer Michael Sevret Selected to Present at CRE's Greater New York Data Center Summit & Expo in NYC
Cross River Fiber announces today that Michael Sevret, the company's Executive Vice President and Chief Strategy Officer, has been selected to speak at CapRate Events, LLC's second annual Greater New York Data Center Summit & Expo. The event takes place on Wednesday, February 27, 2013 at the New York City Bar Association in Midtown Manhattan, New York.
Strong multi-talents: COMSys x86 solutions
TQ presents hardware kits, BoxPCs and PanelPC with the latest Intel Core processors at embedded world. The multi-touch all-in-one solutions with projected capacitive touch and multi-monitor support, based on the COMSys embedded PC solutions of TQ-Systems are best equipped for Windows 8 and Windows Embedded 8.
Stand out the Eminent Feature in the Crowd at ISE
NEXCOM's digital signage players were the remarkable success of the 2013 Integrated Systems Exhibition. Exciting new products such as the NDiS B532, NDiS B862 and NDiS M532 enthralled visitors with their sleek fanless design and brilliant performance.
Atmel Showcases Smart Connected Applications From The Lab To The Digital Living Room At EW 2013
Atmel Corporation has today announced that the company will be showcasing a variety of smart, connected applications from the lab environment to the digital living room at Embedded World 2013 held in Nuremberg, Germany, February 26-28, 2013.
APLEX Display Latest Systems & Embedded Technologies At Embedded World 2013
APLEX Technology announces that a whole new set of products that are designed to meet a wide variety of industrial application demands will be showcased at the Nuremberg, Germany Embedded World 2013. At this exhibition, APLEX will represent new products such as FPD industrial Panel PCs, new generation of BOX PCs as well as demonstrations of wide temperature scenario for embedded products at APLEX booth No. 416, Hall 2.
NEXCOM Invites You to RSA Conference 2013 Where The World Talks Security
NEXCOM is pleased to announce that we will be exhibiting at RSA Conference 2013 taking place February 25th thru March 1st at the Moscone Center – San Francisco. Join us along with other information security professionals from more than 40 countries around the world and from major industry verticals such as Computer Security, Computer Technology & Communications, Financial Services, Government and Technology at the RSA Conference 2013.
Cadence to Showcase Latest Verification Tools and Methodologies at DVCon 2013
Cadence Design Systems today announced its participation at DVCon 2013, the seminal conference for functional design and verification that takes place at the DoubleTree Hotel in San Jose, California on the 25-28 February 2013,
Fujitsu To Present ARM Cortex-M Solutions At Embedded World 2013
Fujitsu announces that it will be showcasing its FM Family ARM Cortex-M-based industrial solutions and FRAM at the Embedded World trade fair in Nuremberg, February 26 to February 28. Learn more about Fujitsu's range of 'right-sized' solutions at our partner booths, where our experts will be on hand to answer your questions and provide live demonstrations. You will find us at GLYN (hall 1, booth 306), MSC (hall 2, booth 219) and EBV Elektronik (hall 4, booth 535).
Audio Design Workshop LIVE
Some of the most experienced engineers in the audio industry will be sharing their knowledge and practical expertise in active loudspeaker design at a unique workshop being hosted by Prism Sound and Oxford Digital, in partnership with the Audio Engineering Society, LOUDSOFT and TTid.
DSM Computer at the embedded world: Flat embedded system of the third generation
DSM Computer presented at the embedded world in Hall 1, Booth 254 for the first time the NanoServer NN-QM67 embedded system that offers maximum power in the tightest space. The 58 mm flat industrial computer is based on Intel Core processors of the third generation and on the energy-saving Intel QM67 mobile chipset.
DSP looks to launch new range of products following investment from Season Group
DSP Design will be launching a new range of Freescale embedded processors at Embedded World 2013 which takes place in Nuremberg, Germany between February 26th and 28th. The new product range, which offers developers both flexibility and rapid development to ensure accelerated time to market, comes within months of DSP Design's acquisition by Season Group.
Xilinx Demonstrates 10 Leading Applications Showcasing ARM Processor-based Zynq-7000 All Programmable SoCs at Embedded World 2013
Xilinx today announced that it will demonstrate applications utilizing its Zynq-7000 All Programmable System-on-Chip (SoC) and its supporting ecosystem at Embedded World 2013 (Nuremberg, Germany, February 26-28, 2013 - Xilinx booth, H1-205). Multiple demonstrations will showcase advanced applications in automotive driver assistance systems, machine vision, biomedical sensing and industrial applications.
