Exhibitions and Conferences
OK International's Scorpion Earns Industry Award
OK International today announced that it has been awarded a 2012 EM Asia Innovation Award in the category of Repair/Rework Equipment for its Scorpion Rework System. The award was presented to the company during an April 26, 2012 ceremony in Shanghai during NEPCON China.
MIRTEC to Exhibit Innovative AOI and SPI Systems during SMT/Hybrid/Packaging 2012
MIRTEC announces that it will showcase its award-winning MV-9 3D Series AOI System alongside a range of other groundbreaking AOI and SPI technologies at its distributor pb tec's Booth 7:506B during SMT Nuremberg, scheduled to take place May 8-10, 2012 at the Messezentrum in Nuremberg, Germany.
Sofradir shows the future in infrared detection for military and space applications at SPIE DSS 2012
Sofradir announces today that it will demonstrate a prototype of the first 10-micron pixel pitch infrared (IR) detector for tactical applications at SPIE DSS in Baltimore, April 23 – 27.
Registration Opens for Annual Atmel Technology Live Developer Conference
Atmel Corporation today announced it is accepting registrations for Atmel Technology Live (ATL), the company's first developers' conference that will be held September 11-13, 2012, at the San Jose Convention Center.
BTU International to Showcase Innovative Pyramax 100A during SMT Nuremberg 2012
BTU International will highlight its PYRAMAX 100A at the upcoming SMT Nuremberg 2012 exhibition. The BTU reflow oven will be on display in Hall 6, Booth 120 at the SMT/Hybrid/Packaging 2012 exhibition and conference, scheduled for May 8-10, 2012 at the Messezentrum Nuremberg, Germany.
DEK Maintains its Promise of “Expect More” Technology Showcase to be Unveiled at NEPCON CHINA 2012
DEK will launch ProDEK in Asia as part of its showcase of advanced print platforms, productivity tools and process improvement products at NEPCON China 2012. NEPCON China 2012 will be held at the World Expo Convention & Exhibition Centre in Shanghai from 25 April to 27 April, 2012.
Nordson DAGE to Showcase µCT Inspection Option at MD&M East 2012
Nordson DAGE announces it will exhibit in Booth #1201 at the upcoming Medical Design & Manufacturing East Exposition, scheduled to take place May 22-24, 2012 at the Pennsylvania Convention center in Philadelphia, PA.
Nordson MARCH Plasma System Technology Displayed at SEMICON Singapore Booth #502
Nordson MARCH will display its FlexTRAK highly configurable, high-throughput plasma treatment and AP-Series vacuum plasma treatment systems at SEMICON Singapore 2012, booth #502. Plasma performs numerous surface modification processes including surface activation, contamination removal, cross linking, etch by chemical reaction, and physical bombardment for semiconductor, hard disk drive, LED, printed circuit board, medical, and photovoltaic/solar manufacturing.
Renesas Electronics Europe will exhibit at PCIM Europe 2012 in Hall 12, booth 12-364
Renesas Electronics Europe will exhibit at PCIM Europe 2012 in Hall 12, booth 12-364, and showcase the following product highlights.
OK International Announces Location for Mid-Atlantic Repair/Rework Seminar
OK International today announced the location for its next Advanced Package Rework and Repair seminar. The technical seminar is scheduled to take place Tuesday, June 5, 2012 at the Holiday Inn in Columbia (Jessup), MD.
Virtual Industries to Feature Vacuum Handling Solutions for Medical Applications at MD&M East 2012
Virtual Industries Inc. announces that it will display several advanced systems for medical applications at the upcoming Medical Design & Manufacturing East Exposition, scheduled to take place May 22-24, 2012 at the Pennsylvania Convention center in Philadelphia, PA. Company representatives will highlight products from its sister company – Prime Axis Manufacturing. Prime Axis Manufacturing uses world-class CNC machining equipment to produce high-quality machined parts.
MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Toronto Expo and Tech Forum
MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Toronto Expo & Tech Forum, scheduled to take place May 16, 2012 from 10 a.m.-3 p.m. at the Crowne Plaza Toronto Airport Hotel in Ontario, Canada.
Specialist precision dispensing technology webinar from Intertronics
A specialist precision dispensing technology webinar will be hosted on 2nd May at 11am by Intertronics Managing Director Peter Swanson with technical manager Paul Whitehead.
GOEPEL electronic explores new Dimensions
Multidimensional test and inspection technologies are the focal aspect of GOEPEL electronics' show appearance at this year's SMT/Hybrid/Packaging in Nuremberg/Germany. The trade show will be used to introduce additional world premiere solutions.
Gore Introducing New Solutions for Improving Equipment Reliability & Performance at CTIA 2012
To improve reliability and performance in telecommunication equipment, W. L. Gore & Associates has advanced its portfolio of products and services that enable the industry to remain connected and protected. In addition to introducing its new business unit that focuses on mobile devices, Gore is displaying new venting products, cooling filters, and testing methods to enable manufacturers and suppliers of wireless headsets, small cell devices, base stations and other telecommunication infrastructure to improve product performance for their customers.
NXP Highlights good2gether and Think&Go NFC at WIMA NFC Monaco
Today at WIMA NFC Monaco, NXP Semiconductors N.V. will showcase good2gether and Think&Go NFC, two applications that are making use of the company's unique end-to-end technology position via state-of-the-art NFC tag ICs and NFC mobile solutions. These service providers are bringing their solutions to a new level, adding more convenience to their services and thus delivering great end-consumer experiences.
ESSEMTEC to Attend 16th Annual SMTA Atlanta Expo & Tech Forum
Essemtec announces that it will exhibit at the upcoming SMTA 16th Annual Atlanta Expo & Tech Forum, scheduled to take place on Thursday, April 19, 2012 from 9:30 a.m.-4 p.m. at the Gwinnett Civic Center in Duluth, GA. Essemtec staff will be on site to discuss some of its industry favorites including Paraquda 4, Tucano, EXPERT-LINE and more.
Mindspeed Features Complete Family of Broadcast Video Solutions for 3G-SDI, 4K TV and Beyond at 2012 NAB Show
Mindspeed Technologies, Inc. announced it will be showcasing its extensive line of broadcast video products at the 2012 NAB Show, including crosspoint switches, serial digital interface (SDI) equalizers, SDI reclockers, SDI cable drivers and optical transport solutions, that are helping drive the industry to 3G-SDI and other emerging high-definition (HD) resolutions.
Analog Devices presents latest motor and power control signal processing technologies at PCIM 2012
Analog Devices, Inc. will be exhibiting at PCIM Europe 2012 to be held May 08-10, 2012 in Nuremberg, Germany. In Hall 11, Booth 11-301, Analog Devices will demonstrate its latest high performance signal processing technologies for motor and power control, which enable motor and inverter design engineers to design products with greater precision, energy efficiency and enhanced communications capabilities.
MIRTEC Europe’s Groundbreaking 3D AOI Technology to Make UK Debut at NEW 2012
MIRTEC announces that its UK distributor, TestWorks, will exhibit an impressive range of MIRTEC's innovative equipment in Booth #61 during National Electronics Week 2012 scheduled to take place 18 -19, April, 2012 at the NEC Hall in Birmingham, UK.
Celebrate JUKI’s 25,000th Shipment at the 2012 SMT in Nuremberg
Juki Automation Systems AG will celebrate both its 25,000th machine shipped worldwide and its 25th year anniversary in the SMT placement industry on booth 333/H7 at the upcoming SMT Hybrid Packaging 2012 scheduled to take place from 8 to 10 May, 2012 in Nuremberg, Germany.
Essemtec Presents Innovations at SMT Nuremberg 2012
In booth 7.203 at the upcoming SMT/Hybrid/Packaging 2012 exhibition in Nuremberg, Essemtec will present several innovations, including Scorpion, the highly flexible dispensing system, as well as two new printers for low-/mid-volume sizes.
Vicor to showcase high performance power components at PCIM Europe 2012
Vicor today announced its participation in the Power Conversion Intelligent Motion (PCIM) 2012 conference, the international conference on power electronics and its applications, hosted in Nuremberg, Germany, 8th -10th May, 2012. Vicor will highlight its full range of modular power components and innovative solutions for performance-critical applications at the event. Conference attendees can visit Vicor at stand 12-328 in the Nuremberg Exhibition Centre.
Fairchild Semiconductor to Showcase Industrial Power, Automotive, LED Lighting and DC-DC Conversion Solutions at PCIM Europe 2012
Fairchild Semiconductor will demonstrate innovative power solutions for real success at PCIM Europe 2012, 08-10 May, in Hall 12, booth 601, in Nuremberg, Germany. At the show, Fairchild will feature silicon and solutions that lead to customer success, including solutions for industrial power, automotive, LED lighting and DC-DC conversion.
Meet TDK-Lambda’s next-generation power supplies at NEW 2012
TDK Corporation announces that it will showcase an extensive array of new and innovative TDK-Lambda products at this year's National Electronics Week. A full line-up of standard and configurable power AC-DC power supplies, DC-DC converters and programmable power supplies will be on display at the TDK-Lambda stand (Hall 2, Stand 134).
Adaptsys to Exhibit BPM Microsystems’ 8th Generation Automated Programming Solution at NEW: UK 2012
BPM Microsystems is pleased to announce that its distributor Adaptsys will showcase its model 3800 automated programming system in Booth 115 at the upcoming National Electronics Week: UK, scheduled to take place 18 -19, April, 2012 at the NEC Hall in Birmingham, UK. The model 3800 is one of the newest additions to BPM Microsystems' line of automated device programmers and combines the unrivaled speed of Vector Engine Co-Processor technology, true universal device support, and on-the-fly vision centering all in a single platform
Viscom to Exhibit Intelligent AOI Software vVision at NEPCON Shanghai
Viscom proudly announces that it will exhibit vVision, its recently introduced AOI software in Booth 1H36 at the upcoming NEPCON Show, scheduled to take place April 25-27, 2012, at the World Expo Convention & Exhibition Center in Shanghai. The new user interface from Viscom revolutionizes inspection system handling. The modern design is self-explanatory and quickly guides even the inexperienced operator to a highly capable inspection program.
Christopher Associates to Exhibit the MAGNUS HD TREND at the Del Mar Show
Christopher Associates Inc. today announced that it will highlight the Tagarno MAGNUS HD TREND in Booth #346 at the upcoming Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 2-3, 2012 at the Del Mar Fairgrounds in San Diego, CA.
Fujitsu to Host Fujitsu Forum 2012
Fujitsu today announced that Fujitsu Forum 2012, the company's largest annual event, will be held May 17-18 at the Tokyo International Forum in Japan. The theme of this year's Fujitsu Forum will be Reshaping ICT - Reshaping Business.
ViTrox Technologies to Showcase Its Leading AOI & AXI Solutions at NEPCON China 2012
ViTrox Technologies announces that it will showcase its leading AOI and AXI solutions in booth 1G88 at the upcoming NEPCON China 2012. The event is scheduled to take place April 25-27, 2012 at the Shanghai World Expo Exhibition & Convention Center.
BTU’s Fred Dimock to Participate in Reflow Optimization Discussion during NEPCON Shanghai
BTU International, Inc announces that Fred Dimock will present at the upcoming Optimizing Reflow of Lead-Free Boards and BGAs round table discussion hosted by EMSNow on Thursday, April 26 at 3:30 p.m. The discussion will take place during the NEPCON Shanghai exhibition at the Shanghai World Expo Exhibition & Convention Center.
