Exhibitions and Conferences
CUI Demonstrates New Digital Power System Interface at APEC 2013
CUI today announced that as part of its presence at the Applied Power Electronics Conference (APEC), the company will demonstrate a new graphical user interface for its digital power modules named Novum ACE.
Power Distribution Systems From FCI On Show At APEC 2013
FCI has developed a series of power distribution systems that provide exceptional performance with repeatable accuracy. Utilizing laminated bus bars and plates, FCI's power distribution systems are engineered for easy connectivity and designed to save space, lower costs and provide pluggable modularity to allow equipment expansion and changeovers.
Supermicro Powers the Cloud with NVIDIA GRID
Super Micro Computer is exhibiting its range of GPU optimized platforms at the 2013 NVIDIA GPU Technology Conference (GTC 2013) in San Jose, CA this week. At the show, Supermicro will exhibit its extensive line of FatTwin and SuperServer GPU platforms, including the industry's only 1U 3x NVIDIA GRID K2 qualified SuperServer (SYS-1027GR-TRF).
Intersil Extends Digital Power Leadership At APEC 2013
Intersil has today announced that it will feature its most innovative digital power technology at this year's APEC in Long Beach March 17-21, booth 619. Intersil will introduce its latest version of the proven, popular PowerNavigator digital design system at the conference as well as the ZL8101 digital power management solution.
OK International to Demonstrate Metcal’s New MX-5200 at SMT/Hybrid/Packaging
OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth # 9-517 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
KIC Will Highlight Automated Thermal Process Tools at SMT/Hybrid/Packaging
KIC will exhibit in Booth #7-419 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany. The KIC RPI helps manage reflow ovens to consistently maximize the desired results.
SEHO to Showcase Innovative Developments at SMT/Hybrid/Packaging 2013 in Nuremberg
SEHO Systems GmbH will highlight several machines in hall 9, stand 209 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
BTU Europe to Debut New Value-Added Solution to Europe during SMT Hybrid Packaging 2013
BTU Europe will highlight solutions to enhance customer value in Booth #7-555 at the upcoming SMT/Hybrid/Packaging exhibition and conference, scheduled to take place 16-18 April 2013 at the Messezentrum in Nuremberg, Germany.
API Technologies to Showcase the ION SA5600-SAL: Avaya SAL Edition at Enterprise Connect 2013
API Technologies announced today that it will showcase its full line of enterprise security products including the ION SA5600-SAL: Avaya SAL Edition, at the Enterprise Connect Conference and Exposition (Booth #331) to be held March 18-21, 2013 in Orlando.
Agilent Technologies to Showcase Bit Error Ratio Tester at OFC/NFOEC
Agilent Technologies today announced it will demonstrate a 32-Gb/s bit error ratio tester with four-tap de-emphasis at the Optical Fiber Communication Conference and Exposition (OFC) and National Fiber Optic Engineers Conference (NFOEC), March 19-21, at the Anaheim Convention Center (Booth 2719), in Anaheim, Calif.
Grand entrance at embedded world 2013
At embedded world 2013 LieberLieber Software and SparxSystems Software show their solutions for model engineering on a joint booth (hall 4/booth 628). "We are pleased to demonstrate the enhanced capabilities of the latest releases of our modeling tools. As recent scientific studies emphasize the joint use of Enterprise Architect 10 and AMUSE 2.2 allows to benefit most when developing models and software.
Altera Demonstrates Solutions for Enabling OTN Systems Beyond 100G at OFC 2013
Altera Corporation today announced it will demonstrate how its FPGA-based solutions are shaping the future of OTN applications at the Optical Fiber Communication Conference and Exposition (OFC) and the National Fiber Optic Engineers Conference (NFOEC) in Anaheim, Calif. on March 19 – March 21, 2013.
WAGO Free Customer I/O Training Schedule
WAGO Corporation is hosting free, three-day Customer I/O Training seminars: March 19–21, May 7–9, June 25–27, October 1–3 and November 5–7. Held at WAGO's Milwaukee-area headquarters, product managers and experts discuss control theory, hardware, network topologies and WAGO-I/O-SYSTEM functionality.
EdXact Participates at CDNLive Silicon Valley on March 12
EdXact is going to exhibit as a technical partner at the Designer Expo at CDNLive Silicon Valley next week. EdXact will showcase its product families that have been build on a common analysis platform Alps.
Is The Power Electronics Industry A World Apart?
For the second straight year, Yole Développement and Serma have joined forces to organize the Successful Semiconductor Fabless conference, a unique European event dedicated to the fabless business model. This event takes place in Paris, from April 10 to 12. In the 1970's, the semiconductor industry was vertically integrated. Most companies were IDMs with manufacturing, design, intellectual property and marketing activities.