VIA Presents VIA Vantage Digital Signage Solutions at DSE 2013
VIA Technologies today announced it will be showcasing the full range of VIA Vantage digital signage solutions at Digital Signage Expo (DSE) 2013, in the Las Vegas Convention Center, booth #1248, this February 27-28.
PSMA Announces Power Management Industry Session At APEC 2013
The Power Sources Manufacturers Association Packaging Committee is sponsoring an Industry Session at APEC 2013, titled "Power Management," which will take place Wednesday, March 20, 2013, from 2:00 PM to 5:30 PM at the Long Beach Convention Center in Long Beach, California. Topics will include power management as it applies to cell phones, real-time thermal calculations for processors, "green" data centres and "green" factories, zero-net-energy buildings, the smart grid and, finally, its influence on regulations, incentives and social consciousness.
Fujitsu Smartphone Using Multiple Tensilica DPUs On Show At Mobile World Congress
Tensilica will be demonstrating NTT DOCOMO's ARROWS X F-02E smartphone at its booth #6D101 at the Mobile World Congress show in Barcelona, Spain, February 25-28, 2013. NTT DOCOMO's ARROWS X F-02E is the first smartphone to employ the ANT30 multi-mode modem from Access Network Technology. ANT is jointly owned by Fujitsu, NTT DOCOMO, NEC and Fujistu Semiconductor.
Essemtec To Highlight Paraquda SMD Pick-and-Place At AUTOMATICON
At the upcoming AUTOMATICON exhibition, taking place March 19 - 22 in Warsaw, Poland, Essemtec will highlight the Paraquda SMD pick-and-place, the first system ever to use ePlace operating software, as well as the table-top screen printer Fino. AUTOMATICON is the most important trade fair for automation, control, measurement and robotics in Poland. The mission of the event is to promote new technology and solutions for industry, through this our macro branch of industry that plays crucial role in economic growth.
SMT Hybrid Packaging 2013 With Interesting Emphasis
Once again SMT Hybrid Packaging acts as a platform providing comprehensive information on innovations, products and solutions in the field of System Integration in Micro Electronics. From 16 – 18 April 2013 visitors will find well-known companies such as ASYS, Assembleon, AAT Aston, Heraeus, KSG Leiterplatten, LPKF and Yamaha in Nuremberg, Germany. Moreover, numerous first time as well as small- and medium-sized exhibitors will be present on the show.
ADATA To Showcase Latest Industrial Memory And Storage Solutions At Embedded World 2013
ADATA has announced that it will participate in Embedded World 2013 Exhibition in Nuremburg, Germany. Embedded World is the world's biggest exhibition focusing on system integration and embedded technology. ADATA will display its line of complete memory solutions for industrial use, including industrial standard Flash modules, high-performance DRAM modules, industrial memory cards, full line of eMMC, eMCP, and SATA interface storage media.
IAR Systems Launches Embedded On Tour In Finland And Sweden
For embedded software designers in Finland and Sweden who would like to gain in-depth understanding of the current discussions in the embedded community, IAR Systems offers a half-day series of technical sessions to recapitulate news and presentations from Embedded World. The seminars take place on March 12, at Radisson Blu Seaside Hotel in Helsinki, Finland and on March 14 at Kista Entré in Stockholm, Sweden.
Fischer Connectors’ medical connectors and cable assembly solutions featured at MEDTEC
Fischer Connectors helps medical device manufacturers maintain rigorous quality objectives by providing high performing reliable push-pull connectors and cable assemblies for professionals around the world. Custom or off-the-shelf complete interconnect solutions enable medical experts to integrate the latest industry technologies for better precision and performance.
Plessey To Focus On Tele-Health At The International IC China Exhibition 2013
Plessey has today revealed that they will be exhibiting at the International IC China Exhibition in Shenzhen from 28 February to 2 March 2013. Plessey will be featuring solutions for the tele-health markets including the handheld imPulse and the wrist worn inCite incorporating the company's award winning EPIC sensor.
Accutronics Blazes A Trail At Embedded World
Accutronics is to showcase leading-edge battery products at the Embedded World 2013 Exhibition & Conference in Nuremberg, Germany on 26–28 February 2013 (Booth 2-515, Hall 2), including the recently launched Intelligent Power Vault lithium ion multi-battery power system for medical and industrial applications.