National Instruments joins the growing ElectroTestExpo community
The ElectroTestExpo consortium is pleased to announce that National Instruments has joined the growing ElectroTestExpo community and will be exhibiting at the Cambridge event – at the Trinity Centre on the Cambridge Science Park on Wednesday 23rd May. The company will also be giving a presentation as part of ElectroTestExpo's seminar programme. Entitled 'Customising Measurements and Analysis with PXI and FPGA Technology', the presentation will detail techniques for performing in-line signal processing within an automated testing environment.
SEHO to Showcase Innovative Developments at SMT/Hybrid/Packaging 2012
SEHO Systems GmbH will highlight several machines in hall 9, stand 209 during SMT/Hybrid/Packaging, scheduled to take place May 8-10, 2012 at the Messezentrum Nuremberg, Germany.
BTU to Feature Next-Generation PYRAMAX Capabilities at NEPCON China
BTU International, Inc. will highlight its next-generation High Efficiency (HE) Flux Management and dual-lane, dual-speed capabilities of the PYRAMAX solder reflow system as well as its latest WINCON 5.0 control system software in booth #1G65 at the upcoming NEPCON China 2012, on April 25-27, 2012 at the Shanghai World Expo Exhibition & Convention Center.
Mike Konrad to Present “Cleaning in a World of No-Clean” at the SMTA Intermountain Vendor Day in Idaho
Aqueous Technologies Corp. announces that CEO Michael Konrad will present at the upcoming SMTA Intermountain Vendor Day and Tech Conference. Mr. Konrad will present "Cleaning in a World of No-Clean" on Wednesday, April 4, 2012 at Boise State University in the Simplot Ballroom.
Nihon Superior Shanghai to Exhibit at NEPCON China 2012
Nihon Superior Shanghai Co. Ltd. will showcase a new and expanded range of products based on its SN100C silver-free, lead-free solder at the upcoming NEPCON China 2012 exhibition in Shanghai. Included in this expanded product range will be the first of Nihon Superior's new SN100C Advantage SeriesTM alloys, SN99CN in the form of spheres and the solder paste SN99CN P502 D4.
ROHM Semiconductor To Present A Range of Novelties at PCIM 2012
ROHM Semiconductor will present its latest products and technologies at PCIM, the leading trade fair for power electronics in Nuremberg, from May 8 to 10 (Hall 12, Booth 601). Based on the most recent developments in the R/D centers of ROHM and LAPIS and the expertise in the design and manufacturing of state-of-the-art power management, the products address the increasing demand for more energy efficiency, miniaturization, reliability, reduced component count and costs while providing optimum performance at the same time.
OK International to Hold Advanced Package Rework and Repair Seminar in Phoenix
OK International today announced the location for its fourth Advanced Package Rework and Repair seminar. The technical seminar is scheduled to take place Tuesday, May 8, 2012, at the Hilton Phoenix Airport in Phoenix, AZ from 9 a.m.-12 p.m.
Aegis brings inForce to Europe at the NEW 2012 show, NEC Birmingham
Aegis Software brings the inForce Digital Process Terminal and Attendant to Europe with live demonstrations on their stand 66f at the NEW 2012 exhibition, NEC Birmingham on 17th and 18th April. inForce ensures a controlled process and provides a powerful and yet simplified interface to factory information systems. Stand visitors will see first-hand how inForce monitors and controls the process, informs operators, saves energy and workspace, and reduces the infrastructure cost and complexity of best-in-class factories.
Laird Technologies to Attend ESC Silicon Valley 2012 Trade Show - Telematics and Wireless M2M Solutions Product Portfolio and Capabilities on Display
Laird Technologies, Inc., today announced it will be attending the ESC Silicon Valley 2012 trade show. The trade show will be held at the McEnery Convention Center in San Jose, California, March 26-29, 2012. Laird Technologies can be found at booth #2116.