Agilent Technologies to Demonstrate Test and Measurement Solutions at OFC/NFOEC for 100G and Beyond
Agilent Technologies today announced it will demonstrate test and measurement solutions for high-speed communication at the Optical Fiber Communication Conference and Exposition (OFC) and National Fiber Optic Engineers Conference (NFOEC), March 19-21, at the Anaheim Convention Center (Booth 2719) in Anaheim, Calif.
DEK Enjoys APEX Advantage
Last month's APEX event in San Diego, California proved to be a very successful show for printing technology frontrunner, DEK. Not only did the company help booth visitors with their print process challenges at the DEK Solutions Center, but also leveraged its show visibility and expert staff to sign on several new customers.
SMART Group to Host “Guide to Auditing a Surface Mount Production Line” Webinar
SMART Group announces that it will present the Webinar "Guide to Auditing a Surface Mount Production Line" on Tuesday, 9 April, 2013, at 2:30 p.m. (GMT). This Webinar provides a basic guide to auditing a surface mount production line.
Vishay Showcase Industry-Leading Power MOSFETs, Passive Components, Diodes and Power ICs At APEC 2013
Vishay Intertechnology reveal its technology line-up for the Applied Power Electronics Conference and Exposition 2013, taking place March 17-21 in Long Beach, Calif. In booth 113, Hall A, the company will be highlighting its latest industry-leading power MOSFET, passive component, diode, and power IC technologies for a wide range of applications.
Its only 2 weeks to go until IMAPS
Being held on the 21st March 2013 at TWI in Cambridge, there is only 2 weeks to go until the Microtech - IMAPS –UK Annual Conference. Pre-registration for the show is now underway click here to register. Visitors can also find out more about the range of exhibitors and presentations exclusively available to ensure they make the most of their MicroTech experience.
Flex Interconnect Technologies to Exhibit DATA LINK Cables with Samtec Connectors at the AeroDef Manufacturing Expo
Flex Interconnect Technologies announces that it will exhibit in booth #438 at the AeroDef Manufacturing exhibition and conference, scheduled to take place March 19-21, 2013 at the Long Beach Convention Center in California.
Laird Technologies Showcases New High-Performance PowerCycler at Pittcon 2013
Laird Technologies today announced it will demonstrate a new reference design for a compact PCR thermal cycler for field-level DNA amplification at Pittcon 2013. The event will be held at the Pennsylvania Convention Center in Philadelphia, Pennsylvania, March 17-21, 2013. Laird Technologies will exhibit at booth #3553.
API Technologies to Showcase Variety of High Reliability Power Electronics at APEC 2013
API Technologies is pleased to announce that they will showcase their diverse range of products suitable for higher power applications during the 2013 Annual Applied Power Electronics Conference & Expo (APEC). Discussions and live demonstrations will take place at the API Technologies Booth #91, featuring its Spectrum Control line of EMI power filters, film capacitors, switch mode power supply capacitors, magnetics, and the latest in current limiting NTC thermistors.
ITL exhibits some world firsts at Med-tech, April 2013
Integrated Technologies Limited exhibits some industry firsts, on stand 14 at Med-tech Innovation Expo, Ricoh Arena, Coventry, April 10-11, 2013. Established in the UK for over 35 years, ITL has built a reputation as market leader in the contract design and manufacture of medical diagnostic and analytical instruments.
Fairchild Semiconductor Highlights Source-to-System Power Efficiency at APEC 2013
During APEC 2013, March 17-21, 2013, in booth 209 at the Long Beach Convention Center, Long Beach, Calif., Fairchild Semiconductor, puts the focus on engineers, and invites visitors to share their design challenges with power experts to find solutions that support their overall success.
Atlona Debuts Control4 Drivers for HDMI Matrix Switchers at ISE 2013
Atlona today announced the release of new Control4® drivers for its PRO3HD, PRO2HD, and H2H families of HDMI matrix switchers. The new drivers, which made their debut at ISE 2013, help ensure seamless integration and compatibility in residential and commercial AV systems using the Control4 platform.
Supermicro’s Revolutionary FatTwin and Broadest Line of Energy Efficient Server Solutions at CeBIT
Super Micro Computer is showcasing its latest innovations in server and storage technologies at CeBIT 2013 in Hannover, Germany this week. At the center of focus is Supermicro's innovative, versatile 4U FatTwin compute and storage platform which is rapidly evolving to meet customer demands across wide variety of applications.
