Exhibitions and Conferences

IPC Apex Expo keynote panel forecasts game changers in the industry

What will have the greatest impact on the electronics industry in five years? Will it be technology, manufacturing, government regulations or global competition? The Wednesday Keynote at IPC APEX EXPO 2012, February 28–March 1 at the San Diego Convention Center, will feature five panelists who will provide their unique perspectives on what the game changers will be for the industry.

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Maxim To Demonstrate Highly Integrated Solutions for Embedded Designs at EMBEDDED WORLD Exhibition & Conference 2012

Maxim To Demonstrate Highly Integrated Solutions for Embedded Designs at EMBEDDED WORLD Exhibition & Conference 2012

Maxim Integrated Products, Inc. will offer a rich choice of design ideas for embedded applications at the upcoming Embedded World Exhibition & Conference 2012 in Nuremberg/Germany (February 28 – March 1). With its expertise in providing highly integrated analog and mixed-signal products as well as full-featured reference designs, Maxim offers solutions for a wealth of embedded applications and helps designers speed up time-to-market.

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Imec and Holst Centre present 14 key achievements at International Solid-State Circuits Conference

At next week's International Solid-State Circuits Conference (February 19-23, 2012, San Francisco, USA), imec and Holst Centre present 14 papers on low power design for wireless communication and wireless sensor networks, and organic electronics. Over the week, imec and Holst Centre will issue several news releases showcasing recent important breakthroughs in these different research domains.

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Lattice features new products and technologies for embedded design applications

Lattice Semiconductor Corporation today announced its plans for Embedded World 2012, which will take place Feb 28th – March 1st in Nuremberg, Germany. Lattice will be exhibiting in Hall 5, Stand 142, and will be featuring among other things its recently announced LatticeECP4TM family of devices.

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Lattice features latest mobile FPGA platforms at Mobile World Congress

Lattice Semiconductor Corporation today announced it will exhibit at Mobile World Congress, Feb 27th – March 1st at Fira de Barcelona in Barcelona, Spain. Lattice will be located in Hall 2.1, Stand 2.1A56, and will be featuring the company's mobileFPGA™ platforms including the new iCE40™ and MachXO2™ FPGAs and ispMACH® 4000ZE CPLDs.

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Nihon Superior’s Keith Sweatman to Present at TMS Annual Conference

Nihon Superior Co. Ltd. announces that its Senior Technical Advisor Keith Sweatman will present "The Effect of Composition on the Thickness Morphology and Growth of Interfacial Intermetallic in Pb-Free Solders" at the upcoming TMS Annual Conference, scheduled to take place March 11-15, 2012 at Walt Disney World Swan and Dolphin Resort in Florida.

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embedded world 2012: IAR Systems further enhances toolchain offering

Since 2011 has been an eventful and extremely successful year for IAR Systems, the embedded world 2012 (Nuremberg/Germany, Feb. 28 - March 1) is the perfect venue for the world's leading supplier of software tools for developing embedded systems applications to present their latest achievements.

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Kontron and Napatech to exhibit carrier grade network analysis demo during Mobile World Congress 2012

Kontron and Napatech to exhibit carrier grade network analysis demo during Mobile World Congress 2012

Kontron and Napatech today announced a technology collaboration to demonstrate a live telecom network analysis platform based on the off-the-shelf, NEBS-compliant Kontron communication rackmount server CG2100 and Napatech NEBS-compliant adapter cards. The integrated demo platform is targeted at telecom equipment manufacturers (TEMs) who seek a significantly improved time to market for the design of network monitoring, management, security, and test and optimization applications. Live product demonstrations will be hosted by Napatech at booth 2G28, Hall 2.0 during Mobile World Congress in Barcelona, February 27 - March 1, 2012.

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Wind River to Present the Future of Embedded Cloud – “From Device to the Cloud” – at Embedded World 2012

Wind River will emphasize the future of embedded cloud at Embedded World 2012 in Nuremberg, Germany. Presentations at the conference, as well as product demos and live customer applications at the Wind River booth, will widely reflect this theme.

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Etek Europe to Showcase a Range of Consumables and Production Equipment Solutions at Southern Manufacturing 2012

Etek Europe announces that it will highlight a range Consumables and Production Equipment Solutions at Stand F3 during Southern Manufacturing 2012, scheduled to take place 15-16 February, 2012 at FIVE, Farnborough, Hants.

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Kontron and Cavium to demonstrate live 40G carrier grade deep packet inspection during Mobile World Congress 2012

Kontron and Cavium, Inc. today announced they will have a live demonstration during Mobile World Congress 2012 that illustrates how telecom equipment manufacturers (TEMs) can achieve 1Tbps (1000Gbps) of multi-functional Deep Packet Inspection (DPI) performance on a single integrated COTS hardware/software solution.

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DNA Electronics CEO Professor Chris Toumazou To Address Scripps “Future of Genomic Medicine” Conference

DNA Electronics Ltd today announces that DNA Electronics Chairman and CEO Professor Chris Toumazou FRS will be an invited speaker at the upcoming "The Future of Genomic Medicine IV" conference presented by the Scripps Translational Science Institute (March 1-2 2012, La Jolla, California).

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Kontron to show new ATCA processor blade and carrier grade communication rackmount server based on future Intel Xeon processor E5 family at Mobile World Congress

Kontron today announced it is pre-booking demonstrations under NDA during Mobile World Congress 2012, February 27 - March 1 (Hall 2.0, Booth 2A28), to showcase the new 10G ATCA processor blade AT8060 and 2U carrier grade communication rackmount server CG2200 designed with the future Intel Xeon processor E5 family.

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ACD to Offer Test Expertise for Medical Applications at MD&M Texas 2012

ACD will highlight its test capabilities in Booth #200 at the Medical Design & Manufacturing Texas Exposition, scheduled to take place March 14-15, 2012 at the Fort Worth Convention Center in Texas. As part of the company's comprehensive service offering, ACD provides flying probe, boundary scan and functional test capabilities.

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Visit the AOI and AXI Technology Leader at the 2012 IPC APEX Expo

ViTrox Technologies will demonstrate the V810 and V510 inspection solutions at Booth #1351 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

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Intelligent Solutions for Embedded Safety and Condition Monitoring

At the embedded world 2012-stand of hardware partner MicroSys (Hall 4, Stand 4-328), logi.cals will be present as a co-exhibitor from February 28 - March 1, and present the best solutions. Safety where you need it logi.cals offers an easy-to-handle and reliable complete solution: hardware components from partners (CPU board) with all that is necessary to reach the required intrinsic safety, as well as a PLC programming system and a PLC runtime environment, especially optimized for this board.

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ECT’s Contact Solutions to Showcase ZIP Family at BiTS Burn-In & Test Socket Workshop

Everett Charles Technologies' Contact Solutions will highlight the ZIP family at the upcoming Burn-In & Test Strategies Workshop, scheduled to take place March 4-7, 2012 in Mesa, AZ. Contact Solutions will exhibit its expanded line of semiconductor products including Zip and Bantam contacts. Demonstration of ZIP's extreme scalability and broad application solutions will include:

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Multitest’s Engineering Expert to Present Breaking Research at BiTS 2012

Multitest announces that Ryan Satrom, RF Engineer, will present a paper titled "Improving Power Delivery In The Test Interface" at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 4-7, 2012 Mesa, AZ.

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JUKI to Highlight Range of Groundbreaking Technologies at Southern Manufacturing 2012

JUKI to Highlight Range of Groundbreaking Technologies at Southern Manufacturing 2012

JUKI announces that it will feature a range of SMT Placement Systems at Stand D7 during Southern Manufacturing & Electronics 2012, scheduled to take place 15-16 February, 2012 at FIVE, Farnborough, Hants.

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Charlie Barnhart & Associates LLC to Host Roundtable Discussions at IPC APEX Expo

Charlie Barnhart & Associates LLC will cohost of a day of roundtables and interviews at the upcoming IPC APEX Expo, scheduled to take place February 28-March 1, 2012 at the San Diego Convention Center in California. The roundtables will take place Tuesday, February 28 and will be produced by EMSNow TV.

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GOEPEL electronic to exhibit Industry leading Test Equipment at IPC APEX 2012

GOEPEL electronic will be present again at this year's IPC APEX in San Diego, CA, exhibiting the latest JTAG/Boundary scan solutions and industry leading AOI, AXI, and THT inspection solutions at booth # 2450.

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Multitest’s Product Manager to Discuss Specmanship at BiTS 2012

Multites announces that Jim Brandes, Product Manager, will hold a presentation titled "Specmanship" at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 4-7, 2012 Mesa, AZ.

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Nihon Superior’s Mr. Keith Sweatman to Present at the 2012 IPC APEX EXPO Technical Conference

Nihon Superior Co. Ltd. announces that its Senior Technical Advisor Keith Sweatman will present the paper titled "Effect of Cooling Rate on the Intermetallic Layer in Solder Joints" at the upcoming IPC APEX Expo, scheduled to take place February 28-March 1, 2012 at the San Diego Convention Center in California. This presentation will be held during the session titled "Solder Joint Morphology" on Wednesday, February 29, 2012 from 9-10 a.m.

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Enpirion's Ashraf Lotfi to present at the 7th International Conference on Integrated Power Electronics Systems (CIPS 2012)

Enpirion's Ashraf Lotfi to present at the 7th International Conference on Integrated Power Electronics Systems (CIPS 2012)

Enpirion has been invited to present a paper about On-chip System Integration at the 7th International Conference on Integrated Power Electronics Systems (CIPS 2012), which will take place from March 6th to 8th, 2012, at the Maritim Hotel in Nuremberg, Germany.

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FCI To Feature Power Solutions At APEC 2012 Exhibition

FCI will showcase its Power Solutions products at booth 1136 during the IEEE-Applied Power Electronics Conference and Exposition 2012 (APECR 2012). The conference is being held from February 5-9, 2012 in Orlando, Florida. APEC 2012 is a premier global event dedicated to applied power electronics.

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Multitest to Exhibit New Test Solutions at BiTS 2012

Multitest to Exhibit New Test Solutions at BiTS 2012

Multitest will exhibit its leading test solutions at the upcoming Burn-In & Test Strategies Workshop, scheduled to take place March 4-7, 2012 in Mesa, AZ.

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Micron Technology to Host Analyst Conference

Micron Technology, Inc. will host an analyst conference on Friday, Feb. 10, 2012. Steve Appleton, Micron's Chairman and Chief Executive Officer, Mark Durcan, Micron's President and Chief Operating Officer, and other executive officers will present Micron's strategy and provide an update on current market conditions.

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BPM Microsystems to Debut New Solution for In-System Device Programming at the 2012 IPC APEX Expo

BPM Microsystems will debut its new production solution for in-system device programming in Booth #3702 at the upcoming IPC APEX Expo, scheduled to take place February 28-March 1, 2012 at the San Diego Convention Center in California.

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Symtavision to showcase new versions of SymTA/S and TraceAnalyzer at Embedded World 2012

At Embedded World 2012 (Hall 4, Stand 327), Symtavision will showcase SymTA/S 3.1 and TraceAnalyzer 3.1, major new versions of its system-level tools for model-based design and trace-based verification. SymTA/S 3.1 and TraceAnalyzer 3.1 will include a wealth of new and enhanced features including new scenario management, enhanced support for CAN transport protocols, COM-layers, gateways, and event-triggered task-activation, updated interfaces and the implementation of more than 50 additional customer- requested functions.

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Cortus and SST to Jointly Exhibit Low Power IP Solutions for System on Chip (SoC) Design at Embedded World 2012

Cortus S.A., and Silicon Storage Technology (SST), Inc. will be showing their low power IP products for embedded system on chip (SoC) designs at Embedded World 2012 in Nuremberg, Germany. The exhibit will combine Cortus' silicon efficient, ultra low power 32 bit microcontroller cores with SST's low power, ultra high endurance embedded flash non-volatile memory (NVM) technology.

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ZMD AG to sponsor, exhibit smart power management devices at APEC 2012

ZMD AG (ZMDI) will sponsor and exhibit at the Applied Power Electronics Conference & Exposition, to be held February 5 – 9, 2012 in Orlando, Florida. ZMDI will display two product lines designed to address specific application needs ranging from mobile devices to high-end systems, such as servers and storage units.

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STI Electronics’ Mel Parrish to Chair TAEC Meeting at IPC APEX 2012

STI Electronics, Inc., announces that Mel Parrish, FSO/Director of Training Materials, will chair the Technical Activities Executive Committee (TAEC) meeting at the upcoming IPC APEX Expo, scheduled to take place Feb 28-March 1, 2012 at the San Diego Convention Center in San Diego, CA. The committee will convene during the Management Session of the Standards Development Meetings on Monday, February 27, 2012 from 5-6:30 p.m.

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Cognex to demonstrate vision systems and sensors at NPE 2012

Cognex Corporation announces that it will demonstrate its latest vision and ID systems in Booth #4248 at the upcoming International Plastics Showcase, scheduled to take place April 1-5, 2012 at the Orange County Convention Center in Orlando, Florida.

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Nordson DAGE to Highlight the X-Plane System Option at SMTA Texas - Houston and Dallas Expos

Nordson DAGE will exhibit its new X-Plane X-ray system option at the upcoming SMTA Texas Expo and Tech Forums, scheduled to take place on February 7, 2012, at the Richardson Civic Center, in Richardson, TX and February 9, 2012 at the Stafford Centre, in Stafford, TX.

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Point Grey Hosts First AIA Vision Standards Meeting

Point Grey will be hosting the AIA Winter 2012 Vision Standards Meeting in Vancouver, Canada from February 13 – 17th. This is the first meeting of its kind where leading industry players meet to progress technical milestones on interface standards. One of the key items on the agenda is the continued effort to form the USB3 Vision standard for a 2012 release.

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KIC to Hold Defect Solution Clinic at the 2012 IPC APEX Expo

KIC will hold a Defect Solution Clinic Booth #2428 at the upcoming IPC APEX Expo, scheduled to take place February 28-March 1, 2012 at the San Diego Convention Center in California. Dr. S. Manian Ramkumar, Ph.D. will be in the KIC booth on Tuesday, February 28th and Wednesday, February 29th from 2-4 p.m.

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Seika Machinery to Introduce New Systems at SMTA Houston Expo & Tech Forum 2012

Seika Machinery, Inc. will highlight many new and innovative products at the upcoming SMTA Houston Expo and Tech Forum, scheduled to take place February 9, 2012, from 10 a.m.-3:30 p.m. at the Stafford Centre, in Stafford, TX.

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STI Electronics to Attend the SMTA Dallas Expo & Tech Forum 2012

STI Electronics to Attend the SMTA Dallas Expo & Tech Forum 2012

STI Electronics, Inc. announces that it will be in attendance at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place February 7, 2012 from 10 a.m.-3:30 p.m. at the Richardson Civic Center, in Richardson (Dallas), TX. STI Electronics highlight all aspects of the company, including Engineering Services, Training Resources and Distribution.

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Murata showcases innovation in electronics at CeBIT 2012

Murata showcases innovation in electronics at CeBIT 2012

Murata today announced their participation at CeBIT 2012, Hannover Messe, Germany, 6 – 10th March 2012 with stand demonstrations showcasing Murata innovations in everyday consumer electronics, healthcare technologies and energy efficiency.

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Kyzen Shows Continued Support of SMTA by Sponsoring the Pan Pacific Microelectronics Symposium

Kyzen will sponsor the SMTA Pan Pacific Microelectronics Symposium, scheduled to take place February 14-16, 2012 at the Sheraton Poipu Resort in Kauai, Hawaii.

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