PLX Technology to Present at 25th Annual ROTH Conference
PLX Technology today announced that David Raun, PLX president and CEO, and Arthur Whipple, PLX chief financial officer, will present at the 25th Annual ROTH Conference on Tuesday, March 19, 2013, at 10:00 AM (PDT).
OCZ Technology to Showcase Next-Generation Enterprise Storage Solutions at CeBIT 2013
OCZ Technology Group today announced that it will preview a variety of enterprise storage solutions at next week's CeBIT 2013 conference in Hannover, Germany. As a renowned global forum, CeBIT represents a great opportunity for attendees to be the first to see and experience the latest innovations in solid-state storage from an industry leader in enterprise SSDs, virtualization, and caching software.
Real Intent Presents Power-related Paper And Tutorial At ISQED 2013 Symposium
Real Intent participating with Intel and University of Texas Austin, presents a paper and a tutorial at this year's International Symposium on Quality Electronic Design. ISQED is the premier interdisciplinary and multidisciplinary Electronic Design conference that bridges the gap among electronic/semiconductor ecosystem members providing electronic design tools, integrated circuit technologies, and semiconductor technology, packaging, assembly & test to achieve design quality.
Cadence Rolls Out 2013 CDNLive User Conferences
Cadence Design Systems kicks off its worldwide series of user conferences, starting with CDNLive Silicon Valley, March 12 and 13 in Santa Clara. CDNLive conferences provide an excellent opportunity for Cadence customers to collaborate and dig deeper into the latest technologies and methodologies with Cadence experts.
PLX Technology to Present at Wedbush 2013 Transformational Technology Conference
PLX Technology today announced that David Raun, PLX president and CEO, and Arthur Whipple, PLX chief financial officer, will present at the Wedbush 2013 Transformational Technology Conference on March 6, 2013 at 9:00 AM (EST).
PLX Expert to Present on Simplifying PCI Express Debugging at PCI-SIG Developers Conference in Israel
PLX Technology today announced the company will deliver a technical presentation on simplifying PCIe debugging at the upcoming PCI-SIG Developers Conference (DevCon), in Tel Aviv, Israel. Derek Percival, PLX senior field applications engineer, will present "Debugging PCIe Links without an Analyzer" at the conference, March 12, 8:30-9:30 a.m. (UTC).
Teknosip Brings BPM Microsystems’ 3800 Programmer to Brazil for FIEE 2013
BPM Microsystems announces that Teknosip will display the 3800 automated production programmer in Booth # I78 at the 27th International Electrical, Energy and Automation Industry Fair (FIEE) scheduled to take place April 1-5, 2013 at the Anhembi Exhibition Hall in Brazil.
Join OK International at Enova Grand Ouest in France for a Demonstration of Metcal’s New MX-5200
OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth E22 at the Enova Grand Ouest exhibition, scheduled to take place March 27-28, 2013 in Rennes, France. The system offers the same increased productivity and process control as the MX-5000 Series, now with dual-simultaneous ports.
Acculogic to Exhibit Award-Winning Test Solutions at BiTS Workshop
Acculogic will exhibit in Booth K6 at the Burn-in & Test Strategies Workshop, scheduled to take place March 3-6, 2013 in Mesa, AZ. The company recently was awarded a 2013 NPI Award in the category of Test & Inspection – ICT for its Ultimate Accuracy Package for the Flying Scorpion.
sercos international presents innovations at the 2013 Hanover Fair
sercos international will show new safety concepts, products, and innovative technologies of exhibiting member companies during the Hanover Fair, April 8 - 12, 2013, in hall 9, booth D80. A conceptual approach that simplifies the integration of machinery in manufacturing will also be presented.
Lian Li To Unveil New Product Line At CeBIT 2013
Lian-Li have today announced that they will be at the world's largest consumer technology trade show – CeBIT 2013 in Hannover, Germany from March 5 to March 9, 2013. Lian Li invites all interested parties to visit their booth in the Exhibition Grounds, Hall 17, Stand M11 and get a first glimpse of the latest generation of brushed aluminium chassis.
Multitest to Exhibit Integrated Test Solutions at BiTS 2013
Multitest will exhibit in Booth #K4 at the Burn-in & Test Strategies Workshop (BiTS), scheduled to take place March 3-6, 2013 in Mesa, AZ. Multitest combines long-term experience in semiconductor test with the expertise of its specialists and state-of-the-art tools to apply industry-leading methods for optimizing test equipment and interfaces.
Computrol to Discuss High Mix, Low- to Mid-Volume Manufacturing Services at the Del Mar Show
Computrol is pleased to announce that it will exhibit in Booth #730-732 at the Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA.